PCB nge-plug hole

Ukuhamba ngomngxuma kukwabizwa ngokuba ngumngxunya. Ukuze kuhlangatyezwane neemfuno zabaxumi, umngxuma webhodi yesekethe kufuneka uzitsaliwe. Emva kokuziqhelanisa okuninzi, inkqubo ye-aluminium yemingxunya itshintshiwe, kwaye i-welding yokumelana kunye nomngxunya weplagi webhodi yesekethe igqityiwe ngombala omhlophe. Imveliso ezinzileyo kunye nomgangatho onokuthenjwa.

Ukuhamba ngomngxuma kudlala indima ekunxibelelaneni nasekuqhubeni iisekethe. Ukuphuhliswa kwemveliso ye-elektroniki kukwakhuthaza uphuhliso lwe-PCB, kwaye kubeka phambili iimfuno eziphezulu zenkqubo yokuvelisa ye-PCB kunye netekhnoloji yokuphakama komphezulu. Inkqubo yokufaka ipulagi yaqala ukubakho kwaye kufuneka ihlangabezane nezi mfuno zilandelayo:

（1, Ukuba kukho ubhedu emngxunyeni, inokufakwa ngaphandle kwentsimbi yokumelana;

（2） Kufuneka kubekhona inkcenkce ekhokelela emngxunyeni, enemfuneko ethile yokujiya (4 microns), kwaye akukho solder iyamelana ne-inki eya kungena emngxunyeni, ibangele ubuhlalu be-tin emngxunyeni;

Hole 3） Umngxuma kufuneka udibanise i-solder uxhathise umngxunya we-inki, opaque, kwaye awuyi kuba ne-tin ring, i-tin bead, flatness kunye nezinye iimfuno.

Nophuhliso iimveliso elektroniki kwicala “ukukhanya, ezingcakacileyo, ezimfutshane kunye ezincinane”, PCB kwakhona ukuphuhlisa ezixineneyo kunye nobunzima eliphezulu. Ke ngoko, kukho inani elikhulu lee-PCB ze-SMT kunye ne-BGA, kwaye abathengi bafuna imingxunya yeplagi xa kufakwa izinto, ikakhulu ezinemisebenzi emihlanu:

（1, Thintela isekethe emfutshane ebangelwe kukungena kwetyin ngapha kwendawo yomngxunya ukusuka kumngxunya ngethuba le-PCB ngaphezulu kokujijwa kweglasi; Ngokukodwa, xa sibeka i-via kwi-BGA pad, kufuneka siqale senze umngxunya weplagi kwaye emva koko igolide isaleke ukuhambisa i-BGA welding.

） 2） Phepha intsalela yokubhobhoza emngxunyeni;

（3, Emva konyusa umphezulu kunye necandelo lendibano yefektri ye-elektroniki egqityiweyo, i-PCB kufuneka ifunxe isithuba kumvavanyi ukwenza uxinzelelo olubi:

（4, Thintela umphezulu we-solder unamathele ungangeni kumngxunya, okukhokelela kwinyango engeyiyo kwaye ichaphazela ufakelo;

） 5, Thintela amaso e-tin ekuphumeni ngexesha lokujijiswa kwamaza, okukhokelela kwisekethe emfutshane.

Ukufezekiswa umngxunya technology iplagi umngxuma conductive

Kwipleyiti yokunyusa umphezulu, ngakumbi ukunyuka kwe-BGA kunye ne-IC, umngxunya weplagi womngxunya kufuneka ucwecwe, udibanise kwaye udibanise udibanise okanye uthabathe i-1mil, kwaye umphetho womngxunya awuyi kuba bomvu kunye netoti; Amaso e-tin agcinwa emngxunyeni. Ukuze kuhlangatyezwane neemfuno zabathengi, kukho iinkqubo ezahlukeneyo zemingxunya yeplagi emngxunyeni. Inkqubo yokuhamba yinde kakhulu kwaye inkqubo yolawulo inzima. Ioyile ihlala iwela ngexesha lokulinganisa umoya oshushu kunye novavanyo lokumelana neoyile eluhlaza; Ukuqhuma kweoyile kunye nezinye iingxaki zenzeka emva kokunyanga. Ngokweemeko zokwenyani zemveliso, iinkqubo ezahlukeneyo zomngxunya we-PCB zishwankathelwe, kwaye ukuthelekiswa okuthile kunye neenkcazo zenziwa kwinkqubo, izinto eziluncedo kunye nezinto ezingalunganga:

