PCB circuit openings and short circuits are problems that PCB manufacturers encounter almost every day. They have been plagued by production and quality management personnel, resulting in insufficient shipments and replenishment, affecting on-time delivery, causing customer complaints, and it is more difficult for people in the industry. solved problem.

Siqale sishwankathele oonobangela abaphambili besekethe evulekileyo ye-PCB kule miba ilandelayo (uhlalutyo lwedayagramu ye-fishbone)

Vula uhlalutyo lwesekethe idayagram yethambo lentlanzi

The reasons for the above phenomenon and the improvement methods are listed as follows:

1. Vula isekethe ebangelwa yi-substrate ebonakalisiweyo

1. Kukho imikrwelo phambi kokuba i-laminate yobhedu ifakwe kwindawo yokugcina impahla;

2. The copper clad laminate is scratched during the cutting process;

3. I-laminate ye-copper clad ikrwelwe yi-drill tip ngexesha lokugaya;

4. The copper clad laminate is scratched during the transfer process;

5. I-foil yobhedu phezu komhlaba yatshitshiswa ngenxa yokusebenza ngokungafanelekanga xa ubeka iibhodi emva kokucwiliswa kobhedu;

6. I-foil yobhedu ebusweni bebhodi yokuvelisa ikhutshwe xa idlula kumatshini wokulinganisa;

Phucula iindlela

1. I-IQC kufuneka iqhube uhlolo olungacwangciswanga phambi kokuba i-laminates ye-copper clad ingene kwindawo yokugcina impahla ukujonga ukuba ubuso bebhodi bukhutshiwe kwaye buvezwe kwizinto ezisisiseko. Ukuba kunjalo, qhagamshelana nomthengisi kwangethuba, kwaye wenze unyango olufanelekileyo ngokweyona meko.

2. I-laminate ye-copper clad ikhutshwe ngexesha lokuvula. Isizathu esiphambili kukuba kukho izinto ezibukhali ezinzima kwitafile yesivuli. I-laminate ye-copper clad kunye nezinto ezibukhali zixubha kwizinto ezibukhali ngexesha lokuvula, okubangela ukuba i-foil yobhedu ikhutshwe kwaye yenze i-phenomenon ye-substrate ebonakalayo. Itafile kufuneka icocwe ngononophelo phambi kokusikwa ukuqinisekisa ukuba itafile igudile kwaye ayinazinto eziqinileyo nezibukhali.

3. I-laminate ye-copper clad yakrwelwa ngumbhobho wokubhobhoza ngexesha lokomba. Esona sizathu yayikukuba umbhobho we-spindle clamp wawunxitywe, okanye kukho inkunkuma kwi-clamp nozzle engacocwanga, kwaye i-drill nozzle ayizange ibambeke ngokuqinileyo, kwaye i-drill nozzle yayingekho phezulu. Ubude bombhobho we-drill bubude kancinane, kwaye ukuphakama kokuphakamisa akwanele xa ubhobhoza. Xa isixhobo somatshini sihamba, i-nozzle ye-drill ikrwela i-foil yobhedu kwaye yenza i-phenomenon yokutyhila izinto ezisisiseko.

a. I-chuck inokutshintshwa ngenani lamaxesha abhalwe ngemela okanye ngokweqondo lokunxiba kwe-chuck;

b. Coca i-chuck rhoqo ngokwemigaqo yokusebenza ukuqinisekisa ukuba akukho nkunkuma kwi-chuck.

4. Scratched due to improper operation after copper sinking and full plate electroplating: When storing boards after copper sinking or full plate electroplating, the weight is not light when the plates are stacked together and then put down. , The board angle is downward and there is a gravitational acceleration, forming a strong impact force to hit the board surface, causing the board surface to scratch the exposed substrate.

5. Ibhodi yemveliso iyakrwelwa xa idlula kumatshini wokulinganisa:

a. I-baffle ye-plate grinder ngamanye amaxesha ichukumisa umphezulu webhodi, kwaye umda we-baffle awulingani kwaye into iphakanyisiwe, kwaye ubuso bebhodi buhlanjululwe xa udlula ibhodi;

b. I-shaft ye-stainless steel drive shaft yonakaliswe kwinto ebukhali, kwaye indawo yobhedu iyatshitshiswa xa idlula ibhodi kunye nesiseko sezinto ezibonakalayo.

