PCB circuit openings and short circuits are problems that PCB manufacturers encounter almost every day. They have been plagued by production and quality management personnel, resulting in insufficient shipments and replenishment, affecting on-time delivery, causing customer complaints, and it is more difficult for people in the industry. solved problem.

Peb thawj zaug sau cov ntsiab lus tseem ceeb ntawm PCB qhib Circuit Court rau hauv cov hauv qab no (kev tsom xam cov pob txha pob txha)

Qhib Circuit Analysis Fishbone Diagram

The reasons for the above phenomenon and the improvement methods are listed as follows:

1. Qhib Circuit Court tshwm sim los ntawm raug substrate

1. Muaj cov khawb ua ntej cov tooj liab clad laminate muab tso rau hauv lub warehouse;

2. The copper clad laminate is scratched during the cutting process;

3. Lub copper clad laminate yog khawb los ntawm lub laum taub thaum lub sij hawm drilling;

4. The copper clad laminate is scratched during the transfer process;

5. Cov ntawv ci tooj liab nyob rau saum npoo tau tawg vim kev ua haujlwm tsis raug thaum muab cov laug cam tom qab tooj liab tog;

6. Cov ntawv ci tooj liab nyob rau saum npoo ntawm lub rooj tsavxwm ntau lawm yog khawb thaum nws dhau los ntawm lub tshuab leveling;

Improve methods

1. IQC yuav tsum tau soj ntsuam random ua ntej cov tooj liab clad laminates nkag mus rau hauv lub warehouse los xyuas seb lub saum npoo ntawm lub rooj tsavxwm yog khawb thiab raug rau lub hauv paus khoom. Yog tias muaj, hu rau tus neeg muag khoom raws sijhawm, thiab kho kom tsim nyog raws li qhov xwm txheej tiag tiag.

2. Cov tooj liab clad laminate yog khawb thaum lub sijhawm qhib. Qhov laj thawj tseem ceeb yog tias muaj cov khoom ntse ntse ntawm lub rooj ntawm qhov qhib. Cov tooj liab clad laminate thiab cov khoom ntse rub tawm tsam cov khoom ntse thaum lub sijhawm qhib, uas ua rau cov ntawv ci tooj liab raug khawb thiab tsim cov phenomenon ntawm raug substrate. Lub rooj yuav tsum tau ua tib zoo ntxuav ua ntej txiav kom ntseeg tau tias lub rooj yog du thiab tsis muaj cov khoom tawv thiab ntse.

3. Lub copper clad laminate tau khawb los ntawm qhov tho lub taub hau thaum lub sijhawm drilling. Qhov laj thawj tseem ceeb yog vim li cas lub spindle clamp nozzle tau hnav, los yog muaj cov khib nyiab hauv lub clamp nozzle uas tsis tau ntxuav, thiab lub tshuab tho lub taub hau tsis ruaj khov, thiab lub tshuab tho lub taub hau tsis tau mus rau saum. Qhov ntev ntawm lub laum nozzle yog me ntsis ntev dua, thiab qhov siab lifting tsis txaus thaum drilling. Thaum lub tshuab cuab yeej txav mus, lub laum nozzle khawb cov ntawv ci tooj liab thiab tsim cov phenomenon ntawm nthuav tawm cov khoom hauv paus.

a. Lub chuck tuaj yeem hloov tau los ntawm tus lej ntawm lub sijhawm sau los ntawm rab riam lossis raws li qib hnav ntawm chuck;

b. Ntxuav lub chuck tsis tu ncua raws li cov kev cai ua haujlwm kom paub tseeb tias tsis muaj cov khib nyiab hauv chuck.

4. Scratched due to improper operation after copper sinking and full plate electroplating: When storing boards after copper sinking or full plate electroplating, the weight is not light when the plates are stacked together and then put down. , The board angle is downward and there is a gravitational acceleration, forming a strong impact force to hit the board surface, causing the board surface to scratch the exposed substrate.

5. Lub rooj tsavxwm ntau lawm yog khawb thaum hla lub tshuab leveling:

a. Lub baffle ntawm lub phaj grinder qee zaum kov lub npoo ntawm lub rooj tsavxwm, thiab ntug ntawm lub baffle yog tsis sib luag thiab cov khoom raug tsa, thiab qhov chaw ntawm lub rooj tsavxwm yog khawb thaum hla lub rooj tsavxwm;

b. Stainless hlau tsav ncej yog puas rau hauv ib qho khoom ntse, thiab tooj liab nto yog khawb thaum hla lub rooj tsavxwm thiab cov khoom siv hauv paus raug.

