PCB circuit openings and short circuits are problems that PCB manufacturers encounter almost every day. They have been plagued by production and quality management personnel, resulting in insufficient shipments and replenishment, affecting on-time delivery, causing customer complaints, and it is more difficult for people in the industry. solved problem.

Anyị buru ụzọ chịkọta isi ihe kpatara PCB oghe sekit n’ime akụkụ ndị a (nyocha eserese ọkpụkpụ azụ)

Mepee eserese ọkpụkpụ azụ nyocha sekit

Edepụtara ihe kpatara ihe a dị n’elu yana ụzọ nkwalite dị ka ndị a:

1. Mepee sekit mere site na mkpụrụ osisi ekpughere

1. Enwere ncha tupu etinye laminate ọla kọpa n’ime ụlọ nkwakọba ihe;

2. The copper clad laminate is scratched during the cutting process;

3. A na-akpụcha laminate nke ọla kọpa site n’ọnụ mmiri n’oge egwu;

4. The copper clad laminate is scratched during the transfer process;

5. A na-akụtu ihe mkpuchi ọla kọpa n’elu n’ihi ọrụ na-ezighị ezi mgbe ị na-akwakọba mbadamba nkume ahụ mgbe ọ nwụsịrị ọla kọpa;

6. A na-ehichapụ ihe mkpuchi ọla kọpa n’elu ụlọ mmepụta ihe mgbe ọ na-agafe igwe ọkwa;

Melite ụzọ

1. IQC ga-eduzi nyocha na-enweghị usoro tupu ọla kọpa clad laminates abanye n’ụlọ nkwakọba ihe iji chọpụta ma a na-ehichapụ elu nke osisi ahụ ma kpughee ya na ihe isi. Ọ bụrụ otú ahụ, kpọtụrụ onye na-eweta ngwaahịa n’oge, ma mee ọgwụgwọ kwesịrị ekwesị dabere na ọnọdụ ahụ n’ezie.

2. A na-akpụcha laminate ọla kọpa n’oge usoro mmeghe. Isi ihe kpatara ya bụ na enwere ihe siri ike dị nkọ na tebụl nke mmeghe. Ihe mkpuchi ọla kọpa na ihe ndị dị nkọ na-ete ihe ndị dị nkọ n’oge usoro mmeghe, nke na-eme ka ọkpụkpụ ọla kọpa na-akpụcha ma na-etolite ihe ngosi nke mkpụrụ osisi ekpughere. A ghaghị kpochaa tebụl ahụ nke ọma tupu ịchachaa iji hụ na tebụl ahụ dị mma na enweghị ihe siri ike ma dị nkọ.

3. A na-akpụpụta laminate nke ọla kọpa site na oghere mkpọpu mgbe a na-egwupụta ya. Isi ihe kpatara ya bụ na a na-eyi eriri mkpịsị mkpịsị mkpịsị mkpịsị aka, ma ọ bụ na e nwere irighiri ihe dị n’ọnụ mmiri nke a na-ehichaghị, na a naghị ejide ya nke ọma, ma ọ bụ n’elu ya eruteghị n’elu. Ogologo nke oghere ihe nkedo dị ntakịrị ogologo, na elu elu adịghị ezuru mgbe ị na-egwupụta ihe. Mgbe ngwa igwe na-agagharị, oghere mkpọpuku na-akpụkọ foil ọla kọpa wee mepụta ihe ngosi nke ikpughe ihe ndị bụ isi.

a. Enwere ike dochie chuck ahụ site na ọnụ ọgụgụ nke oge edere site na mma ma ọ bụ dịka ogo nke ejiji nke chuck;

b. Na-asachapụ chuck mgbe niile dị ka ụkpụrụ arụ ọrụ siri dị iji hụ na ọ dịghị ihe mkpofu na chuck.

4. Scratched due to improper operation after copper sinking and full plate electroplating: When storing boards after copper sinking or full plate electroplating, the weight is not light when the plates are stacked together and then put down. , The board angle is downward and there is a gravitational acceleration, forming a strong impact force to hit the board surface, causing the board surface to scratch the exposed substrate.

5. A na-akpụ osisi mmepụta ihe mgbe ọ na-agafe igwe larịị:

a. Mgbagwoju anya nke efere efere mgbe ụfọdụ na-emetụ n’elu osisi ahụ, na nsọtụ nke mgbagwoju anya na-adịghị mma na ihe ahụ na-ebuli elu, na elu nke osisi na-akpụcha mgbe ị na-agafe osisi;

b. Igwe igwe anaghị agba nchara draịva na-emebi emebi n’ime ihe dị nkọ, a na-ekpochapụkwa ọla kọpa ahụ mgbe ị na-agafe osisi na ihe isi ala na-ekpughe.

