He aha nā papa hana plating no PCB?

The electroplating process of papa ʻapuni hiki ke hoʻokaʻawale ʻē ʻia i loko o ka acidic keleawe electroplating keleawe, electroplated nickel / gula a me ka electroplated tin.

Laina Pākuʻi

1、 Classification of electroplating process:

ʻAkika huali keleawe uila electroplating nickel / gula uila uila

2, Kahe hana:

Piko → keleawe keleawe ma luna o ka papa holoʻokoʻa → hoʻololi i ka hoʻohālikelike → hoʻoliʻiliʻi waikawa → holoi countercurrent lua → micro etching → kekona → pickling → piʻo piʻo → holoi countercurrent lua.

Countercurrent rinsing → acid dipping → graphic copper plating → secondary countercurrent rinsing → nickel plating → secondary water washing → citric acid dipping → gold plating → recovery → 2-3-stage pure water washing → drying

3, Hōʻike Hanana:

（1） ʻohiʻohi

① Role and purpose:

Wehe i ka oxide ma ka papa honua a hoʻoheheʻe i ka papa o ka papa. ʻO ka maʻamau, ʻo 5% ka noʻonoʻo, a mālama ʻia kekahi ma kahi o 10%, ka nui no ka pale ʻana i ka wai mai ka lawe ʻana mai a hoʻoulu i ka ʻikepili sulfuric acid paʻa ʻole i loko o ka pahu wai.

② The acid leaching time should not be too long to prevent oxidation of the plate surface; After use for a period of time, if the acid solution is turbid or the copper content is too high, it shall be replaced in time to prevent contamination of the plated copper cylinder and plate surface;

③ E hoʻohana ʻia ka CP sulfuric acid ma aneʻi;

（2） Full plate copper plating: also known as primary copper, plate electricity, panel plating ① function and purpose:

Palekana i ke keleawe kemika lahilahi i waiho wale ʻia, pale i ke keleawe kemika mai ke kālai ʻia e ka waikawa ma hope o ka hoʻowali ʻana, a hoʻohui iā ia i kekahi ʻano e ka electroplating

② Nā palena hana e pili ana i ka plating keleawe ma ka pā holoʻokoʻa: ʻo ka hopena o ka ʻauʻau sulfate a me ka waikawa sulfuric. Lawe ʻia ke ʻano o ka waikawa kiʻekiʻe a me ke keleawe haʻahaʻa e hōʻoia i ka likelika o ka mahele o ka mānoanoa o ka pā a me ka hiki i ka plating hohonu no nā lua hohonu i ka wā o ka electroplating; ʻO ka nui o ka waihona sulfuric acid ma ka hapanui 180 g / L, a ʻo ka hapa nui o lākou i hiki i 240 g / L; ʻO ka ʻike o ka sulfate keleawe ma kahi o 75 g / L. ma kahi pākuʻi, hoʻohui ʻia kahi hapa liʻiliʻi o ka wai kolona i loko o ka pahu wai ma ke ʻano he mea kōkua gloss a me ka mea alohi keleawe e hoʻokani pū i ka hopena gloss; ʻO ka nui hoʻohui a i ʻole ka paukū e wehe i ka polish keleawe ma ka nui he 3-5ml / L. ka hoʻohui ʻana o ka polish polish e hoʻonui pinepine ʻia e like me ke ʻano o ka hola kiloampere a i ʻole e like me ka hopena hana maoli. Heluhelu ʻia ka manawa o ka pā electroplating āpau ma ka hoʻonui ʻana iā 2 A / decimeter square e ka electroplating area ma ka pā. No ka pā holoʻokoʻa, ʻo ka lōʻihi o ka pā DM × ʻO ka pā ākea DM × ʻelua × 2A / DM2 ； Mālama ʻia ka mahana o ka paukū keleawe i ka mahana o ka lumi, ʻoi aku ma mua o 32 kekelē, ka hapanui kaohi ʻia ma 22 kekelē. No laila, ma muli o ke kiʻekiʻe o ke ana wela i ke kauwela, koi ʻia e hoʻokomo i kahi ʻōnaehana hoʻomehana hoʻoluʻolu no ka paukū keleawe;

