PCB circuit openings and short circuits are problems that PCB manufacturers encounter almost every day. They have been plagued by production and quality management personnel, resulting in insufficient shipments and replenishment, affecting on-time delivery, causing customer complaints, and it is more difficult for people in the industry. solved problem.

Siqale sifingqe izimbangela eziyinhloko zesekhethi evulekile ye-PCB kulezi zici ezilandelayo (ukuhlaziywa komdwebo wethambo lezinhlanzi)

Vula umdwebo we-fishbone wokuhlaziya isifunda

Izizathu zalesi simo esingenhla nezindlela zokuthuthukisa zibalwe ngale ndlela elandelayo:

1. Vula isifunda esibangelwa i-substrate eveziwe

1. Kukhona imihuzuko ngaphambi kokuba i-laminate egqoke ithusi ifakwe endaweni yokugcina impahla;

2. The copper clad laminate is scratched during the cutting process;

3. I-laminate ene-copper clad iklwejwa yi-drill tip ngesikhathi sokumba;

4. The copper clad laminate is scratched during the transfer process;

5. Ucwecwe lwethusi olungaphezulu lwabhampa ngenxa yokusebenza ngendlela engafanele lapho kupakishwa amabhodi ngemva kokucwila kwethusi;

6. I-foil yethusi ebusweni bebhodi lokukhiqiza iyaklwejwa lapho idlula emshinini wokulinganisa;

Thuthukisa izindlela

1. I-IQC kufanele ihlole okungahleliwe ngaphambi kokuba ama-laminates e-copper clad angene endaweni yokugcina impahla ukuze ahlole ukuthi ingaphezulu lebhodi liyaklwejwa futhi livezwe ezintweni eziyisisekelo. Uma kunjalo, thintana nomphakeli kusenesikhathi, futhi wenze ukwelashwa okufanele kuye ngokwesimo sangempela.

2. I-laminate ye-copper clad iklwejwa ngesikhathi sokuvula. Isizathu esiyinhloko ukuthi kunezinto ezicijile eziqinile etafuleni lesivula. I-laminate ye-copper clad kanye nezinto ezicijile zigudla izinto ezicijile ngesikhathi sokuvula, okubangela ukuthi i-foil yethusi iklwetshwe futhi yakhe into ye-substrate eveziwe. Itafula kufanele lihlanzwe ngokucophelela ngaphambi kokusikwa ukuze kuqinisekiswe ukuthi itafula libushelelezi futhi alinazo izinto eziqinile nezicijile.

3. I-laminate egqoke ithusi yaklwejwa ngombhobho wokubhoboza ngesikhathi sokumba. Isizathu esiyinhloko kwakuwukuthi umbhobho we-spindle clamp wawugqokwe, noma kwakukhona imfucumfucu ku-clamp nozzle eyayingahlanzwa, futhi i-drill nozzle ayizange ibanjwe ngokuqinile, futhi i-drill nozzle yayingekho phezulu. Ubude bombhobho wokubhoboza bude kancane, futhi ukuphakama kokuphakamisa akwanele lapho kubhobozwa. Lapho ithuluzi lomshini lihamba, umbhobho wokubhoboza uklwebha i-foil yethusi bese wenza isenzakalo sokuveza okuyisisekelo.

a. I-chuck ingashintshwa ngenani lezikhathi ezirekhodwe ummese noma ngokwezinga lokuguga kwe-chuck;

b. Hlanza i-chuck njalo ngokwemithetho yokusebenza ukuze uqinisekise ukuthi akukho doti ku-chuck.

4. Ukuklwebheka ngenxa yokusebenza okungafanele ngemva kokucwila kwethusi kanye ne-electroplating yepuleti eligcwele: Lapho ugcina amabhodi ngemva kokucwila kwethusi noma ipuleti eligcwele le-electroplating, isisindo asilula lapho amapuleti enqwabelene abese ebekwa phansi. , I-engeli yebhodi ibheke phansi futhi kukhona ukusheshisa kwamandla adonsela phansi, okwakha amandla anamandla okuthonya ukushaya indawo yebhodi, okubangela ukuthi indawo yebhodi iklwebhe i-substrate eveziwe.

5. Ibhodi lokukhiqiza liyaklwejwa lapho lidlula emshinini wokulinganisa:

a. I-baffle ye-plate grinder ngezinye izikhathi ithinta ingaphezulu lebhodi, futhi unqenqema lwe-baffle alulingani futhi into iyaphakanyiswa, futhi ingaphezulu lebhodi liyaklwejwa lapho lidlula ibhodi;

b. I-stainless steel drive shaft yonakaliswa ibe yinto ebukhali, futhi indawo yethusi ishaywa lapho idlula ibhodi futhi izinto eziyisisekelo zivezwa.

