PCB (buga kewaye hukumar) za a iya raba shi cikin PCB mai ƙarfi da PCB mai sassauƙa, tsohon za a iya raba shi zuwa nau’ikan uku: PCB mai gefe ɗaya, PCB mai gefe biyu, da PCB mai ɗimbin yawa. PCBS can be divided into three quality grades based on quality grade: Class 1, Class 2, and Class 3, with 3 of these having the highest requirements. Bambance -bambancen a cikin matakan ingancin PCB suna haifar da bambance -bambance a cikin sarkakiya da gwaji da hanyoyin dubawa. Ya zuwa yanzu, tsayayyun bangarorin PCBS masu ɗimbin yawa don lissafin adadi mai yawa na samfuran lantarki, kuma wani lokacin ana amfani da PCBS mai sauƙi a wasu yanayi. Therefore, this paper will focus on the quality inspection of rigid double-sided and multi-layer PCBs. After the PCB is manufactured, it must be inspected to determine whether the quality is compatible with the design requirements. It can be considered that quality inspection is an important guarantee of product quality and the smooth implementation of subsequent procedures.

Matsayi na dubawa

PCB inspection standards mainly include the following aspects:

A. Matakan da kowace ƙasa ta kafa;

B. Matsayin soja na kowace ƙasa;

C. Matsayin masana’antu kamar SJ/T10309;

D. PCB inspection instructions formulated by equipment supplier;

E. Buƙatun fasaha da aka yiwa alama akan zane zane na PCB.

For PCBS that have been identified as keyboards in equipment, these key characteristic parameters and indicators must be centralized and checked from the head, in addition to regular inspection. Zuwa yatsun kafa.

Abubuwan dubawa

Ko da wane nau’in PCB, dole ne su sha irin wannan hanyoyin dubawa da abubuwa masu inganci. Dangane da hanyar dubawa, abubuwan dubawa masu inganci galibi sun haɗa da dubawa na gani, duba aikin lantarki gaba ɗaya, duba aikin fasaha gabaɗaya, da dubawa na daidaitawa.

• Binciken gani

Binciken gani yana da sauƙi tare da taimakon mai mulki, vernier caliper, ko gilashin ƙara girma. Binciken ya haɗa da:

A. kauri farantin, kaurin farfajiya, da yaƙin.

B. Bayyanar girma da girman taro, musamman girman taro wanda ya dace da masu haɗin wutar lantarki da hanyoyin jagora.

C. Mutunci da tsarkin tsarin gudanar da aiki da kasancewar gadar gajeru, burar bura, ko ɓoyayyiya.

D. Ingancin farfajiya, kasancewar ramuka, karce, ko ramuka a kan alamar da aka buga ko kushin. Location of pad holes and other holes. Yakamata a bincika ramukan don ɓacewa ko kuskure, ramin ramin ya cika buƙatun ƙira, da nodules da ɓoyayye.

F. Pad quality and firmness, roughness, brightness, and clearance of raised defects.

G. Ingancin sutura. The coating flux is uniform and firm, the position is correct, the flux is uniform, and the color meets the requirements.

H. Ingancin halayen, kamar ko suna da ƙarfi, masu tsabta, kuma masu tsabta, ba tare da fashewa ba, shiga ciki, ko karyewa.

• Gaba ɗaya aikin duba wutar lantarki

Akwai gwaje -gwaje guda biyu a ƙarƙashin wannan nau’in jarrabawa:

A. Connection performance test. In this test, a multimeter is typically used to check the connectivity of conductive patterns through the focused metalized through holes of double-sided PCBS and the connectivity of multi-layer PCBS. Don wannan gwajin, PCBCart yana ba da cikakken bincike akan kowane PCB da aka ƙera kafin ya bar shagonsa don tabbatar da cewa ayyukansa na asali sun cika.

B. An tsara wannan gwajin don bincika juriya na ruɗar jirgi ɗaya ko tsakanin jirage daban -daban don tabbatar da aikin rufin PCB.

• Binciken fasaha na gaba ɗaya

General technical inspection includes weldability and electroplating adhesion inspection. Ga na baya, duba dusar ƙanƙara na mai siyarwa zuwa tsarin gudanarwa. For the latter, it can be checked by qualified tips that are first glued to the plating surface to be examined and then quickly pulled out after being pressed evenly. Na gaba, yakamata a kula da jirgin saman plating don tabbatar da cewa peeling yana faruwa. Bugu da ƙari, ana iya zaɓar wasu cakukku gwargwadon ainihin halin da ake ciki, kamar ƙarfin faɗuwar ƙarfe na jan ƙarfe da ƙarfin ƙarfafawa.

• Karfe ƙarfe ta hanyar dubawa

Ingancin ramukan da aka ƙera suna taka muhimmiyar rawa a cikin PCB mai gefe biyu da PCB mai yawa. Adadi mai yawa na gazawar na’urorin lantarki har ma da dukkan kayan aikin saboda ingancin ramukan da aka ƙera. Therefore, it is necessary to pay more attention to the inspection of metalized holes. Binciken Metallization ya haɗa da fannoni masu zuwa:

A. Jirgin ƙarfe na bangon ramin ya zama cikakke kuma mai santsi, ba tare da ɓata ko nodule ba.

B. Za a bincika kaddarorin lantarki gwargwadon gajeriyar hanya da buɗe kushin da juriya tsakanin ramin da gubar ta hanyar ƙarfewar jirgin saman. After environmental testing, the resistance change rate of the through-hole should not exceed 5% to 10%. Mechanical strength refers to the bonding strength between the metalized through-hole and pad. Gwajin bincike na Metallographic yana da alhakin bincika ingancin falon farantin, kauri da daidaiton farfajiyar, da ƙarfin haɗin gwiwa tsakanin farfaɗo da farantin jan ƙarfe.

Ana duba haɗin ƙarfe tare da dubawa na gani da dubawa na inji. Binciken gani shine don lura cewa an sanya PCB a ƙarƙashin haske kuma cikakken bangon rami mai haske yana nuna haske daidai. Koyaya, wucewa ta bangon da ke ɗauke da nodules ko ramuka ba zai yi haske ba. Don samar da taro, yakamata a gudanar da bincike ta kayan gwajin kan layi kamar mai gwajin allurar tashi.

Saboda hadaddun tsarin PCB mai yawa, yana da wahala a gano kurakuran da sauri da zarar matsaloli sun faru a cikin gwaje-gwajen haɗaɗɗen ƙungiya na gaba. Sabili da haka, bincika ingancinsa da amincinsa dole ne ya kasance mai tsananin ƙarfi. Baya ga abubuwan dubawa na yau da kullun na sama, sauran abubuwan dubawa sun haɗa da sigogi masu zuwa: juriya mai jagora, juriya ta cikin rami, gajeriyar gajeriyar hanya, da buɗewa, juriya ta ruɓewa tsakanin wayoyi, ƙarfin haɗaɗɗen jirgin sama, adhesion, juriya mai ɗorewar zafi, juriya na tasiri, tasirin inji, ƙarfin yanzu, da dai sauransu. Dole ne a sami kowane mai nuna alama ta hanyar aikace -aikacen kayan aiki na musamman da hanyoyin.