Enqubeni ye- PCB ukucutshungulwa, kusukela ku-PCB substrate kuya ekudlulisweni kwephethini yesekethe yangaphakathi ngokusebenzisa izikhathi eziningana zokucindezela kuze kube ukudluliswa kwephethini yesifunda sangaphandle, i-warp ne-weft yebhodi izokhula futhi inciphe ngezindlela ezihlukene. Kusuka kulo lonke ishadi lokugeleza kokukhiqiza le-PCB, singathola izizathu nezinqubo ezingabangela ukwanda okungavamile kanye nokuncipha kwezingxenye zebhodi kanye nokungaguquguquki kosayizi okungekuhle:

Ukuzinza kobukhulu be-substrate ye-PCB, ikakhulukazi ukungaguquguquki kobukhulu phakathi kwe-CYCLE ye-laminating ngayinye yomphakeli. Noma ukuzinza kobukhulu be-substrate ye-PCB kumijikelezo ehlukile yesicaciso esifanayo konke kungaphakathi kwezidingo zokucaciswa, ukungaguquguquki okubi phakathi kwabo kungaholela ekuphumeni kokubekezelelana kosayizi ocacile wokukhiqizwa kwe-batch elandelayo ye-PCB ngenxa yomehluko phakathi amaqoqo ahlukene ebhodi ngemva kokunqunywa kwesinxephezelo sesendlalelo sangaphakathi esinengqondo ekukhiqizweni kwesilingo sebhodi lokuqala. Ngesikhathi esifanayo, kukhona nokungahambi kahle kwezinto ohlelweni lokudluliselwa kwehluzo zangaphandle ekubunjweni kwepuleti shrinkage. Enqubweni yokukhiqiza, kutholwe ukuthi ububanzi bephaneli nobude beyunithi yokulethwa bunokufinyezwa okukhulu esilinganisweni sokudlulisa sezithombe zangaphandle, ezifinyelela ku-3.6mil/10inch. Ngemuva kophenyo, isilinganiso se-X-ray nobubanzi bokudlulisa ingcaca yenqwaba yamapuleti angajwayelekile ngemuva kongqimba phezu kongqimba lwengcindezi yangaphandle zombili zingaphakathi kwebanga lokulawula. Njengamanje, indlela engcono yokuqapha ayitholakalanga ekuqapheni inqubo.

Idizayini yephaneli evamile iyalingana futhi ayinawo umthelela osobala kusayizi wesithombe se-PCB eqediwe ngaphansi kwesimo sesilinganiso esivamile sokudluliswa kwezithombe. Kodwa-ke, ukuze kuthuthukiswe izinga lokusebenzisa ibhodi futhi kuncishiswe izindleko, ingxenye yebhodi isebenzisa ukwakheka kwesakhiwo se-asymmetric, okuzoletha ithonya elisobala kakhulu ekuhambisaneni kwehluzo nosayizi we-PCB eqediwe ekusatshalalisweni okuhlukene. izindawo. Ngisho nasenqubweni yokucubungula i-PCB, singathola ukuthi ukuqondanisa kwebhodi elinjalo le-asymmetric design kunzima kakhulu ukulawula nokwenza ngcono kunebhodi elivamile kusixhumanisi ngasinye enqubweni yokubhoboza imbobo eyimpumputhe ye-laser kanye nokuvezwa kokudluliswa kwesithombe sangaphandle / i-solder. ukumelana nokuchayeka/ukuphrinta izinhlamvu.

Izici zenqubo yokudlulisa umfanekiso wesendlalelo sangaphakathi Inqubo yokudlulisa umfanekiso wesendlalelo sangaphakathi idlala indima ebaluleke kakhulu ekutheni usayizi webhodi le-PCB eliqediwe liyahlangabezana yini nezidingo zekhasimende. Uma kukhona ukuchezuka okukhulu esinxephezelweni sesilinganiso sefilimu esihlinzekiwe ukuze kudluliselwe ihluzo zesendlalelo sangaphakathi, angeke kuholele kuphela kusayizi wezithombe eziqediwe ze-PCB ezingakwazi ukuhlangabezana nezidingo zekhasimende, kodwa futhi kubangele ukuqondanisa okungavamile phakathi kwempumputhe ye-laser. imbobo kanye nepuleti yokuxhuma engezansi Ukubangela ukusebenza kwe-ungqimba kusendlalelo Ukwehla ngisho nesekethe elifushane. Futhi inkinga yokuqondanisa imbobo engaboni / eyimpumputhe ngenkathi kudluliswa ihluzo zangaphandle.