Yuav kom suav tau, rau qhov tshwm sim ntawm khawb thiab nthuav tawm lub substrate tom qab tooj liab sinking, nws yog ib qho yooj yim los txiav txim yog hais tias cov kab yog manifested nyob rau hauv daim ntawv ntawm qhib Circuit Court los yog kab sib txawv; yog tias nws yog khawb thiab nthuav tawm cov substrate ua ntej tooj liab sinking, nws yog ib qho yooj yim los txiav txim. Thaum nws nyob rau ntawm txoj kab, tom qab cov tooj liab yog dab dej, ib txheej ntawm tooj liab yog tso, thiab lub thickness ntawm cov ntawv ci tooj liab ntawm kab yog pom tseeb txo. Nws yog qhov nyuaj rau kev kuaj xyuas qhov qhib thiab luv luv tom qab, yog li tus neeg siv khoom yuav tsis tuaj yeem tiv taus nws ntau dhau thaum siv nws. Lub Circuit Court yog burnt vim yog lub siab tam sim no, muaj peev xwm ua tau zoo teeb meem thiab qhov tshwm sim ntawm kev lag luam poob yog loj heev.

Two, non-porous opening

1. Immersion tooj liab yog non-porous;

2. Muaj roj nyob rau hauv lub qhov kom nws tsis ntxeem tau;

3. Tshaj micro-etching ua rau tsis muaj porosity;

4. Tsis zoo electroplating ua rau tsis muaj ntxeem tau;

5. Drill hole burned or dust plugged the hole to cause non-porous;

kev txhim kho

1. Immersion tooj liab yog non-porous:

a. Porosity tshwm sim los ntawm pore modifier: nws yog vim qhov tsis txaus lossis tsis ua haujlwm ntawm cov tshuaj lom neeg ntawm cov pore hloov pauv. Kev ua haujlwm ntawm lub pore modifier yog los kho cov khoom hluav taws xob ntawm cov insulating substrate rau ntawm phab ntsa pore los pab txhawb cov adsorption tom ntej ntawm palladium ions thiab xyuas kom cov tshuaj tiv thaiv tooj liab ua tiav. Yog hais tias cov tshuaj concentration ntawm cov porogen tsis sib npaug los yog ua tsis tiav, nws yuav ua rau tsis muaj porosity.

b. Activator: cov khoom xyaw tseem ceeb yog pd, organic acid, stannous ion thiab chloride. Txhawm rau tso cov hlau palladium uniformly ntawm lub qhov phab ntsa, nws yog ib qho tsim nyog los tswj ntau yam tsis ua raws li qhov yuav tsum tau ua. Coj peb tus activator tam sim no ua piv txwv:

① Qhov kub yog tswj ntawm 35-44 ° C. Thaum qhov kub thiab txias, qhov ceev ntawm palladium deposition tsis txaus, ua rau tsis tiav cov tshuaj tooj liab; thaum qhov kub thiab txias, cov tshuaj tiv thaiv yog ceev heev thiab cov khoom siv nqi nce.

② Cov concentration thiab colorimetric tswj yog 80% -100%. Yog tias qhov concentration tsawg, qhov ceev ntawm palladium tso rau ntawm nws tsis txaus.

Cov tshuaj tiv thaiv tooj liab tsis tiav; qhov siab dua qhov concentration, ntau dua cov khoom siv vim yog cov tshuaj tiv thaiv sai.

c. Accelerator: Lub ntsiab tivthaiv yog cov organic acid, uas yog siv los tshem tawm cov stannous thiab chloride ion tebchaw adsorbed rau ntawm lub pore phab ntsa, exposing cov catalytic hlau palladium rau cov kev tshwm sim tom ntej. Lub accelerator peb siv tam sim no muaj tshuaj lom neeg ntawm 0.35-0.50N. Yog tias qhov concentration siab, cov hlau palladium yuav raug tshem tawm, ua rau cov tshuaj tsis tiav cov tooj liab. Yog tias qhov concentration tsawg, cov nyhuv ntawm kev tshem tawm stannous thiab chloride ion compounds adsorbed rau ntawm phab ntsa pore tsis zoo, ua rau tsis tiav cov tshuaj tooj liab.

