Eyona njongo iphambili ye- PCB ukubhaka kukususa isidima kunye nokususa ubumdaka, ukususa ukufuma okuqulethwe okanye okufunxwe ngaphandle kwePCB, kuba ezinye izinto zePCB kulula ukwenza iimolekyuli zamanzi.

Ukongeza, i-PCBS ikwanethuba lokufunxa ukufuma kwindalo esingqongileyo emva kokuba ivelisiwe kwaye ibonisiwe kangangexesha elithile, kwaye amanzi sesinye sezona zinto ziphambili kwiipopcorn okanye kwi-delamination. Xa i-PCB ibekwe kwindawo enobushushu obungaphezulu kwe-100 ℃, enje ngeziko lokubuyela umva, iziko lokutshangatshangisa, ukubumba umoya oshushu okanye inkqubo yokuwelda ngesandla, amanzi aya kujika abe ngumphunga kwaye andise ngokukhawuleza umthamo wawo.

Ngokukhawuleza i-PCB ishushu, umphunga wamanzi uyanda. Ukuphakama kobushushu, kokukhona umthamo womsi wamanzi ukhulu; Xa umphunga wamanzi ungaphumi kwi-PCB ngexesha, unethuba elihle lokufaka i-PCB.

Ngokukodwa, ulwalathiso lwe-Z lwe-PCB lolona lusemngciphekweni, ngamanye amaxesha lunokwaphula i-phakathi kweengqimba ze-PCB, ngamanye amaxesha kunokubangela ukwahlukana phakathi kweengcamba ze-PCB, nkqu nokubonakala kwe-PCB kunokubonwa ukubhabha, ukwanda, ibhodi eqhekezayo kunye ezinye iziganeko;

Ngamanye amaxesha, nokuba i-PCB ayiyiboni le nto ingentla apha emhlabeni, yonakele ngaphakathi ngaphakathi. Ixesha elingaphezulu, liya kubangela ukungazinzi kokusebenza kweemveliso zombane, okanye i-CAF kunye nezinye iingxaki, kwaye ekugqibeleni kukhokelele ekusileleni kwemveliso.

Esona sizathu sohlalutyo kunye namanyathelo othintelo lwebhodi eqhekezayo yePCB

Ngapha koko, inkqubo yokubhaka kwe-PCB inzima kakhulu. Ukupakisha kwasekuqaleni kufuneka kususwe ngaphambi kokuba kufakwe eontini, kwaye ke ubushushu bube ngaphezulu kwe-100 ℃, kodwa iqondo lobushushu akufuneki libe phezulu kakhulu, ukuze i-PCB iqhume ngenxa yolwandiso olugqithisileyo lomphunga wamanzi ngexesha lokubhaka.

Ngokubanzi, iqondo lobushushu lokubhaka le-PCB lihlala lisetwa kwi-120 ± 5 ℃ kolu shishino ukuqinisekisa ukuba ukufuma kunokususwa emzimbeni we-PCB ngaphambi kokuba umgca we-SMT udityaniswe ngesithando somlilo sangasemva.

Ixesha lokubhaka liyahluka ngobukhulu kunye nobungakanani be-PCB, kunye ne-PCB enobunzima obucekeceke okanye obukhulu, ibhodi kufuneka icinezelwe ubunzima obunzima emva kokubhaka, ukunciphisa okanye ukunqanda intlekele yokugoba kwe-PCB okubangelwa kukhululwa ngoxinzelelo ngexesha Ukupholisa i-PCB emva kokubhaka.

Kuba xa i-PCB ikhubazekile kwaye igobile, ingxaki ye-offset okanye ubukhulu obungalinganiyo iya kwenzeka xa i-SOLDER incamathele iprintwe kwi-SMT, eya kuthi ikhokelele kwinani elikhulu lokudibanisa isekethe emfutshane okanye i-welding engenanto kunye nezinye izehlo ezimbi.

Isimo sokubhaka sePCB

At present, the general conditions and time Settings for PCB baking are as follows:

1. I-PCB iya kutywinwa kakuhle kwithuba leenyanga ezi-2 ukusukela kumhla wokwenziwa kwayo. Ukuba i-PCB ayitywinwanga kwaye ibekwe kwindawo elawula ubushushu-ukufuma (≦ 30 ℃ / 60% RH, ngokwe-IPC-1601) ngaphezulu kweentsuku ezi-5, iya kubhakwa nge-120 ± 5 ℃ ngeyure enye ngaphambi kokuba ibekwe emgceni.