Maintenance Mālama hana:

Hoʻopiha hou i ka polish keleawe i ka manawa e like me nā hola kiloampere i kēlā me kēia lā, a hoʻohui iā ia e like me 100-150ml / Kah; E hōʻoia inā hana maʻamau ka pauma kānana a inā aia ka leakage ea; E hoʻomaʻemaʻe i ke koʻokoʻo cathode conductive me kahi lole maʻū maʻemaʻe i kēlā me kēia 2-3 mau hola; E nānā pono ʻia nā ʻike o ka keleawe sulfate (hoʻokahi manawa i ka pule), sulfuric acid (hoʻokahi manawa i ka pule) a me ka ion kloride (ʻelua manawa o ka pule) i ka paukū keleawe i kēlā me kēia pule. e hoʻopili ʻia nā mea pono kūpono i ka manawa; E hoʻomaʻemaʻe i ke koʻokoʻo conductive anode a me nā mea hoʻopili uila i nā wēlau ʻelua o ka pahu i kēlā me kēia pule, hoʻopiha i ka pōpō keleawe anode i ka hīnaʻi titanium i ka manawa, a electrolyze me ka haʻahaʻa 0.2-0.5 ASD o kēia manawa no 6-8 mau hola; E hōʻoia inā ua ʻino ka ʻeke hīnaʻi titanium o anode i kēlā me kēia mahina, a hoʻololi iā ia i ka manawa; E hōʻoia inā i hōʻiliʻili ʻia ka lepo anode ma lalo o ka hīnaʻi titanium anode, a hoʻomaʻemaʻe ia i ka manawa inā loaʻa; Ua hoʻohana ʻia ke kinona kalapona no ka kānana mau no 6 mau hola, a ua hoʻoneʻe ʻia nā impurities e ka electrolysis haʻahaʻa haʻahaʻa i ka manawa like; I kēlā me kēia hapalua makahiki a ʻoi paha, e hoʻoholo inā koi ʻia ka lapaʻau nui (activated carbon powder) e like me ka pahu wai i hoʻowahāwahā ʻia. E kuapo i ka mea kānana o ka paila kānana i kēlā me kēia pule ʻelua;

④ Nā kaʻina hana nui: A. lawe i ka anode, ninini i ke anode, hoʻomaʻemaʻe i ke kiʻi anode ma luna o ka anode, a laila hoʻokomo i loko o ka pahu e hoʻopili ana i ka anode keleawe. Hōʻoluʻolu i ke kihi keleawe keleawe i poni me ka etchant micro. Ma hope o ka holoi ʻana a me ka hoʻomaloʻo ʻana, hahao ia i loko o ka hīnaʻi titanium a hoʻokomo i loko o ka pahu waikawa no ke kū paʻa. B. hoʻohuʻu i ka hīnaʻi titanium anode a me ka ʻeke anode ma 10% solution alkaline no 6-8 mau hola, holoi a hoʻomaloʻo me ka wai, a laila e pulu i ka 5% dilute sulfuric acid, holoi a hoʻomaloʻo me ka wai no ka standby; C. Hoʻololi i ka wai i loko o ka pahu e kū pono, e hoʻohui i ka 1-3ml / L 30% hydrogen peroxide, e hoʻomaka i ka hoʻomehana ʻana, e hoʻohuli i ka lewa i ka wā o ka mahana ma kahi o 65 ℃, a hoʻoulu me ka ea i hoʻopaʻa ʻia no 2-4 mau hola. D. E hoʻopau i ka ea e hoʻouluulu, e lohi mālie i ka pauka kalapona i hoʻoheheʻe ʻia i loko o ka hopena wai ma ke ana o 3-5g / L, e hoʻohuli i ka ea e hoʻouluulu ana ma hope o ka pau ʻana o ka hoʻopau ʻana, a mehana ia no 2-4 mau hola; E. E hoʻopau i ka ea e hoʻonāukiuki ana, hoʻomehana a hoʻokuʻu i ka pauma kalapona hana i ka lalo o ka pahu i ka lohi; F. Ke hāʻule ka mahana ma kahi o 40 ℃, e hoʻohana i ka 10um PP filter element a me ka paukū kōkua kānana e kānana i ka wai wai i loko o ka pahu hana hoʻomaʻemaʻe, e hoʻohuli i ka ea, e hoʻokomo i ka anode, e kau i loko o ka papa electrolytic, a electrolyze ma haʻahaʻa haʻahaʻa e like me ka 0.2-0.5asd i kēia manawa no 6-8 mau hola. G. hoʻomaʻa i ka ʻike o ka sulfuric acid, keleawe sulfate a me ka paʻakai kolona i loko o ka pahu i ka pae hana maʻamau ma hope o ka loiloi ʻana o ka hale hana; Hoʻopiha hou i ka mea hoʻomālamalama e like me nā hopena hōʻike o ka cell Hall; H. Ma hope o ke ʻano o ke kala o ka pā, hiki ke hoʻopau ʻia ka electrolysis, a laila mālama ʻia ke kiʻi ʻoniʻume uila no 1-2 mau hola e like me ka nui o 1-1.5asd i kēia manawa. Hoʻokumu ʻia kahi ʻāpana o ke kiʻi ʻoniʻoni phosphorus me ka adhesion kūpilikiʻi kaulike ma ka anoda; 1. Hōʻoia plating OK;

