PCB (papan sirkuit cetak) bisa dipérang dadi PCB kaku lan PCB fleksibel, sing tilas bisa dipérang dadi telung jinis: PCB sisi siji, PCB sisi loro, lan PCB multi-lapisan. PCBS can be divided into three quality grades based on quality grade: Class 1, Class 2, and Class 3, with 3 of these having the highest requirements. Bentenipun level kualitas PCB nyebabake beda ing kompleksitas lan metode tes lan inspeksi. Nganti saiki, PCBS kaku loro-sisi lan multi-lapisan kaku kanggo aplikasi sing akeh banget ing produk elektronik, lan kadang PCBS fleksibel digunakake ing kahanan tartamtu. Therefore, this paper will focus on the quality inspection of rigid double-sided and multi-layer PCBs. Sawise PCB diproduksi, kudu dipriksa kanggo nemtokake manawa kualitas kasebut cocog karo syarat desain. It can be considered that quality inspection is an important guarantee of product quality and the smooth implementation of subsequent procedures.

Standar inspeksi

PCB inspection standards mainly include the following aspects:

A. Standar sing ditemtokake dening saben negara;

B. Standar militer kanggo saben negara;

C. Standar industri kayata SJ / T10309;

D. PCB inspection instructions formulated by equipment supplier;

E. Syarat teknis ditandhani ing gambar desain PCB.

For PCBS that have been identified as keyboards in equipment, these key characteristic parameters and indicators must be centralized and checked from the head, in addition to regular inspection. Kanggo driji sikil.

Barang pamriksan

Ora preduli saka jinis PCB, dheweke kudu ngalami cara lan barang pamriksa kualitas sing padha. Miturut cara inspeksi, barang pamriksa kualitas biasane kalebu inspeksi visual, inspeksi kinerja listrik umum, inspeksi kinerja teknis umum, lan inspeksi metalisasi.

• inspeksi visual

Pamriksa visual gampang kanthi pitulung panguasa, kaliper vernier, utawa kaca pembesar. Pengawasan kalebu:

A. kekandelan piring, atose lumahing, lan warpage.

B. Dimensi tampilan lan perakitan, utamane dimensi perakitan sing kompatibel karo konektor listrik lan rel pandhuan.

C. Integritas lan kejelasan pola konduktif lan anane bridging cendhak, burr open, utawa batal.

D. Kualitas permukaan, ana jugangan, goresan, utawa pinholes ing tilak utawa bantalan sing dicithak. Location of pad holes and other holes. Bolongan kudu dicenthang kanggo dock sing ilang utawa ora bener, diameter bolongan cocog karo syarat desain, lan nodul lan rongga.

F. Pad quality and firmness, roughness, brightness, and clearance of raised defects.

G. Kualitas lapisan. The coating flux is uniform and firm, the position is correct, the flux is uniform, and the color meets the requirements.

H. Kualitas karakter, kayata kuwat, resik, lan resik, tanpa goresan, penetrasi, utawa istirahat.

• Pemeriksaan kinerja listrik umum

Ana rong tes ing jinis ujian iki:

A. Connection performance test. Ing tes iki, multimeter biasane digunakake kanggo mriksa konektivitas pola konduktif liwat metalisasi fokus liwat bolongan PCBS sisi loro lan konektivitas PCBS multi-lapisan. Kanggo tes iki, PCBCart nyedhiyakake pamriksan umum ing saben PCB pabrik sadurunge ninggalake gudang kanggo mesthekake yen fungsi dhasar kasebut bisa kawujud.

B. Tes iki dirancang kanggo mriksa resistensi isolasi pesawat sing padha utawa ing antarane pesawat sing beda kanggo mesthekake kinerja insulasi PCB.

• Pemeriksaan teknis umum

General technical inspection includes weldability and electroplating adhesion inspection. Kanggo sing tilas, priksa kemampuan mbukak solder menyang pola konduktif. For the latter, it can be checked by qualified tips that are first glued to the plating surface to be examined and then quickly pulled out after being pressed evenly. Sabanjure, bidang plating kudu diamati kanggo mesthekake yen peeling ana. Kajaba iku, sawetara cek bisa dipilih miturut kahanan sing nyata, kayata kekuatan tembaga foil tembaga lan kekuatan anti-tarik logam.

• Metallisasi liwat pengawasan

Kualitas bolongan logam minangka peran penting ing PCB kanthi sisi loro lan PCB multi-lapisan. Gagal akeh modul listrik lan uga kabeh peralatan amarga kualitas bolongan sing di logam. Therefore, it is necessary to pay more attention to the inspection of metalized holes. Inspeksi metallisasi kalebu aspek ing ngisor iki:

A. Pesawat logam tembok liwat-bolongan kudu lengkap lan lancar, tanpa batal utawa nodul.

B. Properti listrik kudu dicenthang miturut sirkuit pad lan mbukak pad lan resistensi antarane bolongan liwat lan timbal liwat metallisasi pesawat plating. After environmental testing, the resistance change rate of the through-hole should not exceed 5% to 10%. Mechanical strength refers to the bonding strength between the metalized through-hole and pad. Tes analisis metalografi tanggung jawab kanggo mriksa kualitas permukaan plating, kekandelan lan keseragaman permukaan plating, lan kekuatan ikatan antarane permukaan plating lan foil tembaga.

Inspeksi metallisasi biasane digabung karo inspeksi visual lan inspeksi mekanik. Pamriksa visual yaiku supaya PCB dilebokake ing cahya lan tembok liwat bolongan sing lancar bisa ditampilake kanthi rata. Nanging, ngliwati tembok sing ngemot nodul utawa void ora bakal padhang banget. Kanggo produksi massal, inspeksi kudu ditindakake kanthi alat uji coba online kayata tester jarum mabur.

Amarga struktur kompleks PCB multi-lapisan, angel nemokake kesalahan kanthi cepet yen ana masalah nalika tes unit modul sabanjure. Mula, mriksa kualitas lan keandalane kudu ketat banget. Saliyane item inspeksi rutin ing ndhuwur, item inspeksi liyane kalebu parameter ing ngisor iki: resistensi konduktor, resistensi liwat bolongan logam, sirkuit cendhak njero, lan sirkuit terbuka, resistensi isolasi ing antarane kabel, kekuatan ikatan pesawat elektroflasi, adhesi, resistensi kejut termal, resistensi dampak, dampak mekanik, kekuwatan saiki, lsp. Saben indikator kudu dipikolehi liwat aplikasi alat lan metode khusus.