2. I-PCB iya kugcinwa ngaphezulu kweenyanga ezi-2 ~ 6 emva komhla wokuvelisa, kwaye iya kubhakwa iiyure ezi-2 nge-120 ± 5 ℃ ngaphambi komnxeba.

3. I-PCB kufuneka igcinwe ngaphezulu kweenyanga ezi-6 ~ 12, kwaye yosiwe iiyure ezi-4 nge-120 ± 5 ℃ ngaphambi kokuba ihambe kwi-intanethi.

I-4, ukugcinwa kwe-PCB ngaphezulu kweenyanga ezili-12 zomhla wokuvelisa, ngokungacetyiswanga ukuba kusetyenziswe, kuba amandla okuncamathela ebhodini ye-multilayer kodwa iya kuguga ngexesha, ukungazinzi kwemveliso yemveliso kunye nezinye iingxaki zomgangatho zinokubakho kwixesha elizayo, zonyuse ukubakho kwentengiso ukulungiswa, kwaye inkqubo yemveliso ineqhushumbo ebhodini kunye ne-tin itya umngcipheko omncinci. Ukuba kufuneka usebenzise, ​​kuyacetyiswa ukubhaka nge-120 ± 5 ℃ ngeyure ezingama-6, inani elikhulu lokuncamathelisa kusengaphambili kwimveliso yokuqinisekisa ukuba akukho ngxaki ngaphambi kokuqhubeka kwemveliso.

Enye ayikhuthazwa ixesha elide kakhulu i-PCB ngenxa yomphezulu wayo onyango kunye nexesha kwaye ngokuthe ngcembe iya kuthi isilele, kwi-ENIG, ubomi beshelfu ziinyanga ezili-12, emva kweli xesha, kuxhomekeke kubunzima bayo begolide obunzima, ukuba ubukhulu bezinto Umaleko we-nickel usenokubangelwa kukusasazeka kwaye kubonakale kwangumaleko wegolide kunye nokwakheka kwe-oxide, kuchaphazela ukuthembeka, akunakuqondakala.

5. Zonke ii-PCBS ezibhakiweyo mazisetyenziswe zingaphelanga iintsuku ezintlanu, kwaye ii-PCBS ezingasetyenziswanga kufuneka zibhakwe kwi-5 ± 120 ℃ enye iyure enye ngaphambi kokuya kwi-intanethi.

Ukufumba kwePCB ngexesha lokubhaka

1.I-PCB enkulu kufuneka ibekwe ngokuthe tye kwaye ifunjwe xa kubhakwa. Kuyacetyiswa ukuba elona nani liphezulu lomfumba kufuneka lingadluli kumaqhekeza angama-30. Ukubhaka nkqo akukhuthazwa ukuba ubungakanani bePCB enkulu, kulula ukugoba.

2. Xa ubhaka i-PCB encinci naphakathi, inokubekwa ngokuthe tye kwaye ifakelwe, elona nani liphezulu lomfumba alikho ngaphezulu kwamaqhekeza angama-40, okanye inokusetyenziswa ngokuthe nkqo kwaye inani alilinganiswanga. Emva kwemizuzu eli-10 yokubhaka, kufuneka uvule i-oveni kwaye ukhuphe i-PCB kwaye uyibeke ngokuthe tye ukuyipholisa.

Amanqaku okupheka kwe-PCB

1. Iqondo lobushushu lokubhaka alinakugqitha kwinqanaba le-TG le-PCB, kwaye ngokubanzi alidluli kwi-125 ℃. Kwinqanaba lokuqala, inqaku le-Tg ye-PCB enesikhokelo yayisezantsi, kodwa ngoku i-Tg ye-PCB eninzi ngaphandle kokukhokelela ingaphezulu kwe-150 ℃.

2, emva kokubhaka i-PCB kufuneka isetyenziswe kwakamsinya, ukuba ayisetyenziswanga, kufuneka iphindwe kwakhona ngokupakisha kwangoko. Ukuba ivezwe kumasifundisane ixesha elide, kufuneka iphinde ibhakwe.

I-3, i-oveni iyakhumbula ukufaka izixhobo zokoma zeemoto, kungenjalo umphunga wamanzi obhakwe uya kugcinwa ehovini ukwandisa ukufuma kwawo, i-PCB engathandekiyo yokuchithwa.