Qaphela: umgaqo osebenzayo wokulinganisa umoya oshushu kukusebenzisa umoya oshushu ukususa i-solder egqithisileyo kumphezulu nakwimingxunya yebhodi yesekethe eprintiweyo, kwaye i-solder eseleyo igutyungelwe ngokulinganayo kwiphedi, imigca ye-solder engathintelwanga kunye neendawo zokupakisha zomhlaba, yenye yeendlela zokuphathwa kwebhodi yesekethe eprintiweyo.

1, Plug umngxuma technology emva sokulinganisa umoya eshushu

Inkqubo flow: ipleyiti umphezulu ukumelana iwelding → Hal → plug umngxuma → ephilisa. Inkqubo yomngxunya ongasetyenziswanga yemveliso yamkelwe kwimveliso. Emva kokulinganisa umoya oshushu, iscreen sealuminium ipleyiti okanye inki isetyenziselwa ukugcwalisa imingxunya yemingxunya yeplagi yazo zonke iinqaba ezifunwa ngabathengi. Le-inki umngxuma iplagi kunokuba inki photosensitive okanye inki thermosetting. Ngaphantsi kwemeko yokuqinisekisa ukungqinelana kombala wefilimu emanzi, inki yomngxunya weplagi kufuneka isebenzise i-inki efanayo nomphezulu wepleyiti. Le nkqubo inokuqinisekisa ukuba umngxuma awuyi kuwisa ioyile emva kokulinganisa umoya oshushu, kodwa kulula ukwenza i-ink umngxunya we-plug ungcolise umphezulu weplate kwaye ungalingani. Abathengi kulula ukwenza i-soldering engeyiyo ngexesha lokunyuka (ngakumbi kwi-BGA). Ke ngoko, abathengi abaninzi abayamkeli le ndlela.

2, umoya eshushu sokulinganisa ngaphambili plug umngxuma technology

2.1 Sebenzisa iphepha lealuminium ukufaka imingxunya, ukuqinisa kunye nokusila iipleyiti, emva koko udlulise imizobo

Kule nkqubo, kusetyenziswa umatshini we-CNC wokugrumba iphepha le-aluminium ukuze ifakwe, yenze ikhusi, kwaye uyivale umngxunya ukuqinisekisa ukuba umngxunya we-plug we-hole ugcwele, uyinki yomngxunya we-plug, uyinki yomngxunya we-plug, kunye ne-thermosetting i-ink ingasetyenziswa. Kufuneka ibonakaliswe ngobulukhuni obukhulu, utshintsho oluncinci lwe-resin shrinkage kunye nokubambelela okuhle kunye nodonga lomngxunya. Le nkqubo yinkqubo: pretreatment → umngxuma iplagi → ipleyiti besila → transfer ipateni → ngasekhohlo → ipleyiti umphezulu ukumelana iwelding

This method can ensure that the plug hole of the through hole is flat and the hot air leveling will not have quality problems such as oil explosion and oil drop at the hole edge. However, this process requires one-time thickening of copper to make the copper thickness of the hole wall meet the customer’s standard. Therefore, it has high requirements for the copper plating of the whole plate and the performance of the plate grinder to ensure that the resin on the copper surface is completely removed and the copper surface is clean and not polluted. Many PCB factories do not have a one-time copper thickening process, and the performance of the equipment can not meet the requirements, resulting in little use of this process in PCB factories.