Ukufingqa, ngenxa yokwenzeka kokuklwebheka nokuvezwa kwe-substrate ngemva kokucwila kwethusi, kulula ukwahlulela uma umugqa ubonakaliswa ngendlela yesifunda esivulekile noma igebe lomugqa; uma kuwukuklwebha nokuveza i-substrate ngaphambi kokucwila kwethusi, kulula ukwahlulela. Uma isemgqeni, ngemva kokucwiliswa kwethusi, ungqimba lwethusi lufakwa, futhi ubukhulu be-foil yethusi yomugqa buyancipha ngokusobala. Kunzima ukuthola ukuhlolwa kwesekethe evulekile nefushane kamuva, ukuze ikhasimende lingakwazi ukumelana nakho kakhulu uma lilisebenzisa. Isekhethi ishile ngenxa yamandla aphezulu, izinkinga zekhwalithi ezingase zibe khona kanye nomphumela wokulahlekelwa kwezomnotho kukhulu kakhulu.

Okubili, ukuvulwa okungenayo i-porous

1. Ithusi lokucwiliswa alinambobo;

2. Kukhona amafutha emgodini ukuze angabi nezimbotshana;

3. I-micro-etching kakhulu idala ukungahambi kahle;

4. I-electroplating engalungile idala i-non-porous;

5. Drill hole burned or dust plugged the hole to cause non-porous;

Ukuthuthukiswa

1. Ikhopha yokucwiliswa ayinambobo:

a. I-porosity ebangelwa i-pore modifier: kungenxa yokungalingani noma ukwehluleka kokugxila kwamakhemikhali kwesilungisi sembotshana. Umsebenzi we-pore modifier ukulungisa izakhiwo zikagesi ze-insulating substrate odongeni lwembotshana ukuze kube lula ukufakwa okulandelayo kwama-ion e-palladium nokuqinisekisa ukuthi amakhemikhali Ukumbozwa kwethusi kuqediwe. Uma ukuhlushwa kwamakhemikhali e-porogen kungalingani noma kwehluleka, kuzoholela ekungabini kwe-porosity.

b. I-Activator: izithako eziyinhloko yi-pd, i-organic acid, i-stannous ion ne-chloride. Ukuze ufake i-palladium yensimbi ngokufanayo odongeni lwembobo, kuyadingeka ukulawula imingcele ehlukahlukene ukuze uhlangabezane nezidingo. Thatha isiqalisi sethu samanje njengesibonelo:

① Izinga lokushisa lilawulwa ku-35-44°C. Lapho izinga lokushisa liphansi, ukuminyana kwe-palladium deposition akwanele, okuholela ekufakweni kwethusi kwamakhemikhali okungaphelele; lapho izinga lokushisa liphezulu, ukusabela kushesha kakhulu futhi izindleko zempahla ziyanda.

② I-concentration and colorimetric control ingu-80% -100%. Uma ukugxila kuphansi, ukuminyana kwe-palladium efakwe kuyo akwanele.

Ukufakwa kwamakhemikhali ethusi akuphelele; ukugxila okuphezulu, kuyanda izindleko zempahla ngenxa yokusabela okusheshayo.

c. I-Accelerator: Ingxenye eyinhloko i-asidi ephilayo, esetshenziselwa ukususa i-stannous ne-chloride ion compounds ekhangiswe odongeni lwembotshana, iveze obala i-catalytic metal palladium ngokusabela okulandelayo. I-accelerator esiyisebenzisayo manje inokugxila kwamakhemikhali okungu-0.35-0.50N. Uma ukugxila kuphezulu, i-palladium yensimbi izosuswa, okuholela ekufakweni kwethusi kwamakhemikhali okungaphelele. Uma ukugxilisa ingqondo kuphansi, umphumela wokukhipha i-stannous ne-chloride ion compounds ekhangiswe odongeni lwama-pore awumuhle, okuholela ekufakweni kwekhopha kwamakhemikhali okungaphelele.