4. Ukusuka kwindawo yokujonga umgangatho, okutsha kokuthengiswa kwe-PCB, kokukhona umgangatho uya kuba ngcono emva kokudlula eziko. I-PCB ephelelwe lixesha iya kuba nomngcipheko othile nokuba sele isetyenzisiwe emva kokubhaka.

Iingcebiso malunga nokubhaka kwe-PCB

1. Kuyacetyiswa ukubhaka i-PCB ngo-105 ± 5 ℃ okoko amanzi abilayo ayi-100 ℃. Logama indawo yokubilisa igqithile, amanzi aya kuguqulwa abe ngumphunga. Ngenxa yokuba ii-PCBS zingaqulathanga iimolekyuli zamanzi ezininzi, azidingi amaqondo obushushu aphezulu ukunyusa isantya segesi.

Iqondo lobushushu liphezulu kakhulu okanye isantya segesi sikhawuleza kakhulu, kodwa kulula ukwenza ukwanda okukhawulezayo komphunga wamanzi, okunene kubi kumgangatho, ngakumbi kwibhodi enemaleko emininzi kunye nePCB enemingxunya engcwatyelweyo. I-105 ℃ ingaphezulu nje kwendawo yokubilisa yamanzi, kwaye amaqondo obushushu awaphakamanga kakhulu, anokuhlisa isidima kunye nokunciphisa umngcipheko we-oxidation. Kwaye amandla okulawula ubushushu ehovini namhlanje abengcono kakhulu kunangaphambili.

2, NOKUBA i-PCB ifuna ukubhakwa, kufuneka ibone ukuba ukupakisha kufumile, oko kukuthi, ukugcina ukupakishwa kwe-VACUUM ye-HIC (iKhadi lesiKhombisi seHumidity, iKhadi lesalathiso seHumidity) ibonakalisile kufumile, ukuba ukupakisha kulungile, i-HIC ayenziwanga ayibonisi kufumile enyanisweni inokuba ngokuthe ngqo kwi-Intanethi ngaphandle kokubhaka.

3. Kuyacetyiswa ukuba kusetyenziswe “ukuma nkqo” kunye nokubhaka okunesithuba kwi-PCB baking, kuba kuphela ngale ndlela kuphela apho umoya omoya oshushu unokufikelela kwisiphumo esiphezulu, kwaye umphunga wamanzi kulula ukubhakwa kwi-PCB. Nangona kunjalo, ngobukhulu bePCBS obukhulu, kunokuba yimfuneko ukuqaphela ukuba ngaba uhlobo oluthe nkqo luya kubangela ukugoba kweplate.

4. Kuyacetyiswa ukuba i-PCB ibekwe kwindawo eyomileyo kwaye ipholile ngokukhawuleza emva kokubhaka. Kungcono ucofe “i-anti-plate bending fixture” ngaphezulu kwebhodi, kuba into ngokubanzi kulula ukufunxa ukufuma ukusuka kwishushu ukuya kwinkqubo yokupholisa, kodwa ukupholisa ngokukhawuleza kunokubangela ukuba ibhodi igobe, ethi kufuneka ufezekise ulungelelwaniso.

Iingxaki zokupheka kwePCB kunye nemicimbi efuna ukuqwalaselwa

1. Ukubhaka kuya kukhawulezisa i-oxidation yomphezulu we-PCB, kwaye amaqondo obushushu aphezulu, kokukhona ukubhaka kuyinto engathandekiyo. 2, ayikhuthazwa into yokubhaka kobushushu obuphezulu kwibhodi ephathwe ngomphezulu we-OSP, kuba ifilimu ye-OSP iya kuthoba okanye isilele ngenxa yeqondo lobushushu eliphezulu. Ukuba kufuneka ubhaka, kuyacetyiswa ukubhaka nge-105 ± 5 ℃ ngaphezulu kweeyure ezi-2. Kuyacetyiswa ukuba usebenzise ngaphakathi kweeyure ezingama-24 emva kokubhaka.

3, ukubhaka kunokuchaphazela ukuveliswa kwe-IMC, ngakumbi kwi-HASL (ukutshiza i-tin), i-ImSn (i-tin tin, ukutshiza i-tin) unyango lomphezulu webhodi, kuba umaleko wayo we-IMC (ubumba wekhonkco lobhedu) okunene kwangoko kwinqanaba le-PCB yenziwe, Oko kukuthi, ngaphambi kokuzalwa kwe-solder ye-PCB, ukubhaka kuya kwandisa ubukhulu balo maleko kuye kwaveliswa nge-IMC, Yenza iingxaki zokuthemba.