Babban manufar PCB yin burodi shine deumumify da dehumidify, don cire danshi da ke ciki ko sha daga waje na PCB, saboda wasu kayan PCB suna da sauƙin ƙirƙirar ƙwayoyin ruwa.

Bugu da kari, PCBS kuma suna da damar shayar da danshi a cikin muhalli bayan an samar da su kuma an nuna su na ɗan lokaci, kuma ruwa yana ɗaya daga cikin manyan laifuffukan popcorn ko delamination. Lokacin da aka sanya PCB a cikin yanayi tare da zafin jiki sama da 100 ℃, kamar tanderun baya, tanderu mai zafi, samuwar iska mai zafi ko tsarin walda hannu, ruwa zai juya zuwa tururi da faɗaɗa ƙarar sa cikin sauri.

Da sauri PCB yana da zafi, da sauri tururin ruwa yana faɗaɗa. Mafi girman zafin jiki, mafi girman ƙarar ruwa; Lokacin da tururin ruwa ba zai iya tserewa daga PCB cikin lokaci ba, yana da kyakkyawar dama don kumbura PCB.

Musamman, hanyar Z na PCB shine mafi rauni, wani lokacin yana iya karya ta tsakanin yadudduka na PCB, wani lokacin yana iya haifar da rarrabuwa tsakanin yadudduka na PCB, har ma da bayyanar PCB ana iya ganin kumfa, faɗaɗa, fashewar jirgi da sauran abubuwan mamaki;

Wani lokaci, koda PCB bai ga abin da ke sama a farfajiya ba, a zahiri yana lalacewa a ciki. Bayan lokaci, zai haifar da rashin aikin aiki na samfuran lantarki, ko CAF da sauran matsaloli, kuma a ƙarshe zai haifar da gazawar samfur.

Haƙiƙa dalilin bincike da matakan rigakafin fashewar PCB

A zahiri, tsarin yin burodin PCB yana da matsala. Dole ne a cire fakitin na asali kafin a saka shi a cikin tanda, sannan zafin ya kamata ya wuce 100 ℃, amma zafin bai kamata ya yi yawa ba, ta yadda PCB za ta fashe saboda yawaitar tururin ruwa yayin yin burodi.

Gabaɗaya, yawanci ana saita zafin zafin burodin PCB a 120 ± 5 ℃ a cikin masana’antar don tabbatar da cewa za a iya kawar da danshi da gaske daga jikin PCB kafin a iya yin amfani da layin SMT ta cikin wutar wutar walda ta baya.

Lokacin yin burodi ya bambanta da kauri da girman PCB, kuma ga PCB tare da ɗan ƙaramin bakin ciki ko babba, yakamata a matse allon tare da nauyi mai nauyi bayan yin burodi, don ragewa ko gujewa bala’in PCB lankwasawa nakasa lalacewa ta hanyar sakin damuwa yayin PCB sanyaya bayan yin burodi.

Domin da zarar PCB ya lalace kuma ya lanƙwasa, matsalar ramawa ko kauri mara daidaituwa zai faru lokacin da aka buga manna SOLDER akan SMT, wanda zai haifar da adadi mai yawa na gajeren waldi ko walda mara komai da sauran abubuwan da ba su dace ba.

Yanayin yanayin yin burodi na PCB

At present, the general conditions and time Settings for PCB baking are as follows:

1. PCB za a rufe shi da kyau cikin watanni 2 daga ranar da aka ƙera shi. Idan ba a rufe PCB ba kuma an sanya shi a cikin yanayin sarrafa yanayin zafi (≦ 30 ℃/60%RH, bisa ga IPC-1601) sama da kwanaki 5, za a gasa shi a 120 ± 5 ℃ na awa 1 kafin a saka shi akan layi.

2. PCB za a adana fiye da watanni 2 ~ 6 bayan ranar ƙira, kuma za a gasa shi tsawon awanni 2 a 120 ± 5 ℃ kafin kan layi.

3. PCB yakamata a adana fiye da watanni 6 ~ 12, kuma a gasa shi tsawon awanni 4 a 120 ± 5 ℃ kafin ya shiga yanar gizo.

4, ajiya na PCB sama da watanni 12 na ranar ƙira, asali ba a ba da shawarar yin amfani da shi ba, saboda ƙarfin manne na allon multilayer amma zai tsufa tare da lokaci, rashin aikin samfur da sauran matsalolin inganci na iya faruwa a nan gaba, ƙara yiwuwar kasuwa gyare -gyare, da tsarin samarwa yana da fashewar jirgi da kwanon cin haɗarin haɗari. Idan dole ne ku yi amfani da shi, ana ba da shawarar yin gasa a 120 ± 5 ℃ na awanni 6, adadi mai yawa na allurar da aka riga aka buga a cikin samarwa don tabbatar da cewa babu matsala mai siyarwa kafin ci gaba da samarwa.

Wani kuma ba a ba da shawarar tsawon PCB ɗin ba saboda jiyyarsa ta ƙasa tare da lokaci kuma sannu a hankali kuma zai gaza, a cikin ENIG, rayuwar shiryayye shine watanni 12, bayan wannan lokacin, dangane da kaurin kaurin zinare mai nauyi, idan kauri mai kauri, Layer nickel na iya kasancewa saboda watsawa kuma ya bayyana a cikin zinaren zinare da samuwar oxide, yana shafar amincin, ba zai iya sani ba.

5. Dole ne a yi amfani da duk PCBS da aka gasa a cikin kwanaki 5, kuma dole ne a gasa PCBS da ba a sarrafa ta ba a 120 ± 5 ℃ na wani awa 1 kafin shiga yanar gizo.