⑤ The anode copper ball contains 0.3-0.6% phosphorus. The main purpose is to reduce the anode dissolution efficiency and reduce the production of copper powder;

⑥ When replenishing drugs, if the amount is large, such as copper sulfate and sulfuric acid; Low current electrolysis shall be conducted after addition; Pay attention to safety when adding sulfuric acid. When the amount of sulfuric acid is large (more than 10 liters), add it slowly several times; Otherwise, the temperature of the bath liquid will be too high, the photocatalyst decomposition will be accelerated, and the bath liquid will be polluted;

⑦ E uku ʻia ka nānā kūikawā i ka waihona o ka ion kloride, no ka mea, he haʻahaʻa loa ka mea o ka ion ion kloride (30-90ppm), pono e kaupaona pono ʻia me kahi paukū ana a i ʻole ke ana ana i mua o ka hoʻohui ʻana; Loaʻa ka 1ml hydrochloric acid ma kahi o 385ppm chloride ion,

Formula Hoʻolālā helu hoʻohui hoʻohui lāʻau:

Copper sulfate (kg) = (75-x) × Tank volume (L) / 1000

Sulfuric acid (in liters) = (10% – x) g / L × Tank volume (L)

Or (in liters) = (180-x) g / L × Tank volume (L) / 1840

Hydrochloric acid (ML) = (60-x) ppm × Tank volume (L) / 385

（3） Hoʻemi degere

Ose Ke kumu a me ka hana: wehe i ka oxide ma ka pae keleawe o ka laina, residual film of ink and residual glue, a e hōʻoia i ka adhesion ma waena o ke keleawe mua a me ke keleawe electroplating keleawe a nickel paha.

② Remember to use acid degreaser here. Why not use alkaline degreaser, and the degreasing effect of alkaline degreaser is better than that of acid degreaser? Mainly because the graphic ink is not alkali resistant and will damage the graphic circuit, only acidic degreaser can be used before graphic electroplating.

③ I ka wā o ka hana ʻana, pono wale ia e kaohi i ka noʻonoʻo a me ka manawa o ka degreaser. ʻO ke kukuna o ka degreaser ma kahi o 10% a hōʻoia ʻia ka manawa i 6 mau minuke. ʻAʻole loaʻa nā hopena maikaʻi ʻole i ka manawa lōʻihi; Hoʻokumu ʻia ka hoʻohana a me ka hoʻololi ʻana o ka wai pahu ma 15 mc / L wai hana, a hoʻokumu ʻia ka mea hoʻohui ma 2 m 100. 2.—0。 5L ；

（4） Micro etching:

Laina e kiʻi ana

① Purpose and function: clean and roughen the copper surface of the circuit to ensure the bonding force between pattern electroplating copper and primary copper

