Dalilin PCB layering:

(1) Abubuwan masu siyarwa ko matsalolin aiwatarwa

(2) Zaɓin zaɓi mara kyau da rarraba saman jan ƙarfe

(3) Lokacin adanawa ya yi yawa, ya wuce lokacin ajiya, kuma allon PCB yana shafar danshi

(4) Kunshin da bai dace ba ko ajiya, danshi

Matakan magancewa:

Zaɓi marufi mai kyau, yi amfani da zazzabi mai ɗorewa da kayan zafi don ajiya. Misali, a cikin gwajin dogaro na PCB, mai siyar da ke kula da gwajin damuwar zafi yana ɗaukar fiye da sau 5 na rashin daidaituwa azaman daidaitacce kuma zai tabbatar da shi a cikin samfurin samfurin da kowane sake zagayowar yawan taro, yayin da babban mai ƙira zai iya kawai buƙatar sau 2 kuma tabbatar da shi sau ɗaya a cikin ‘yan watanni. Gwajin IR na hawa kwaikwaiyo na iya hana fitowar samfuran lahani, wanda ya zama dole don ingantattun masana’antu na PCB. Bugu da kari, Tg na hukumar PCB yakamata ya kasance sama da 145 ℃, don ya zama mai aminci.

PCB allon plating Layer

A karkashin hasken ultraviolet, mai daukar hoto wanda ke shafar makamashin haske ya lalace cikin radical kyauta don fara monomer zuwa daukar hoto, da samar da kwayoyin jikin da ba za a iya narkewa a cikin ruwan alkali mai narkewa ba. Lokacin da fallasawar bai isa ba, saboda ƙarancin polymerization, a cikin tsarin haɓakawa, kumburin fim ya zama mai taushi, wanda ke haifar da layin da ba a sani ba har ma da faifan fim ɗin ya faɗi, wanda ke haifar da haɗewar fim da jan ƙarfe; Idan fallasawar ta wuce kima, zai haifar da wahala wajen haɓakawa, kuma zai kuma haifar da warping da tsinke a cikin tsarin sakawa, yana haifar da ruɓewa. Don haka yana da mahimmanci a sarrafa ƙarfin watsawa; Farkon jan ƙarfe bayan sarrafawa, lokacin tsaftacewa ba mai sauƙi bane don yin tsayi da yawa, saboda ruwan tsabtace shima yana ƙunshe da wasu abubuwan acidic duk da cewa abun cikin sa yana da rauni, amma tasirin saman jan ƙarfe ba za a iya ɗauka da sauƙi ba, yakamata ya kasance cikin tsananin daidai da ƙayyadaddun tsari na lokacin don ayyukan tsaftacewa.

Babban dalilin da yasa zinaren gwal ya fado daga saman sashin nickel shine maganin saman nickel. Ayyukan saman ƙarfe na nickel ba shi da kyau kuma yana da wahala a sami sakamako mai gamsarwa. Filin murfin nickel yana da sauƙin samar da fim ɗin wucewa a cikin iska, idan ba a bi da shi yadda yakamata ba, za a rarrabe zaren gwal ɗin daga farfajiyar nickel. Kamar kunna ba daidai ba a cikin zoben zinare na lantarki, za a keɓe zaren gwal ɗin daga saman peel ɗin. Dalili na biyu shi ne cewa bayan kunnawa, lokacin tsaftacewa ya yi tsayi sosai, wanda ke haifar da samuwar fim ɗin wucewa a saman nickel, sannan kuma zuwa zinare na zinariya, babu makawa zai haifar da lahani na zubar da abin rufe fuska.

Dalilin layering na PCB board

Dalilin:

Kwamfutocin kewaye na PCB bayan shan zafi, suna samar da daidaiton faɗaɗa daban -daban tsakanin abubuwa daban -daban kuma suna haifar da damuwa na ciki, idan resin tare da resin, resin da relay relay stick relay bai isa ba don tsayayya da damuwa na ciki zai haifar da delamination, wannan shine tushen dalilin Kwamfutocin da’irar PCB sun shimfida, kuma suna sake kunnawa, zafin zafin taro da tsawaita lokaci, suna iya haifar da allon allon PCB.

Matakan magancewa:

1, zaɓin kayan tushe don zaɓar gwargwadon iko don tabbatar da amincin kayan da suka cancanta, ingancin kayan PP na allon multilayer shima babban mahimmin abu ne.

2, sarrafa tsarin sarrafa lamination a wuri, musamman don Layer na ciki mai kauri mai kauri mai jan ƙarfe, yakamata a kula. A karkashin girgizawar zafi, Layer allon PCB ya bayyana a cikin sashin ciki na allon multilayer, wanda ya haifar da duka tarin tarkace.

3, ingancin tagulla mai nauyi. Mafi kyawun yawa na murfin jan ƙarfe a cikin bangon ciki na rami, kaurin jan ƙarfe, ya fi ƙarfin bugun zafin PCB kewaye. Dukansu zuwa kwamitin kewaye na PCB na babban abin dogaro, farashin samarwa da ƙarancin buƙatun, sarrafa tsarin sarrafa lantarki kowane mataki yana buƙatar kulawa mai kyau.

Lokacin da hukumar PCB ke kan yanayin zafi mai zafi, murfin jan ƙarfe a cikin ramin ya karye saboda yawan faɗaɗa hukumar. Wannan ramin rami ne. Wannan kuma shine mahimmin stratification, wanda ke bayyana lokacin da digirin ya ƙaru.

Masu kera kwamiti na kewaye na PCB tare da yanayi suna da dakin gwaje -gwaje na kansu, wanda zai iya lura da aikin kwamiti na kewaye na PCB na bugun zafi a cikin ainihin lokaci.