Indlela yokuthintela ibhodi yesekethe ukujija

1, Kutheni le nto ibhodi yesekethe kufuneka icabalele kakhulu

Kumgca wokufaka okuzenzekelayo, ukuba ibhodi eprintiweyo ayicaba, iya kubangela ukubekwa ngendlela engachanekanga, izinto ezingenakufakwa kwimingxunya kunye neepads zokunyusa umphezulu webhodi, kwaye zonakalise umatshini wokufaka ozenzekelayo. Ibhodi efakwe ngamacandelo igobile emva kwentsimbi, kwaye iinyawo zecandelo kunzima ukusika zithe tyaba kwaye zicocekile. Ibhodi ayinakufakelwa kwisisu semoto okanye kwisokethi kumatshini, ke kuyasokolisa kakhulu kumzi-mveliso wokuhlangana ukuhlangana nokudilika kwebhodi. Okwangoku, iibhodi eziprintiweyo zingene kwixesha lofakelo lomphezulu kunye nofakelo lwe-chip, kwaye izityalo zebandla kufuneka zibe neemfuno ezingqongqo ngakumbi zokungqubana kwebhodi.

2, umgangatho kunye novavanyo indlela warpage

Ngokwe-American ipc-6012 (uhlelo lowe-1996) Oku kuphucula iimfuno zeebhodi eziprintiweyo ezingaphezulu komhlaba xa kuthelekiswa ne-ipc-rb-0.75 (ushicilelo luka-1.5). Okwangoku, iphepha lemfazwe elivumelekileyo kwifektri nganye yendibano ye-elektroniki, nokuba inamacala amabini okanye uninzi lwamanqwanqwa, yi-276mm ubukhulu, ihlala ingu-1992 ~ 1.6%. Kwiibhodi ezininzi ze-SMT kunye ne-BGA, kufuneka ibe yi-0.70%. Ezinye iifektri zombane zikhuthaza ukunyusa umgangatho we-warpage kwi-0.75%. Indlela yokuvavanya iphepha lemfazwe iya kuthobela i-gb0.5-0.3 okanye ipc-tm-4677.5b. Beka ibhodi eprintiweyo kwiqonga eliqinisekisiweyo, faka inaliti yovavanyo endaweni kunye nephepha elikhulu lemfazwe, kwaye wahlule ububanzi benaliti yovavanyo ngobude bomda ogobileyo webhodi eprintiweyo ukubala iphepha lemfazwe lebhodi eprintiweyo.

3, Anti kwipleyiti anti ngexesha lemveliso

1. Uyilo lobunjineli: izilumkiso kuyilo lwePCB:

Ukulungelelaniswa kwamashiti anyangiweyo aphakathi kwamanqanaba kuya kuba macala. Umzekelo, ubukhulu phakathi kwezingqimba 1 ~ 2 kunye no-5 ~ 6 kwezingqimba ezintandathu ziya kuhambelana nenani lamashiti aphilisiweyo, kungenjalo kulula ukusonteka emva kokukhutshelwa.

B. Iimveliso zomthengisi omnye ziya kusetyenziselwa ibhodi engundoqo ye-multilayer kunye nephepha eliphilisiweyo.

C. Indawo yendlela yomgca kumphezulu womhlaba kunye nomphezulu B womaleko ongaphandle uya kusondela kangangoko. Ukuba umphezulu u yindawo enkulu yobhedu kunye nomphezulu B uthatha kuphela iingcingo ezimbalwa, ibhodi eprintiweyo kulula ukuyisonga emva kokudinwa. Ukuba umahluko wendawo yomgca phakathi kwala macala mabini mkhulu kakhulu, ezinye iigridi ezizimeleyo zinokongezwa kwicala elincinci lokulinganisa.

2. Ukucoca ipleyiti ngaphambi kokungabinanto:

Injongo yokomisa i-laminate egqunywe ngobhedu ngaphambi kokungabinanto (150 ° C, ixesha le-8 ukuya kwi-2 iiyure) kukususa ukufuma kwipleyiti, yomeleza ngokupheleleyo i-resin kwipleyiti kwaye kuphelise ngakumbi uxinzelelo olushiyekileyo kwipleyiti, eluncedo Ukuthintela iphepha lemfazwe. Okwangoku, iibhodi ezininzi ezinamacala amabini kunye neebhodi ezininzi ze-multilayer zisabambelela kwinqanaba lokomisa ngaphambi okanye emva kokungena. Nangona kunjalo, kukho ukungafani kwezinye iifektri zeplati. Okwangoku, ixesha lokomisa kwemizi-mveliso ye-PCB nayo ayingqinelani, ukusuka kwiiyure ezi-4 ukuya kwezili-10. Kuyacetyiswa ukuba kuthathwe isigqibo ngokwebakala leebhodi eziprintiweyo ezivelisiweyo kunye neemfuno zomthengi malunga nemfazwe. Zombini ezi ndlela zinokwenzeka. Kuyacetyiswa ukomisa ibhodi emva kokusika. Iplati yangaphakathi nayo iya koma.