N’ịchịkọta, maka onu nke scratching na ikpughe mkpụrụ mgbe ọla kọpa sinking, ọ dị mfe ikpe ikpe ma ọ bụrụ na akara na-egosipụta n’ụdị na-emeghe sekit ma ọ bụ akara ọdịiche; ma ọ bụrụ na ọ bụ ọkọchị na ikpughe mkpụrụ tupu ọla kọpa imi, ọ dị mfe ikpe ikpe. Mgbe ọ dị n’ahịrị, mgbe a na-agbanye ọla kọpa ahụ, a na-edobe oyi akwa nke ọla kọpa, na o doro anya na a na-ebelata oke nke mpempe akwụkwọ ọla kọpa nke akara ahụ. Ọ na-esiri ike ịchọpụta ule sekit na-emeghe na nke dị mkpirikpi mgbe e mesịrị, nke mere na onye ahịa agaghị enwe ike iguzogide ya mgbe ọ na-eji ya. A na-ere sekit ahụ ọkụ n’ihi nnukwu ihe dị ugbu a, nsogbu ndị nwere ike ịdị mma na nkwụsị akụ na ụba na-akpata dị nnọọ ukwuu.

Two, non-porous opening

1. Imikpu ọla kọpa na-adịghị porous;

2. Onwere mmanụ n’oghere ime ka ọ ghara ịgbapu;

3. Nnukwu micro-etching na-akpata enweghị porosity;

4. Ogbenye electroplating na-akpata enweghị porous;

5. Drill hole burned or dust plugged the hole to cause non-porous;

Ndozi

1. Ọla kọpa imikpu n’ime mmiri adịghị agba:

a. Porosity kpatara pore modifier: ọ bụ n’ihi enweghị ahaghị nhata ma ọ bụ ọdịda nke kemịkalụ kemịkalụ nke pore modifier. Ọrụ nke pore modifier bụ imezi ihe eletriki nke ihe mkpuchi mkpuchi na mgbidi pore iji kwado mgbasa ozi nke palladium na-esote ma hụ na mkpuchi mkpuchi ọla kọpa zuru oke. Ọ bụrụ na mkpokọta kemịkalụ nke porogen adịghị mma ma ọ bụ daa, ọ ga-eduga na enweghị porosity.

b. Activator: ihe ndị bụ isi bụ pd, organic acid, ion dị egwu na chloride. Iji tinye palladium metal n’otu n’otu na mgbidi oghere, ọ dị mkpa ijikwa ihe dị iche iche iji mezuo ihe ndị a chọrọ. Were onye na-eme ihe ugbu a dịka ọmụmaatụ:

① A na-achịkwa okpomọkụ na 35-44 ° C. Mgbe okpomọkụ dị ala, njupụta nke ntinye nke palladium ezughị, na-eme ka mkpuchi ọla kọpa ezughị ezu; mgbe okpomọkụ dị elu, mmeghachi omume dị ngwa ngwa na ọnụ ahịa ihe na-abawanye.

② Ntinye uche na njikwa colorimetric bụ 80% -100%. Ọ bụrụ na ntinye uche dị ala, njupụta nke palladium etinyere na ya ezughị.

Ihe mkpuchi ọla kọpa kemịkalụ ezughị oke; nke dị elu na ntinye uche, ọnụ ahịa ihe dị elu n’ihi mmeghachi omume ngwa ngwa.

c. Accelerator: Isi ihe dị n’ime ya bụ organic acid, nke a na-eji wepụ ogige ion dị egwu na chloride nke a na-etinye na mgbidi pore, na-ekpughe palladium metal catalytic maka mmeghachi omume na-esote. Ngwa ngwa ngwa anyị na-eji ugbu a nwere mkpokọta kemịkalụ 0.35-0.50N. Ọ bụrụ na ntinye uche dị elu, a ga-ewepụ palladium metal, na-eme ka mkpuchi ọla kọpa ezughị ezu. Ọ bụrụ na ntinye uche dị ala, mmetụta nke iwepụ ihe ndị dị egwu na ion ion ion ion dị mma adịghị mma, na-eme ka mkpuchi ọla kọpa ezughị ezu.