2.2 vala umngxuma ngephepha lealuminium kwaye emva koko ujonge ngqo kumgangatho wepleyiti yokunyusa ukunganyangeki

Kule nkqubo, kusetyenziswa umatshini we-CNC wokugrumba kusetyenziswa iphepha lealuminium ukuze ifakwe kwipleyiti yescreen, efakwe kumatshini wokuprinta kwesikrini wokufaka. Emva kokuba iplagi igqityiwe, ayiyi kupakwa ngaphezulu kwemizuzu engama-30, kwaye isikrini se-36t sisetyenziselwa ukukrola ngokuthe ngqo umphezulu weplate yentsimbi yokumelana. Inkqubo yokuhamba yile: unyango lwangaphambili-iplagi-ukuprinta kwescreen-ukomisa kwangaphambili-ukubhengeza-Ukuphucula-ukunyanga

Le nkqubo inokuqinisekisa ukuba isiciko seoyile somngxuma silungile, umngxunya weplagi ucabalele, kwaye umbala wefilimu emanzi uyahambelana. Emva kokulinganisa umoya oshushu, inokuqinisekisa ukuba akukho zinki emngxunyeni kwaye akukho mabhiya e-tin afihliweyo emngxunyeni, kodwa kulula ukwenza iphedi ye-solder kwi-inki emngxunyeni emva kokunyanga, okukhokelela kukungabinakho ukuthengiswa kakuhle; Emva kokulinganisa umoya oshushu, emaphethelweni emigodi kunye nokuwisa ioyile. Kunzima ukulawula imveliso ngale ndlela yenkqubo. Inkqubo yeenjineli kufuneka zamkele iinkqubo ezizodwa kunye neeparitha ukuqinisekisa umgangatho womngxunya weplagi.

2.3 conduct plate surface resistance welding after aluminum sheet plug hole, development, pre curing and grinding.

Iphepha lealuminium elifuna umngxunya weplagi liya kugrunjwa ngomatshini wokugrumba we-NC ukwenza ipleyiti yescreen, kwaye ifakelwe kumatshini wokushicilela weshifti womngxunya weplagi. Umngxunya weplagi kufuneka ugcwale kwaye uphume macala omabini kukhethwe. Emva kokuphilisa, ipleyiti yokugaya iya kuba phantsi kwepleyiti yonyango lomphezulu. Inkqubo flow: pretreatment – iplagi umngxuma – pre-yokomisa-Development – pre ephilisa-ipleyiti umphezulu ukumelana welding

Ngenxa yokuba le nkqubo yamkela ukuqiniswa komngxunya weplagi, inokuqinisekisa ukuba akukho kulahla kweoyile kunye nokuqhushumba kweoyile kwi-Hal emva kweHal, kodwa kunzima ukusombulula ngokupheleleyo i-tin kwi-tin ubuhlalu nakwimingxunya emva kweHal, abathengi abaninzi Ungayamkeli.

I-2.4 iplati yomgangatho wokumelana nomhlaba kunye nomngxunya weplagi uya kugqitywa ngaxeshanye.

This method uses 36t (43T) wire mesh, which is installed on the screen printing machine, and uses a backing plate or nail bed to plug all through holes while completing the plate surface. The process flow is: pretreatment – screen printing – pre drying – exposure – Development – curing.

Le nkqubo inezibonelelo zexesha elifutshane kunye nenqanaba lokusetyenziswa okuphezulu kwezixhobo, ezinokuqinisekisa ukuba akukho lahleko yeoyile kumngxunya nakwitoti emngxunyeni emva kokulinganisa umoya oshushu. Nangona kunjalo, ngenxa yokusetyenziswa kwesikrini sokushicilela kwesilika kumngxunya weplagi, kukho umoya omninzi emngxunyeni. Ngexesha lokuqiniswa, umoya uyanda kwaye uqhekeze ngefilimu emelana ne-solder, ekhokelela kwimingxunya kunye nokungalingani. Kuya kubakho isixa esincinci setoti emngxunyeni emva kokulinganisa umoya oshushu. Okwangoku, emva kwenani elikhulu lokulinga, inkampani yethu isombulule ingxaki yokungena komngxunya kunye nokungalingani ngokukhetha iintlobo ezahlukeneyo ze-inki kunye ne-viscosity kunye nokulungelelanisa uxinzelelo loshicilelo lwesilika. Le nkqubo isetyenziselwe ukuvelisa ubuninzi