Ny antony PCB layering:

(1) Olana ara-pitaovana na olana amin’ny mpamatsy

(2) Fisafidianana fitaovana ratsy sy fizarana varahina

(3) Ny fotoana fitehirizana dia lava loatra, mihoatra ny fe-potoana fitehirizana, ary ny tabilao PCB dia voan’ny hamandoana

(4) Famonosana na fitahirizana tsy mety, hamandoana

Countermeasures:

Misafidiana fonosana tsara, ampiasao fitaovana hafanana sy hamandoana tsy tapaka ho an’ny fitehirizana. Ohatra, amin’ny fitsapana azo itokisana PCB, ny mpamatsy miandraikitra ny fitsapana ny fihenjanana amin’ny hafanana dia mihoatra ny in-5 stratification ho fenitra ary hamafisina amin’ny dingana santionany sy ny tsingerin’ny famokarana betsaka, raha toa ka ny mpamokatra ankapobeny ihany mitaky in-2 ary manamafy izany indray mandeha isam-bolana. Ny fitsapana IR amin’ny fametrahana simulated dia afaka manakana ny fivoahan’ny vokatra tsy mandeha ihany koa, izay ilaina amin’ny orinasa PCB tena tsara. Ho fanampin’izany, NY Tg an’ny birao PCB dia tokony ho ambonin’ny 145 ℃, mba ho azo antoka.

Sosona plating birao PCB

Eo ambanin’ny hazavana ultraviolet, ny photoinitiator izay mandray ny angovo maivana dia alaina ho radika malalaka hanombohana ny monomer amin’ny fanehoan-kevitry ny photopolymerization, mamorona ny molekiola ao amin’ny vatana izay tsy afaka amin’ny vahaolana alkali maloto. Rehefa tsy ampy ny fampirantiana, noho ny polymerisation tsy feno, amin’ny fizotry ny fivoarana dia manjary malefaka ny fivontosana sarimihetsika ka miteraka tsipika tsy mazava ary na ny sosona sarimihetsika aza milatsaka, ka miteraka tsy fifangaroana sarimihetsika sy varahina; Raha be loatra ny fipoahana dia hiteraka fahasarotana amin’ny fivoarana izany, ary hiteraka ady sy fikikisana koa amin’ny fizotran’ny plating, ka hametahana takelaka fidirana. Noho izany dia zava-dehibe ny fifehezana ny angovo fampirantiana; The surface of copper after processing, cleaning time is not easy to be too long, because the cleaning water also contains certain acidic substances although its content is weak, but the impact on the surface of copper can not be taken lightly, should be in strict accordance with the process specifications of the time for cleaning operations.

Ny antony lehibe mahatonga ny sosona volamena hianjera avy eo ambonin’ny sosona nikela dia ny fitsaboana ambonin’ny nikela. Ny hetsika ambonin’ny metaly nikela dia ratsy ary sarotra ny mahazo valiny mahafa-po. Ny velaran-tsolika nikela dia mora mamokatra sarimihetsika passivation amin’ny rivotra, raha tsy voatsabo tsara, dia hosarahana amin’ny sosona nikela ny sosona volamena. Toy ny fampahavitrihana tsy mety amin’ny fametahana volamena elektrika, ny sosona volamena dia hesorina tsy ho etona ambonin’ny fonon’ny nikela. Ny antony faharoa dia aorian’ny fampahavitrihana, lava loatra ny fotoana fanadiovana, miteraka ny famolavolana ny sarimihetsika passivation amin’ny velarana nikela, ary avy eo mandeha amin’ny plating volamena, dia tsy maintsy ihodivirana ny famonoana firakotra.

Ny antony fametrahana ny birao PCB

Ny antony:

PCB circuit boards after absorbing heat, produce the different expansion coefficient between different materials and form internal stress, if resin with resin, resin and copper foil stick relay is not enough to resist the internal stress will produce delamination, this is the root cause of the PCB circuit boards layered, and resonant, the temperature of the assembly and the extension of time, are more likely to cause PCB circuit boards layered.

Countermeasures:

1, ny fisafidianana ireo fitaovana ifotony hisafidianana araka izay azo atao mba hahazoana antoka ny fitokisana ireo fitaovana mahafeno fepetra, ny kalitaon’ny fitaovana PP an’ny tabilao multilayer koa dia masontsivana lehibe indrindra.

2, fanaraha-maso ny dingan’ny lamination amin’ny toerany, indrindra ho an’ny sosona anatiny misy ny multilayer varahina matevina, dia tokony hihaino tsara. Teo ambanin’ny fikorontanana mafana dia nipoitra ny sosona birao PCB tao anaty sosona anatiny misy ny takelaka multilayer, ka niafara tamin’ny fakofako manontolo.

3, kalitaon’ny varahina mavesatra. Ny tsara kokoa ny hakitroky ny varahina sosona ao anaty rindrin’ny lavaka, ny matevina ny varahina sosona, ny matanjaka ny fikorontanana hafanana PCB circuit board. Samy ho an’ny birao boribory PCB azo itokisana, vidin’ny famokarana ary takiana ambany, fanaraha-maso ny dingana electroplating dingana tsirairay dia mitaky fanaraha-maso tsara.

Rehefa eo am-panaovana mari-pana ambony ny tabilao PCB dia tapaka ny foil varahina ao anaty lavaka noho ny fanitarana be loatra ny tabilao. Lavaka lavaka izany. Ity koa dia mialoha ny stratification, izay miseho rehefa mitombo ny diplaoma.

Ny mpanamboatra birao PCB misy fepetra dia manana laboratoara fitiliana azy ireo, izay afaka mandinika ny fahombiazan’ny tabilao PCB momba ny hafanana tampoka amin’ny fotoana tena izy.