2. There is wet film oil remaining in the hole causing non-porosity:

a. Uma isikrini siphrinta ifilimu emanzi, phrinta ibhodi bese uklwebha phansi kwesikrini kanye ukuze uqinisekise ukuthi awekho ukunqwabelana kwamafutha ngaphansi kwesikrini, futhi ngeke kube khona uwoyela wefilimu omanzi osalayo embobeni ngaphansi kwezimo ezijwayelekile.

b. Isikrini esingu-68-77T sisetshenziselwa ukuphrinta isikrini sefilimu esimanzi. Uma isikrini esingalungile sisetshenziswa, esifana ne-≤51T, amafutha efilimu emanzi angase avuze embobeni, futhi amafutha emgodini angase angathuthukisiwe ngokuhlanzekile ngesikhathi sokuthuthukiswa. Ngezinye izikhathi, ungqimba lwensimbi ngeke luhlanganiswe, okuholela ekungabini kwe-porous. Uma i-mesh iphezulu, kungenzeka ukuthi ngenxa yobukhulu be-inki obunganele, ifilimu yokulwa ne-coating iphulwa okwamanje ngesikhathi se-electroplating, okubangela amaphuzu amaningi ensimbi phakathi kwamasekethe noma ngisho namasekhethi amafushane.

Okuthathu, indawo egxilile yesekethe evulekile

1. Isekhethi evulekile ebangelwa imihuzuko kulayini wefilimu ophambene;

2. Kukhona i-trachoma kulayini wefilimu ophambene obangela isekethe evulekile;

Thuthukisa izindlela

1. Ukuklwebheka emugqeni wefilimu wokuqondanisa kubangela isekethe evulekile, futhi indawo yefilimu ihlikihlwa phezu kwebhodi noma udoti ukuze kunwaye umugqa ongaphezulu wefilimu, okubangela ukudluliswa kokukhanya. Ngemuva kokuthuthukiswa, umugqa we-scratch yefilimu ubuye umbozwe yiyinki, okwenza i-electroplating Uma umelana nokufakwa, isifunda sichithwa futhi sivulwe ngesikhathi sokuqopha.

2. Kukhona i-trachoma emgqeni wendawo yefilimu ngesikhathi sokuqondanisa, futhi umugqa ku-trachoma yefilimu usambozwe uyinki ngemva kokuthuthukiswa, okuholela ekunqandeni ukugcoba ngesikhathi se-electroplating, futhi umugqa uguguleka futhi uvulwe ngesikhathi sokuqoshwa.

Okwesine, isifunda esivulekile sokulwa nokucwebezela

1. Ifilimu eyomile iphukile futhi inamathele kumjikelezo ngesikhathi sokuthuthukiswa, okwenza isifunda esivulekile;

2. Uyinki unamathiselwe ebusweni bomjikelezo ukuze kubangele isekethe evulekile;

Thuthukisa izindlela

1. Vula isifunda esibangelwa ifilimu eyomile ephukile enamathiselwe emugqeni:

a. “Izimbobo zokubhoboza” kanye “nezimbobo zokuphrinta isikrini” onqenqemeni lwefilimu noma ifilimu azivalwanga ngokuphelele nge-tape yokuvimbela ukukhanya. Ifilimu eyomile emaphethelweni ebhodi iphulukiswa ukukhanya ngesikhathi sokuchayeka futhi iba ifilimu eyomile ngesikhathi sokuthuthukiswa. Izingcezu ziphonswa kumthuthukisi noma ithangi lokugeza amanzi, futhi izingcezu zefilimu ezomile zinamathela kumjikelezo endaweni yebhodi ngesikhathi sokudlula kwebhodi okulandelayo. Ziyakwazi ukumelana nokucwenga ngesikhathi se-electroplating futhi zakha isifunda esivulekile ngemva kokuba ifilimu isusiwe futhi igxiliwe.

b. Izimbobo ezingezona ezensimbi ezimbozwe ngefilimu eyomile. Ngesikhathi sokuthuthukiswa, ngenxa yokucindezela okukhulu noma ukunamathela okwanele, ifilimu eyomile efihliwe emgodini iphulwa ibe yizicucu futhi iphonswe kumthuthukisi noma ithangi lokugeza amanzi. Izingcezu zefilimu ezomile zixhunywe kumjikelezo, ongamelana nokugcoba ngesikhathi se-electroplating, futhi yenza isifunda esivulekile ngemva kokuba ifilimu isusiwe futhi ifakwe.

2. Kukhona uyinki enamathiselwe ebusweni besekethe ukuze kubangele isekethe evulekile. Isizathu esiyinhloko ukuthi uyinki awubhakwanga ngaphambili noma inani likayinki kumthuthukisi liningi kakhulu. Inamathiselwe emgqeni ngesikhathi sokudlula kwebhodi elilandelayo, futhi imelana nokucwenga ngesikhathi se-electroplating, futhi isifunda esivulekile siyakhiwa ngemva kokuba ifilimu isusiwe futhi ifakwe.