2. There is wet film oil remaining in the hole causing non-porosity:

a. Mgbe ị na-ebipụta ihe nkiri mmiri mmiri, bipụta bọọdụ ma kpochapụ ala ihuenyo ahụ otu ugboro iji hụ na ọ dịghị nchịkọta mmanụ na ala nke ihuenyo ahụ, a gaghị enwekwa mmanụ ihe nkiri mmiri fọdụrụ na oghere n’okpuru ọnọdụ nkịtị.

b. A na-eji ihuenyo 68-77T mee ihe maka mbipụta ihuenyo mmiri mmiri. Ọ bụrụ na ejiri ihuenyo na-ezighị ezi, dị ka ≤51T, mmanụ ihe nkiri mmiri mmiri nwere ike ịbanye n’ime oghere ahụ, mmanụ dị n’ime oghere ahụ nwere ike ghara ịmepụta nke ọma n’oge mmepe. Mgbe ụfọdụ, a gaghị ekpuchi oyi akwa ígwè ahụ, na-eme ka ọ ghara ịcha. Ọ bụrụ na ntupu dị elu, ọ ga-ekwe omume na n’ihi oke ink ezughị ezu, ihe nkiri mkpuchi mkpuchi na-agbaji site ugbu a n’oge electroplating, na-eme ka ọtụtụ ihe ígwè dị n’etiti sekit ma ọ bụ ọbụna obere sekit.

Atọ, ofu ọnọdụ oghe oghe

1. Ihe na-emeghe sekit mere site na scratches na-abụghị ihe nkiri akara;

2. Enwere trachoma na ahịrị ihe nkiri na-abụghị nke na-eme ka oghere mepere emepe;

Melite ụzọ

1. Scratches na ahịrị ihe nkiri ntinye na-eme ka oghere na-emeghe, na ihe nkiri ahụ na-ete n’elu osisi ma ọ bụ ihe mkpofu iji kpoo ahịrị elu ihe nkiri ahụ, na-eme ka nnyefe ọkụ. Mgbe mmepe gasịrị, eriri nke ihe nkiri ahụ na-ekpuchikwa ink, na-eme ka electroplating Mgbe ị na-eguzogide plating, sekit na-emebi ma meghee ya n’oge etching.

2. Enwere trachoma n’ahịrị nke ihe nkiri ahụ n’oge nhazi, na ahịrị dị na trachoma ihe nkiri ahụ ka na-ekpuchi ink mgbe emechara ya, na-ebute mgbochi plating n’oge electroplating, na eriri na-emebi ma mepee mgbe etching.

Anọ, mgbochi-plating oghe sekit

1. A na-agbaji ihe nkiri akọrọ ma tinye ya na sekit n’oge mmepe, na-eme ka oghere oghere;

2. A na-ejikọta ink na elu nke sekit iji mee ka oghere na-emeghe;

Melite ụzọ

1. Mepee sekit mere site na ihe nkiri akọrọ gbajiri agbaji etinyere na ahịrị:

a. A naghị eji teepu na-egbochi ọkụ mechie “oghere ndị a na-egwupụta ihe” na “oghere a na-ebipụta ihuenyo” na nsọtụ ihe nkiri ma ọ bụ ihe nkiri. A na-agwọta ihe nkiri akọrọ na nsọtụ osisi ahụ site na ọkụ n’oge ikpughe ma ghọọ ihe nkiri akọrọ n’oge mmepe. A na-atụba iberibe ihe ndị ahụ n’ime onye mmepụta ma ọ bụ mmiri na-asacha mmiri, na iberibe ihe nkiri akọrọ na-adabere na sekit dị n’elu osisi n’oge ngafe bọọdụ na-esote. Ha na-eguzogide ọgwụ plating n’oge electroplating ma na-etolite oghere na-emeghe mgbe e wepụrụ ihe nkiri ahụ na etched.

b. Oghere ndị na-abụghị metalized masked na ihe nkiri akọrọ. N’oge mmepe, n’ihi nrụgide dị ukwuu ma ọ bụ nrapado ezughị ezu, ihe nkiri akọrọ nke masked na oghere na-agbaji n’ime iberibe ma tụba n’ime onye mmepụta ma ọ bụ mmiri na-asacha mmiri. A na-ejikọta iberibe ihe nkiri akọrọ na sekit, nke na-eguzogide ọgwụ n’oge electroplating, na-emepụta oghere na-emeghe mgbe e wepụrụ ihe nkiri ahụ na etched.

2. Enwere ink na-ejikọta na elu nke sekit iji mee ka oghere na-emeghe. Isi ihe kpatara ya bụ na a na-ebughị ụzọ mee ink ma ọ bụ ọnụ ọgụgụ ink dị na onye mmepụta hiri nne. A na-ejikọta ya na akara n’oge ntinye akwụkwọ na-esote, ma na-eguzogide ọgwụ maka ịkwanye n’oge electroplating, a na-emepụta sekit na-emeghe mgbe e wepụrụ ihe nkiri ahụ na etched.