Isizathu se PCB ukubeka:

(1) Izimpahla zomhlinzeki noma izinkinga zenqubo

(2) Ukukhethwa kwezinto ezimbi kanye nokusatshalaliswa kwendawo yethusi

(3) Isikhathi sokugcina side kakhulu, sidlula isikhathi sokugcina, futhi ibhodi le-PCB lithinteka ngomswakama

(4) Ukupakisha okungalungile noma ukugcinwa, umswakama

Izinyathelo Zokuphikisa:

Khetha ukupakisha okuhle, sebenzisa okokushisa okungapheli nomswakama okokugcina. Isibonelo, esivivinyweni sokwethenjelwa kwe-PCB, umphakeli ophethe isivivinyo sokushisa esishisayo uthatha ngaphezu kwezikhathi ezi-5 zokungahlukanisi njenge-standard futhi uzoqinisekisa esigabeni sesampula nakuwo wonke umjikelezo wokukhiqizwa kobuningi, ngenkathi umenzi ojwayelekile angasebenza kuphela kudinga izikhathi ezi-2 bese uyiqinisekisa kanye ezinyangeni ezimbalwa. Ukuhlolwa kwe-IR kokufakwa okulingisiwe nakho kungavimbela ukuphuma kwemikhiqizo enesici, okudingeka kumafemu we-PCB amahle kakhulu. Ngaphezu kwalokho, i-Tg yebhodi le-PCB kufanele ibe ngaphezu kuka-145 ℃, ukuze iphephe ngokuqhathaniswa.

PCB ibhodi Plating ungqimba

Ngaphansi kokukhanya kwe-ultraviolet, i-photoinitiator emunca amandla wokukhanya ibola ibe yi-radical yamahhala ukuqala i-monomer ekuphenduleni i-photopolymerization, yakha i-molecule yomzimba engancibiliki kwisisombululo se-alkali. Lapho ukuvezwa kunganele, ngenxa yokungaphelele kwe-polymerization, enqubeni ekhulayo, ukuvuvukala kwefilimu kuba buthambile, okuholela emigqeni engacacile futhi ungqimba lwefilimu luyawa, okuholela ekuhlanganisweni okungalungile kwefilimu nethusi; Uma ukuvezwa kukweqile, kuzodala ubunzima ekukhuleni, futhi kuzokhiqiza nokugoqa kanye nokuhlubula inqubo yokufaka, ukwakha ukufakwa kokungena. Ngakho-ke kubalulekile ukulawula amandla okuchayeka; Ubuso bethusi ngemuva kokucutshungulwa, isikhathi sokuhlanza akulula ukuthi sibe side kakhulu, ngoba amanzi okuhlanza aqukethe nezinto ezithile ezine-asidi yize okuqukethwe kwawo kubuthakathaka, kepha umthelela ebusweni bethusi awunakuthathwa kalula, kufanele ube ngokuqinile ngokuhambisana nenqubo ebekiwe yesikhathi sokuhlanza imisebenzi.

Isizathu esiyinhloko esenza ungqimba lwegolide luwe ebusweni bengqimba ye-nickel ukwelashwa okuphezulu kwe-nickel. Umsebenzi ongaphezulu wensimbi ye-nickel awumuhle futhi kunzima ukuthola imiphumela egculisayo. Indawo yokumboza nge-nickel ithambekele ekukhiqizeni ifilimu yokungena emoyeni, uma ingalashwa kahle, ungqimba lwegolide luzohlukaniswa nobuso bengqimba le-nickel. Njengokwenza kusebenze okungalungile ku-golide kagesi, ungqimba lwegolide luzokhishwa ebusweni bendawo yocingo le-nickel. Isizathu sesibili ukuthi ngemuva kokuvula ukusebenza, isikhathi sokuhlanza sinde kakhulu, okuholela ekwakhiweni kongqimba lwefilimu lokuphamba ebusweni be-nickel, bese uya kokufakwa kwegolide, nakanjani kuzokhiqiza ukukhubazeka kokuchithwa kokumboza.

Imbangela yokubeka kwebhodi le-PCB

Isizathu:

Amabhodi wesifunda we-PCB ngemuva kokumunca ukushisa, akhiqize i-coefficient ehlukile yokwanda phakathi kwezinto ezahlukahlukene bese enza ukucindezeleka kwangaphakathi, uma i-resin ene-resin, i-resin ne-copper foil stick relay ayanele ukumelana nengcindezi yangaphakathi ezokhiqiza i-delamination, lokhu kuyimbangela PCB wesifunda amabhodi egqinsiwe, futhi resonant, izinga lokushisa kwenhlangano kanye ukunwetshwa kwesikhathi, maningi amathuba okudala PCB wesifunda amabhodi egqinsiwe.

Izinyathelo Zokuphikisa:

1, ukukhethwa kwento eyisisekelo ongakhetha kuyo ngangokunokwenzeka ukuqinisekisa ukuthembeka kwezinto ezifanelekile, ikhwalithi yezinto ze-PP zebhodi le-multilayer nayo iyipharamitha esemqoka kakhulu.

I-2, inqubo yokulawula i-lamination isendaweni, ikakhulukazi ungqimba lwangaphakathi lwesigaxa sethusi esiningi se-multilayer, kufanele sinake. Ngaphansi ukushaqeka ezishisayo, PCB ibhodi ungqimba uvele ungqimba kwangaphakathi ibhodi multilayer, okwaholela lonke batch imvuthuluka.

3, ikhwalithi esindayo yethusi. Ukuqina kobukhulu besendlalelo sethusi odongeni lwangaphakathi lomgodi, ubukhulu besendlalelo sethusi, ukuqina kokushisa kwebhodi lesifunda le-PCB kunamandla. Kokubili ebhodini lesifunda le-PCB elinokwethenjelwa okuphezulu, izindleko zokukhiqiza nezidingo eziphansi, ukulawulwa kwenqubo ye-electroplating isinyathelo ngasinye kudinga ukulawulwa okuhle.

Lapho ibhodi le-PCB lisenqubweni yokushisa okuphezulu, ucwecwe lwethusi emgodini luphukile ngenxa yokwandiswa ngokweqile kwebhodi. Lowo umgodi wembobo. Lokhu futhi kuyisandulela se-stratification, esibonakala lapho izinga lenyuka.

Abakhiqizi bebhodi lesifunda be-PCB abanezimo bane-laboratory yabo yokuhlola, engabona ukusebenza kwebhodi lesifunda le-PCB lokushaqeka kokushisa ngesikhathi sangempela.