3.I-Longitude kunye nobubanzi bephepha eliphilisiweyo:

I-warp kunye ne-weft shrinkage yeshiti ephilisiweyo emva kokuba i-lamination ihlukile, ke i-warp kunye ne-weft kufuneka yahlulwe ngexesha lokungabinanto kunye ne-lamination. Ngaphandle koko, kulula ukubangela iphepha lemfazwe leplate egqityiweyo emva kokuhlanjwa, kwaye kunzima ukulungisa nokuba uxinzelelo lusetyenzisiwe ukomisa ipleyiti. Izizathu ezininzi zokuba iphepha leemfazwe ezininzi libangelwa kukungacaci kobude kunye nobubanzi bamashiti aphilisiweyo ngexesha lokumisa.

/ Wahlula njani phakathi kobude nobude? Isalathiso sokuqengqeleka sephepha elinyangiweyo lesinyibilikisi sisalathiso se-warp, kwaye ububanzi bendlela sisikhokelo se-weft; Kwifoyile yobhedu, icala elide likwicala le-weft, kwaye icala elifutshane likulwalathiso lwe-warp. Ukuba awuqinisekanga, unokujonga kumenzi okanye kumthengisi.

4.Ukuncitshiswa koxinzelelo emva kokukhutshelwa:

Emva kokucinezela okushushu nokucinezela ukubanda, thabatha ibhodi ye-multilayer, unqumle okanye usike i-burr, emva koko uyibeke e-oveni nge-150 ℃ iiyure ezingama-4, ukuze ukhulule uxinzelelo ebhodini kwaye uphilise ngokupheleleyo i-resin . Eli nyathelo alinakushiyeka.

5. Iphepha kufuneka lilungiswe ngexesha lokwenza electroplating:

Xa i-0.4 ~ 0.6mm ibhodi ye-multilayer ebhityileyo isetyenziselwa ukucoca iplati yaphezulu kunye nephethini yokwenza i-electroplating, iiroller ezizodwa ziya kwenziwa. Emva kokubambelela amacwecwe amancinci kwibhar yokubhabha kumatshini wokuhambisa umbane ngokuzenzekelayo, sebenzisa intonga ejikelezayo ukuze uqinise ii-roller pin kwi-bar yonke ephaphazelayo, ukwenzela ukuba uzolule zonke iipleyiti kwiroller, ukuze iipleyiti ezingafakwanga zingakhubazeki. Ngaphandle kwalo mlinganiso, ipleyiti ebhityileyo iya kugoba emva kokufakela ubhedu obunobunzima obungama-20 okanye ama-30 eemicron, kwaye kunzima ukulungisa.

6. Ukupholisa ipleyiti emva kokulinganisa umoya oshushu:

Xa ibhodi eprintiweyo ilinganiswa ngumoya oshushu, ichaphazeleka bubushushu obuphezulu be-solder bath (malunga ne-250 ℃), emva koko iya kubekwa kwimarble ethe tyaba okanye kwipleyiti yentsimbi yokupholisa kwendalo, kwaye ithunyelwe kwiprosesa yeposi Ukucoca. Oku kulungele ukulwa kwebhodi. Ukuze kuphuculwe ukuqaqamba komphezulu wethini okhokelayo, ezinye iifektri zibeka iipleyiti emanzini abandayo kwangoko emva kokulinganisa umoya oshushu, kwaye zikhuphele ngaphandle konyango emva kwemizuzwana embalwa. Olu bushushu bunye kunye nefuthe elinye elibandayo kunokwenzeka ukuba livelise iphepha lemfazwe, i-delamination okanye i-blistering kwezinye iintlobo zamacwecwe. Ukongeza, izixhobo zokupholisa zinokufakwa kumandlalo ojikelezayo womoya.

7.Unyango lwesitya sokusonga:

Kwifektri elawulwe kakuhle, i-100% yokuhlolwa kwendlu iya kwenziwa ngexesha lokuhlolwa kokugqibela kweebhodi eziprintiweyo. Zonke iibhodi ezingafanelekanga ziya kukhethwa, zifakwe eontini, zomiswe kwi-150 ℃ kwaye ziphantsi koxinzelelo olunzima kangangeeyure ezingama-3 ~ 6, kwaye zipholile ngokwemvelo phantsi koxinzelelo olunzima. Emva koko thabatha ibhodi emva kokunyanzeliswa kwengcinezelo kwaye ukhangele ukunyaniseka. Ngale ndlela, ezinye iibhodi zinokugcinwa. Ezinye iibhodi kufuneka zomiswe kwaye zicinezelwe kabini okanye kathathu ukuze zilinganiswe. Umatshini womoya wokujija kunye nokulungisa umatshini omelwe yi-Shanghai Huabao sele isetyenzisiwe yi-Shanghai Bell ukulungisa i-warpage yebhodi yesekethe. Ukuba le nkqubo ingentla yokulwa inkqubo ayenziwanga, ezinye iibhodi azincedi kwaye zinokukhutshwa kuphela.