Ukudibanisa, ngenxa yesiganeko sokukrazula kunye nokutyhila i-substrate emva kokucwiliswa kobhedu, kulula ukugweba ukuba umgca ubonakaliswe ngendlela yesiphaluka evulekileyo okanye i-gap yomgca; ukuba kukukrwela kunye nokuveza i-substrate ngaphambi kokutshona kobhedu, kulula ukugweba. Xa kumgca, emva kokucwiliswa kobhedu, uluhlu lobhedu lufakwe, kwaye ubukhulu be-foil yobhedu yomgca buyancipha ngokucacileyo. Kunzima ukufumanisa uvavanyo oluvulekileyo kunye nolufutshane lwesekethe kamva, ukwenzela ukuba umthengi angakwazi ukujamelana nayo kakhulu xa eyisebenzisa. Isekethe itshiswe ngenxa yombane ophezulu, iingxaki ezinobulunga obunokubakho kunye nelahleko yezoqoqosho ekhoyo inkulu kakhulu.

Two, non-porous opening

1. Ubhedu oluntywiliselwayo alunabhobhozo;

2. Kukho ioli emngxunyeni ukuyenza ingabi yi-porous;

3. Ukugqithiswa kwe-micro-etching kubangela i-non-porosity;

4. I-electroplating embi ibangela ukuba i-non-porous;

5. Drill hole burned or dust plugged the hole to cause non-porous;

Phuculo

1. Ubhedu oluntywiliselwayo alunambobo:

a. I-Porosity ebangelwa yi-pore modifier: kungenxa yokungalingani okanye ukungaphumeleli koxinzelelo lweekhemikhali ze-pore modifier. Umsebenzi we-pore modifier kukulungelelanisa iimpawu zombane ze-insulating substrate kwindonga ye-pore ukuququzelela i-adsorption elandelayo ye-ion palladium kunye nokuqinisekisa iikhemikhali Ukugubungela ubhedu kugqityiwe. Ukuba i-chemical concentration ye-porogen ayilingani okanye iyasilela, iya kukhokelela ekubeni i-non-porosity.

b. Activator: izithako eziphambili pd, organic acid, stannous ion kunye chloride. Ukuze ufake i-palladium yensimbi ngokufanayo eludongeni lomngxuma, kuyimfuneko ukulawula iiparitha ezahlukeneyo ukuhlangabezana neemfuno. Thatha i-activator yethu yangoku njengomzekelo:

① Ubushushu bulawulwa kwi-35-44 ° C. Xa iqondo lokushisa liphantsi, ukuxinana kwe-palladium deposition akwanelanga, okubangelwa ukugubungela ubhedu lweekhemikhali ezingaphelelanga; xa ubushushu buphezulu, impendulo ikhawuleza kakhulu kwaye ixabiso lezinto eziphathekayo liyanda.

② Ukulawulwa koxinzelelo kunye nombala ngu-80% -100%. Ukuba i-concentration iphantsi, ukuxinana kwe-palladium efakwe kuyo akwanele.

Ukhuselo lweekhemikhali zobhedu aluphelelanga; iphezulu yoxinaniso, iphezulu indleko yezinto eziphathekayo ngenxa yokusabela ngokukhawuleza.

c. I-accelerator: Inxalenye ephambili yi-asidi ephilayo, esetyenziselwa ukususa i-stannous kunye ne-chloride ion ikhompawundi ezifakwe kudonga lwe-pore, eveza i-catalytic metal palladium kwiimpendulo ezilandelayo. I-accelerator esiyisebenzisayo ngoku ine-chemical concentration ye-0.35-0.50N. Ukuba i-concentration iphezulu, i-palladium yensimbi iya kususwa, kubangele ukugubungela ubhedu lweekhemikhali ezingaphelelanga. Ukuba i-concentration iphantsi, umphumo wokukhupha i-stannous kunye ne-chloride ion compounds efakwe kwi-pore wall ayilungile, okubangelwa ukugubungela ubhedu lweekhemikhali ezingaphelelanga.