2. There is wet film oil remaining in the hole causing non-porosity:

a. Thaum kev tshuaj ntsuam luam ntawv ntub dej, luam ib lub rooj tsavxwm thiab txhuam hauv qab ntawm lub vijtsam ib zaug kom ntseeg tau tias tsis muaj roj tsub zuj zuj hauv qab ntawm lub vijtsam, thiab yuav tsis muaj cov roj ntub dej nyob hauv lub qhov nyob rau hauv ib txwm muaj.

b. Lub 68-77T npo yog siv rau cov ntaub ntawv ntub dej tshuaj ntsuam luam ntawv. Yog tias siv lub vijtsam tsis raug, xws li ≤51T, cov roj zaj duab xis ntub dej tuaj yeem nkag mus rau hauv lub qhov, thiab cov roj hauv lub qhov yuav tsis raug tsim kom huv si thaum lub sijhawm txhim kho. Qee lub sij hawm, cov txheej hlau yuav tsis raug plated, ua rau tsis muaj qhov ntxeem tau. Yog hais tias lub mesh yog siab, nws muaj peev xwm hais tias vim tsis txaus number case thickness, lub anti-coating zaj duab xis yog tawg los ntawm tam sim no thaum electroplating, ua rau muaj ntau yam hlau ntsiab lus ntawm circuits los yog luv luv circuits.

Peb, tsau txoj hauj lwm qhib Circuit Court

1. Ib qho qhib Circuit Court tshwm sim los ntawm khawb ntawm cov yeeb yaj kiab rov qab;

2. Muaj trachoma ntawm txoj kab yeeb yaj kiab uas ua rau muaj qhov qhib qhib;

Improve methods

1. Kos rau ntawm txoj kab sib dhos zaj duab xis ua rau lub voj voog qhib, thiab cov zaj duab xis saum npoo yog rubbed rau ntawm lub rooj tsavxwm nto los yog cov khib nyiab los khawb cov zaj duab xis nto kab, ua rau lub teeb kis tau tus mob. Tom qab kev txhim kho, txoj kab ntawm cov zaj duab xis khawb kuj tseem npog los ntawm tus number case, ua rau electroplating Thaum tiv thaiv plating, Circuit Court yog eroded thiab qhib thaum lub sij hawm etching.

2. Muaj cov kab mob trachoma ntawm txoj kab ntawm zaj duab xis nto thaum lub sij hawm sib dhos, thiab cov kab ntawm cov yeeb yaj kiab trachoma tseem npog los ntawm tus number case tom qab kev loj hlob, uas ua rau kev tiv thaiv plating thaum lub sij hawm electroplating, thiab cov kab yog eroded thiab qhib thaum lub sij hawm etching.

Plaub, tiv thaiv plating qhib Circuit Court

1. Cov zaj duab xis qhuav yog tawg thiab txuas rau hauv Circuit Court thaum lub sij hawm kev loj hlob, ua rau qhib Circuit Court;

2. Ink yog txuas rau saum npoo ntawm lub voj voog kom ua rau lub voj voog qhib;

Improve methods

1. Qhib Circuit Court tshwm sim los ntawm tawg zaj duab xis qhuav txuas rau kab:

a. Cov “drilling qhov” thiab “screen-printing qhov” ntawm ntug zaj duab xis lossis zaj duab xis tsis raug kaw tag nrog daim kab xev teeb. Cov zaj duab xis qhuav ntawm ntug ntawm lub rooj tsavxwm yog kho los ntawm lub teeb thaum raug thiab ua zaj duab xis qhuav thaum lub sij hawm tsim kho. Cov fragments raug muab tso rau hauv tus tsim tawm los yog dej ntxuav lub tank, thiab cov fragments qhuav ua raws li lub Circuit Court ntawm lub rooj tsavxwm nto thaum lub sij hawm tom ntej board pass. Lawv tiv taus plating thaum lub sij hawm electroplating thiab tsim ib qho qhib Circuit Court tom qab cov zaj duab xis raug tshem tawm thiab etched.

b. Non-metallized qhov npog nrog zaj duab xis qhuav. Thaum lub sij hawm txoj kev loj hlob, vim yog siab dhau heev lawm los yog tsis txaus adhesion, daim npog qhov ncauj qhuav zaj duab xis nyob rau hauv lub qhov yog tawg mus rau hauv fragments thiab poob rau hauv lub developer los yog dej ntxuav tank. Cov zaj duab xis qhuav yog txuas rau hauv Circuit Court, uas tiv taus plating thaum lub sij hawm electroplating, thiab tsim ib qho qhib Circuit Court tom qab cov zaj duab xis raug tshem tawm thiab etched.

2. Muaj tus cwj mem txuas rau saum npoo ntawm lub voj voog ua rau lub voj voog qhib. Qhov laj thawj tseem ceeb yog tias tus cwj mem tsis tau ci ua ntej lossis tus lej ntawm tus tsim tawm ntau dhau. Nws txuas nrog rau txoj kab thaum lub sij hawm tom ntej board pass, thiab tiv taus plating thaum lub sij hawm electroplating, thiab qhib Circuit Court yog tsim tom qab cov zaj duab xis raug tshem tawm thiab etched.