Kwinkqubo ye PCB ukusetyenzwa, ukusuka kwi-PCB substrate ukuya kwipatheni yesekethe yangaphakathi yokudlulisa ngokucinezela amaxesha amaninzi de kube ukuhanjiswa kwepateni yesekethe yangaphandle, i-warp kunye ne-weft yebhodi iya kwandisa kwaye iyancipha kwiindlela ezahlukeneyo. Ukusuka kuyo yonke itshati yemveliso yePCB, sinokufumanisa izizathu kunye neenkqubo ezinokubangela ukwanda okungaqhelekanga kunye nokucutheka kwamalungu ebhodi kunye nokungaguquguquki kobungakanani obungalunganga:

Uzinzo lwe-dimension ye-PCB substrate, ngakumbi ukuhambelana kwe-dimension phakathi kwe-CYCLE ye-laminating nganye yomthengisi. Nangona uzinzo lwe-dimensional ye-PCB substrate kwimijikelo eyahlukeneyo yolubalo olufanayo konke kungaphakathi kweemfuno ezichaziweyo, ukungaguquguquki okungalunganga phakathi kwabo kunokukhokelela ekunyamezeleni ubungakanani begraphic kwimveliso elandelayo yebhetshi yePCB ngenxa yomahluko phakathi iibhetshi ezahlukeneyo zebhodi emva kokuba imbuyekezo umaleko olunengqiqo lwangaphakathi imiselwe kwimveliso yolingo lwebhodi yokuqala. Kwangaxeshanye, kukho ukungahambi kakuhle kwezinto kwinkqubo yokudluliselwa kwemizobo yangaphandle kwimilo yeplate shrinkage. Kwinkqubo yemveliso, kwafumaniseka ukuba ububanzi bepaneli kunye nobude beyunithi yokuhambisa bunokuxinana okukhulu kumda wokudlulisa imizobo engaphandle, efikelela kwi-3.6mil / 10inch. Emva kophando, umlinganiso we-X-ray kunye nomfanekiso wokudlulisa ongaphandle webhetshi engaqhelekanga yamacwecwe emva kongqimba kubushushu boxinzelelo lwangaphandle bobabini bakuloluhlu lolawulo. Okwangoku, indlela ebhetele yokubeka esweni ayifumanekanga kwinkqubo yokubeka esweni.

Uyilo lwepaneli oluqhelekileyo luyalingana kwaye alunampembelelo ibonakalayo kubungakanani begraphic yePCB egqityiweyo phantsi kwemeko yokuhanjiswa kwemizobo eqhelekileyo. Nangona kunjalo, ukuze kuphuculwe izinga lokusetyenziswa kwebhodi kunye nokunciphisa iindleko, inxalenye yebhodi isebenzisa uyilo lwesakhiwo se-asymmetric, eya kuzisa impembelelo ecacileyo kakhulu ekungqinelani kwemizobo kunye nobukhulu bePCB egqityiweyo kwizabelo ezahlukeneyo. iindawo. Nkqu kwinkqubo PCB processing, sinokufumanisa ukuba ulungelelwaniso loyilo asymmetric ebhodini kunzima ukulawula nokuphucula ngaphezu ibhodi eqhelekileyo kwikhonkco ngalinye kwinkqubo yokugrumba umngxuma laser imfama kunye yangaphandle graphic transfer exposure / solder. ukumelana nokuvezwa/ushicilelo lomlinganiswa.

Imiba yenkqubo yogqithiselo lwegrafiki yangaphakathi Umaleko ongaphakathi wenkqubo yogqithiselo lomzobo idlala indima ebaluleke kakhulu ekubeni ubungakanani bebhodi yePCB egqityiweyo iyahlangabezana neemfuno zabathengi. Ukuba kukho ukutenxa okukhulu kwimbuyekezo yomlinganiselo wefilimu enikezelweyo ukudluliselwa kwemizobo yomaleko yangaphakathi, ayinakukhokelela kuphela ngokuthe ngqo kubungakanani bemizobo egqityiweyo yePCB engakwaziyo ukuhlangabezana neemfuno zomthengi, kodwa kubangele ulungelelwaniso olungaqhelekanga phakathi kwemfama yelaser. umngxuma kunye nepleyiti yokudibanisa esezantsi Ukudala ukusebenza kwe-insulation layer-to-layer Ukuhla kunye nesekethe emfutshane. Kwaye ngokusebenzisa / ukulungelelaniswa kwemingxunya engaboniyo kwinkqubo yokudlulisa imifanekiso engaphandle.