2. There is wet film oil remaining in the hole causing non-porosity:

a. Xa isikrini siprinta ifilimu emanzi, printa ibhodi kwaye ukhuhle ezantsi kwesikrini kube kanye ukuqinisekisa ukuba akukho mfumba wamafutha ezantsi kwesikrini, kwaye akuyi kubakho intsalela yeoli yefilimu emanzi emngxunyeni phantsi kweemeko eziqhelekileyo.

b. Isikrini se-68-77T sisetyenziselwa ukushicilelwa kwesikrini sefilimu emanzi. Ukuba isikrini esingalunganga sisetyenzisiweyo, njenge-≤51T, ioli yefilimu emanzi inokuvuza emngxunyeni, kwaye ioli emngxunyeni ayinakuphuhliswa ngokucocekileyo ngexesha lophuhliso. Ngamanye amaxesha, i-metal layer ayiyi kuhlanjululwa, ibangele i-non-porous. Ukuba i-mesh iphezulu, kunokwenzeka ukuba ngenxa yobuninzi be-inki eyaneleyo, ifilimu ye-anti-coating yaphulwa ngoku ngexesha lokufakwa kwe-electroplating, ibangela amanqaku amaninzi esinyithi phakathi kweesekethe okanye iisekethe ezimfutshane.

Isithathu, indawo esisigxina yesekethe evulekileyo

1. Isekethe evulekileyo ebangelwa yimikrwelo kumgca wefilimu ochaseneyo;

2. Kukho i-trachoma kumgca wefilimu ochaseneyo obangela isiphaluka esivulekileyo;

Phucula iindlela

1. Imikrwelo kumgca wefilimu wolungelelaniso ibangela ukuba isekethe evulekileyo, kwaye umphezulu wefilimu uxutywe kumgangatho webhodi okanye udoti ukukrwela umgca wefilimu, obangela ukuhanjiswa kokukhanya. Emva kokuphuhliswa, umgca we-scratch yefilimu uphinde uhlanganiswe yi-inki, ebangela i-electroplating Xa uxhathisa i-plating, isiphaluka sichithwa kwaye sivulwe ngexesha lokudibanisa.

2. Kukho i-trachoma kumgca wendawo yefilimu ngexesha lokulungelelaniswa, kwaye umgca kwi-trachoma yefilimu usagqunywe yi-inki emva kokuphuhliswa, okubangelwa ukuchasana nokufakwa ngexesha le-electroplating, kwaye umgca uyachithwa kwaye uvulwe ngexesha lokubetha.

Ezine, anti-plating evulekileyo isiphaluka

1. Ifilimu eyomileyo iphukile kwaye ifakwe kwisiphaluka ngexesha lophuhliso, ibangela isiphaluka esivulekileyo;

2. I-Ink ifakwe kumphezulu wesekethe ukuze ibangele isekethe evulekileyo;

Phucula iindlela

1. Vula isiphaluka esibangelwa yifilimu eyomileyo eyaphukileyo eqhotyoshelwe kumgca:

a. “Imingxuma yokubhoboza” kunye “nemingxuma yokushicilela isikrini” kumda wefilimu okanye ifilimu ayivalwanga ngokupheleleyo ngetape yokuthintela ukukhanya. Ifilimu eyomileyo emaphethelweni ebhodi iphiliswa ngokukhanya ngexesha lokuvezwa kwaye iba yifilimu eyomileyo ngexesha lophuhliso. Amaqhekeza awela kumthuthukisi okanye itanki yokuhlamba amanzi, kwaye iinqununu zefilimu ezomileyo zihambelana nesekethe kwindawo yebhodi ngexesha lokudlula kwebhodi elandelayo. Ziyakwazi ukumelana nokubethelwa ngexesha le-electroplating kwaye zenze isiphaluka esivulekileyo emva kokuba ifilimu isusiwe kwaye ifakwe.

b. Imingxuma engeyiyo isinyithi egqunywe ngefilimu eyomileyo. Ngethuba lophuhliso, ngenxa yoxinzelelo olugqithisileyo okanye ukunamathela okunganeleyo, ifilimu eyomileyo efihliweyo emgodini iphukile ibe ngamaqhekeza kwaye iphoswe kumthuthukisi okanye itanki yokuhlamba amanzi. Iziqwenga zefilimu ezomileyo zifakwe kwisekethe, echasene ne-plating ngexesha le-electroplating, kwaye yenza isiphaluka esivulekileyo emva kokuba ifilimu isuswe kwaye ifakwe.

2. Kukho i-inki eqhotyoshelwe kumphezulu wesekethe ukwenza isekethe evulekileyo. Esona sizathu siphambili kukuba i-inki ayibhakwanga kwangaphambili okanye isixa seinki kumphuhlisi sininzi kakhulu. Ifakwe kumgca ngexesha lokudlula kwebhodi elandelayo, kwaye ixhatshazwa kwi-plating ngexesha le-electroplating, kwaye isiphaluka esivulekileyo senziwe emva kokuba ifilimu isuswe kwaye ifakwe.