Ngokwalokhu kuhlaziya okungenhla, singathatha izinyathelo ezifanele zokuqapha nokwenza ngcono okungajwayelekile;

Ukuqapha ukuqina kobukhulu bezinto ezingenayo ze-PCB substrate kanye nokungaguquguquki kobukhulu phakathi kwamaqoqo Ukuzinza kwe-dimensional kwe-PCB substrate okunikezwa abahlinzeki abahlukene kuhlolwa njalo, okusuka lapho umehluko wedatha ye-longitudeal-latitude phakathi kwamaqoqo ahlukene ebhodi lokucaciswa okufanayo uyalandelelwa, futhi idatha yokuhlola ye-PCB substrate ingahlaziywa ngamasu afanele ezibalo. Ngale ndlela, abahlinzeki abanekhwalithi ezinzile bangatholakala, futhi idatha eningiliziwe yokukhethwa kwabahlinzeki inganikezwa ku-SQE nomnyango wokuthenga. Ngokuqondene nokwandiswa okukhulu kanye nokufinyezwa kwezingxenye zebhodi ngemva kokudluliselwa kwezithombe zangaphandle okubangelwa ukungaqini kahle kwe-dimensional ye-PCB substrate yamaqoqo ngamanye, ingatholakala kuphela ngokulinganisa ibhodi lokuqala ekukhiqizweni komumo noma ukuhlolwa kokuthunyelwa. . Nokho, lokhu kwakamuva kunezidingo eziphakeme zokuphathwa kweqoqo, futhi kulula ukubonakala ipuleti elixubile lapho inombolo ethile ikhiqizwa ngobuningi.

Uhlelo lokuklama lwesakhiwo esilinganayo kufanele lwamukelwe ngokusemandleni ukuze kwenziwe ukunwetshwa nokufinyezwa kweyunithi ngayinye yokuthunyelwa ebhodini le-jigsaw kuhlale kufana. Uma kungenzeka, ikhasimende kufanele lelulekwe ukuthi livumele ukuhlonzwa okuqondile kwendawo yeyunithi ngayinye ethunyelwayo ebhodini ngokubhala/ukuhlonza umlingiswa onqenqemeni lwenqubo yebhodi. Le ndlela ngendlela yomphumela we-asymmetric design isobala kakhulu kuphaneli, noma ngabe zonke ihluzo zangaphakathi ze-asymmetric zibangela usayizi weyunithi ngayinye ukuphuma ekubekezeleleni, ngisho kungabangela ukuhluka okuyingxenye kokuxhumeka kwembobo eyimpumputhe kungaba lula kakhulu ukucacisa okungajwayelekile. amayunithi nesibambo sokuyikhetha ngaphambi kokuthunyelwa, hhayi ukuphuma okudalwe i-encapsulation engavamile kubangela isikhalazo.

3. Yenza ipuleti lokuphindaphinda kuqala, thola ngokwesayensi isiphindaphindi sepuleti yokuqala yongqimba lwangaphakathi, thola ngokwesayensi isiphindaphinda sehluzo esidlulisa ungqimba lwangaphakathi lwepuleti lokukhiqiza ngepuleti lokuqala; Lokhu kubaluleke kakhulu lapho kushintshwa iziqeshana ze-PCB noma amashidi e-P avela kwabanye abahlinzeki ukunciphisa izindleko zokukhiqiza. Uma kutholakala ukuthi ipuleti ingaphezu kwebanga lokulawula, kufanele licutshungulwe ngokuya ngokuthi imbobo yepayipi yeyunithi iyi-drilling yesibili. Uma kuyinqubo evamile yokucubungula, ipuleti ingakhululwa kungqimba lwangaphandle ngokusho kwesimo sangempela futhi idluliselwe esilinganisweni sefilimu sokulungiswa okufanele; Endabeni yamapuleti esibili abhoboziwe, ukunakekelwa okukhethekile kufanele kuthathwe ekwelapheni amapuleti angavamile ukuze kuqinisekiswe usayizi wezithombe zamapuleti aqediwe kanye nebanga elisuka kumgomo kuya emgodini wepayipi (imigodi yesibili ebhoboziwe); Okunamathiselwe uhlu lokuqala lweqoqo lesilinganiso sepuleti lamapuleti esibili ane-laminated. 4. Gada inqubo yokwenza ibhodi le-PCB ngokusebenzisa idatha eqondiwe yangaphakathi yamapuleti angaphandle noma angaphansi kukalwa ngesikhathi sokukhiqizwa kwe-X-ray yezimbobo zokumba amapayipi ngemva kokucwenga ukuze kuhlaziywe ukuthi angaphakathi kwebanga lokulawula futhi aliqhathanise nezihambisanayo. idatha eqoqwe ngamapuleti okuqala afanelekayo ukuze ahlulele ukuthi ubukhulu bamapuleti abujwayelekile ngokwemibandela yokwandiswa nokufinyela; Ngokuya ngesibalo sethiyori, isiphindaphindo lapha kufanele silawulwe ngaphakathi +/- 0.025% ukuhlangabezana nezidingo zosayizi wamapuleti ajwayelekile.

Ngokuhlaziya izimbangela zokunwetshwa nokuncipha kosayizi we-PCB, singathola izindlela ezikhona zokuqapha nezindlela zokuthuthukisa, sithemba ukuthi iningi labasebenzi be-PCB bangathola ugqozi kulokhu, futhi bathole uhlelo lokuthuthukisa olufanele izinkampani zabo ngokwangempela. isimo.