Ngokolu hlalutyo lungasentla, singathatha amanyathelo afanelekileyo okubeka iliso kunye nokuphucula okungaqhelekanga;

Ukubekw’esweni kozinzo lwe-dimension ye-PCB substrate imathiriyeli engenayo kunye nokuhambelana komlinganiselo phakathi kweebhetshi Uzinzo lwe-dimensional ye-PCB substrate ebonelelwa ngababoneleli abohlukeneyo ivavanywa rhoqo, apho umahluko wedatha ye-longitude-latitude phakathi kweebhetshi ezahlukeneyo zebhodi yobalo iyalandelwa, kwaye idatha yovavanyo lwe-substrate ye-PCB inokuhlaziywa ngeendlela ezifanelekileyo zokubala. Ngale ndlela, abathengisi abanomgangatho ozinzileyo banokufunyanwa, kwaye idatha eneenkcukacha zokukhetha abanikezeli zinokubonelelwa ngeSQE kunye nesebe lokuthenga. Ngokumalunga nokwandiswa okuqatha kunye nokucutheka kwamalungu ebhodi emva kokudluliselwa kwemizobo yangaphandle ebangelwa kukungazinzi komgangatho ombi we-PCB substrate yeebhetshi zomntu ngamnye, inokufumaneka kuphela ngomlinganiselo webhodi yokuqala kwimveliso yeemilo okanye ukuhlolwa kokuthunyelwa. . Nangona kunjalo, le yokugqibela ineemfuno eziphezulu zolawulo lweebhetshi, kwaye kulula ukuvela ipleyiti exubeneyo xa inani elithile liveliswa ngobuninzi.

Uyilo loyilo lolwakhiwo olulinganayo kufuneka lwamkelwe kangangoko kunokwenzeka ukwenza ukwandiswa kunye nokuncipha kwento nganye yokuhambisa kwibhodi yejigsaw igcine ukungaguquguquki. Ukuba kunokwenzeka, umthengi kufuneka acetyiswe ukuba avumele ukuchongwa okuthe ngqo kwendawo yeyunithi nganye yokuthunyelwa ebhodini ngokubhala / ukuchongwa komlinganiswa kumda wenkqubo yebhodi. Le ndlela ngendlela ye-asymmetric design isiphumo siyabonakala kakhulu kwiqela lenjongo, nokuba yonke imizobo ye-asymmetric yangaphakathi ibangela ubungakanani beyunithi nganye ngaphandle kokunyamezelana, nokuba kunokubangela ukuba umngxunya ongaboniyo ongaphantsi kunxibeleleke kunokuba lula kakhulu ukumisela okungaqhelekanga iiyunithi kunye nokuphatha ukuyichola phambi kokuthunyelwa, hayi ukuphuma okubangelwa kukufakwa okungaqhelekanga kwe-encapsulation kubangela isikhalazo.

3. Yenza umphindaphindeli wokuqala kwipleyiti, ngokwesayensi ukumisela ukuphinda-phinda komaleko wangaphakathi wemifanekiso yokuhambisa ipleyiti yokuqala, ngokwenzululwazi ukumisela ukuphinda-phinda ukuhanjiswa kwemizobo yangaphakathi kwimaleko yemveliso kwipleyiti yokuqala; Oku kubaluleke ngakumbi xa utshintsha ii-substrates ze-PCB okanye ii-P sheet ezivela kwabanye abathengisi ukunciphisa iindleko zemveliso. Xa kufunyaniswa ukuba ipleyiti ingaphaya koluhlu lolawulo, kufuneka iqhutywe ngokubhekiselele ekubeni umngxuma wombhobho weyunithi ukugaya okwesibini. Ukuba yinkqubo eqhubekekayo yokuqhubekeka, ipleyiti inokukhutshelwa kumaleko angaphandle ngokwendlela eyiyo kwaye idluliselwe kumlinganiso wefilimu ukuze uhlengahlengiso olufanelekileyo; Kwimeko yeepleyiti zokombiwa kwesibini, kufuneka kuthathelwe ingqalelo ekhethekileyo ekunyangeni iipleyiti ezingaqhelekanga ukuqinisekisa ubungakanani begraphic yamacwecwe agqityiweyo kunye nomgama ukusuka kwithagethi ukuya kumbhobho wombhobho (imingxunya eyombiwa yesibini); Okuqhotyoshelwe apha luluhlu lokuqala lokuqokelelwa komlinganiselo wepleyiti yeepleyiti zesibini ezilaminethiweyo. 4.Ukubeka iliso kwinkqubo yokwenza ibhodi ye-PCB ngokusebenzisa idatha ekujoliswe kuyo yangaphakathi yamacwecwe angaphandle okanye angaphandle alinganiswe ngexesha lokuveliswa kwe-X-ray yemingxunya yemibhobho yokuma kombhobho emva kokukhutshelwa ukuhlalutya ukuba ngaba kuluhlu lokulawula kwaye uthelekise nokuhambelana idatha eqokelelwe ngamacwecwe okuqala afanelekileyo ukugweba ukuba ubungakanani bamacwecwe abuqhelekanga ngokwemiqathango yokwandiswa kunye nokunciphisa; Ngokwezibalo zethiyori, i-multiplier apha kufuneka ilawulwe ngaphakathi +/-0.025% ukuhlangabezana neemfuno zobungakanani beepleyiti eziqhelekileyo.

Ngokuhlalutya oonobangela bokwandiswa kobungakanani bePCB kunye nokucutheka, sinokufumanisa iindlela ezikhoyo zokubeka iliso kunye nokuphucula, ngethemba lokuba uninzi lwabasebenzi be-PCB banokufumana impembelelo koku, kwaye bafumane isicwangciso sophuculo esilungele iinkampani zabo ngokwezabo zokwenyani. imeko.