Sarrafa PCB yayin yin burodi

1. PCB mai girma yakamata a sanya shi a kwance kuma a haɗa shi lokacin yin burodi. Ana ba da shawarar cewa matsakaicin adadin tari bai wuce guda 30 ba. Ba a ba da shawarar yin burodi a tsaye don PCB mai girma ba, mai sauƙin lanƙwasa.

2. Lokacin yin burodi PCB ƙanana da matsakaici, ana iya sanya shi a sarari kuma a ɗora, matsakaicin adadin tari bai wuce guda 40 ba, ko ana iya amfani da shi a tsaye kuma lambar ba ta da iyaka. Bayan mintuna 10 na yin burodi, ya zama dole a buɗe tanda kuma fitar da PCB kuma a kwance shi a kwance don sanyaya shi.

Bayanan kula don yin burodi na PCB

1. Zazzabin yin burodi ba zai wuce matakin Tg na PCB ba, kuma gaba ɗaya ba zai wuce 125 ℃ ba. A farkon matakin, matakin Tg na wasu PCB mai ɗauke da gubar yana da ƙarancin ƙarfi, amma yanzu Tg na yawancin PCB ba tare da gubar ba ya wuce 150 ℃.

2, bayan yin burodi PCB ya kamata a yi amfani da shi da wuri-wuri, idan ba a yi amfani da shi ba, yakamata a sake buɗe fakitin wuri-wuri. If exposed to the workshop for too long, it must be re-baked.

3, tanda ku tuna shigar da kayan bushewa na shaye -shaye, in ba haka ba za a riƙe tururin ruwa da aka gasa a cikin tanda don haɓaka ɗimbin dangi, ɓarnawar PCB mara kyau.

4. Daga mahangar inganci, sabo da mai siyar da PCB shine, mafi kyawun ingancin zai kasance bayan wucewa cikin wutar makera. PCB ɗin da ya ƙare zai sami wasu haɗarin inganci ko da ana amfani da shi bayan yin burodi.

Shawarwari don yin burodi na PCB

1. Ana ba da shawarar yin burodi PCB a 105 ± 5 long muddin tafasar ruwan ta zama 100 ℃. Muddin aka wuce wurin tafasa, ruwa zai zama tururi. Saboda PCBS ba ta ƙunshi ƙwayoyin ruwa da yawa, ba sa buƙatar yanayin zafi don haɓaka saurin iskar gas.

Zazzabi ya yi yawa ko saurin iskar gas yana da sauri, amma yana da sauƙin yin saurin faɗaɗa tururin ruwa, wanda a zahiri mara kyau ne ga ƙima, musamman ga katako mai yawa da PCB tare da ramukan da aka binne. 105 ℃ ya fi girma fiye da ruwan tafasasshen ruwa, kuma zazzabi bai yi yawa ba, wanda zai iya dehumidify da rage haɗarin hadawan abu da iskar shaka. Kuma ikon sarrafa zafin zafin rana na yau ya yi kyau sosai fiye da da.

2, KO PCB yana buƙatar yin burodi, yakamata ya duba ko kunshin yana da ɗumi, wato, don kula da fakitin VACUUM na HIC (Katin Indicator Humidity, Card Indicator Card) ya nuna danshi, idan kunshin yayi kyau, HIC yayi baya nuna damp a zahiri yana iya kasancewa kai tsaye akan layi ba tare da yin burodi ba.

3. An ba da shawarar yin amfani da “madaidaiciya” da yin burodi mai nisa don yin burodi na PCB, saboda ta wannan hanyar ne kawai iskar iska mai zafi zata iya cimma matsakaicin sakamako, kuma tururin ruwa ya fi sauƙi a gasa daga PCB. Koyaya, don girman girman PCBS, yana iya zama dole a bincika ko nau’in tsaye zai haifar da lanƙwasa farantin.

4. Ana ba da shawarar a sanya PCB a busasshiyar wuri kuma a sanyaya da sauri bayan yin burodi. Zai fi kyau a danna “anti-plate lankwasa kayan aiki” a saman allon, saboda abu gaba ɗaya yana da sauƙin ɗaukar danshi daga yanayin zafi zuwa tsarin sanyaya, amma saurin sanyaya na iya sa hukumar ta lanƙwasa, wanda yana buƙatar cimma daidaituwa.

Illolin yin burodin PCB da abubuwan da ke buƙatar la’akari

1. Yin burodi zai hanzarta yin oxidation na murfin farfajiyar PCB, kuma mafi girman zafin jiki, tsawon yin burodi ya fi muni. 2, ba a ba da shawarar yin yin burodi mai zafi a kan jirgin da aka yi wa farfajiya ta OSP, saboda fim ɗin OSP zai ƙasƙantar ko gazawa saboda tsananin zafin. Idan dole ne ku gasa, ana ba da shawarar yin gasa a 105 ± 5 ℃ fiye da awanni 2. Ana ba da shawarar yin amfani da shi a cikin awanni 24 bayan yin burodi.

3, yin burodi na iya shafar ƙarni na IMC, musamman don HASL (fesa tin), ImSn (tin tin, sinadarai na tin, dipping) jiyya na hukumar, saboda matakin IMC ɗin sa (mahaɗin tin na jan ƙarfe) a zahiri tun farkon matakin PCB yana da an ƙirƙira shi, wato, kafin GENERATION na mai siyar da PCB, yin burodi zai haɓaka kaurin wannan Layer an samar da IMC, Sanya matsalolin aminci.