② Hoʻohana nui ʻia ʻo Sodium persulfate ma ke ʻano he micro etchant, me ka nui o ka coarsening rate a me ke ʻano like a me ka holoi wai maikaʻi. Hoʻomaopopo pinepine ʻia ka hoʻokaumaha o ka sodium persulfate ma kahi o 60 g / L a kaohi ʻia ka manawa ma kahi o 20 kekona. ʻO ka hoʻohui o nā lāʻau ʻo 3-4 kg no 100 mau mika kūlike; E mālama ʻia ka ʻike keleawe ma lalo o 20 g / L; ʻO nā mālama ʻē aʻe a me ka paukū e pani ana e like ia me ka paʻapū paʻapū o ka paʻapū o ka micro.

（5） ʻohiʻohi

① Role and purpose:

Wehe i ka oxide ma ka papa honua a hoʻoheheʻe i ka papa o ka papa. ʻO ka maʻamau, ʻo 5% ka noʻonoʻo, a mālama ʻia kekahi ma kahi o 10%, ka nui no ka pale ʻana i ka wai mai ka lawe ʻana mai a hoʻoulu i ka ʻikepili sulfuric acid paʻa ʻole i loko o ka pahu wai.

② The acid leaching time should not be too long to prevent oxidation of the plate surface; After use for a period of time, if the acid solution is turbid or the copper content is too high, it shall be replaced in time to prevent contamination of the plated copper cylinder and plate surface;

③ E hoʻohana ʻia ka CP sulfuric acid ma aneʻi;

（6） Graphic copper plating: also known as secondary copper, circuit copper plating

Ose Ke kumu a me ka hana: i mea e hoʻokō ai i ka ukana o ka helu o kēlā me kēia laina, pono kēlā me kēia laina a me ke keleawe kele i kahi mānoanoa. No ke kumu o ke keleawe keleawe, e hoʻonui ʻia ke keleawe keleawe a me ke keleawe laina i kahi mānoanoa o ka manawa;

② like nā mea ʻē aʻe i ka electroplating una honua

（7） Electroplated tin ① purpose and function: the purpose of graphic electroplated pure tin mainly uses pure tin as a metal resist layer to protect circuit etching;

② Hoʻokomo nui ʻia ka wai ʻauʻau i ka sulfate stannous, ka waikawa sulfuric a me nā mea hoʻohui; Hoʻopili ʻia ka ʻike sulfate stannous ma kahi o 35 g / L a mālama ʻia ka sulfuric acid ma kahi o 10%; Hoʻohui ʻia ka hoʻohui o nā mea hoʻohui plating tin e like me ke ʻano o ka hola kiloampere a i ʻole e like me ka hopena hana maoli. Hoʻomaopopo pinepine ʻia ke au o ka tin electroplated e like me 1. 5 A / decimeter square i hoʻonui ʻia e ka wahi electroplating ma ka pā; Mālama ʻia ka mahana o ka pahu kui i ka mahana o ka lumi. ʻO ka maʻamau, ʻaʻole ʻoi aku ka mahana ma mua o 30 kekelē a kaohi nui ʻia ma 22 kekelē. No laila, ma muli o ke kiʻekiʻe o ke ana wela i ke kauwela, paipai ʻia e hoʻokomo i kahi ʻōnaehana hoʻoluʻolu a me ka mahana no ka pahu kui;

Maintenance Mālama hana:

Hoʻopiha kūpono i nā mea hoʻohui plating tin e like me nā hola kiloampere i kēlā me kēia lā; E hōʻoia inā hana maʻamau ka pauma kānana a inā aia ka leakage ea; E hoʻomaʻemaʻe i ke koʻokoʻo alakaʻi cathode me kahi ʻūlū maʻū maʻemaʻe i kēlā me kēia 2-3 mau hola; Kālailai i ka sulfate stannous (hoʻokahi manawa i ka pule) a me ka waikawa sulfuric (hoʻokahi manawa i ka pule) i ka paukū o ka pahu i kēlā me kēia pule, hoʻoponopono i ka ʻike o nā mea hoʻopili plating tin ma o ka hoʻāʻo ʻana o ka cell Hall, a hoʻohui i nā mea maka i pili i ka manawa; E hoʻomaʻemaʻe i ke koʻokoʻo conductive anode a me nā mea hoʻopili uila i nā wēlau ʻelua o ka pahu i kēlā me kēia pule; Electrolysis me ka haʻahaʻa i kēia manawa 0.2-0.5 ASD no 6-8 mau hola i kēlā me kēia pule; E nānā ʻia ka ʻeke anode i kēlā me kēia mahina no ka pohō, a e hoʻololi ʻia ka mea i ʻino i ka manawa; E hōʻoia inā aia kahi lepo anode i hōʻiliʻili ʻia ma ka lalo o ka ʻeke anode, a hoʻomaʻemaʻe ia i ka manawa inā aia; Kānana mau me ka ʻāpana kalapona no 6-8 mau hola i kēlā me kēia mahina, a hemo i nā impurities e ka electrolysis haʻahaʻa o kēia manawa; I kēlā me kēia hapalua makahiki a ʻoi paha, e hoʻoholo inā koi ʻia ka lapaʻau nui (activated carbon powder) e like me ka pahu wai i hoʻowahāwahā ʻia. E kuapo i ka mea kānana o ka paila kānana i kēlā me kēia pule ʻelua;

⑨ Nā kaʻina hana nui: A. lawe i ka anode, hemo i ka ʻeke anode, hoʻomaʻemaʻe i ka papa anode me kahi palaki keleawe, holoi a hoʻomaloʻo ia me ka wai, hahao i loko o ka ʻeke anode a hoʻokomo i loko o ka pahu waikawa no ka hoʻomākaukau. B. kuʻu i ka ʻeke anode i 10% alkaline solution no 6-8 mau hola, holoi a hoʻomaloʻo iā ia me ka wai, e hoʻopulu iā ia i ka 5% dilute sulfuric acid, a holoi a hoʻomaloʻo iā ia me ka wai no ka standby; C. Hoʻololi i ka hopena o ke kelepona i ka cell standby a hoʻonā lohi i ka carbon carbon powder i ka solution cell ma ke ana o 3-5g / L. ma hope o ka pau ʻana o ka hopena, adsorb iā ia no 4-6 mau hola, kānana i ka hopena o ke kelepona. me ka 10um PP kānana a me ka paukū kōkua paukū i ka hoʻomaʻemaʻe hana paʻalima, hoʻokomo i loko o ka anode, kau ia i loko o ka electrolytic una, a electrolyze ma haʻahaʻa haʻahaʻa o 0.2-0.5asd ʻānō density no 6-8 mau hola. D. hoʻomaʻa i ka waikawa sulfuric i loko o ke kele ma hope o ke kālailai ʻana i ka kemikala, nā ʻike sulfate Stannous ma waena o nā pae hana maʻamau; Hoʻohui i nā mea hoʻohui plating tin e like me nā hopena hōʻike o ke keʻena ʻo Hall; E. Kāohi i ka electrolysis ma hope o ke kala o ka papa electrolytic papa i like; F. Hōʻoia plating OK;

④ Ke hoʻopiha hou ʻana i nā lāʻau, inā nui ka mea hoʻohui, e like me ka sulfate stannous a me ka sulfuric acid; E alakaʻi ʻia ka electrolysis haʻahaʻa ma hope o ka hoʻohui; E nānā i ka palekana ke hoʻohui ʻana i ka waikawa sulfuric. Ke nui ka nui o ka waikawa sulfuric (ʻoi aku ma mua o 10 liters), e hoʻohui mālie i kekahi mau manawa; Ināʻole, e kiʻekiʻe loa ka mahana o ka ʻauʻau, e oxidized ʻia ka tin oxide, a e hoʻonui ʻia ka ʻelemakule o ka wai.

Formula Hoʻolālā helu hoʻohui hoʻohui lāʻau:

Sulfate kū (paukū: kg) = (40-x) × pahu pahu (L) / 1000

Sulfuric acid (in liters) = (10% – x) g / L × Tank volume (L)

Or (in liters) = (180-x) g / L × Tank volume (L) / 1840

（9） Hoʻololi Nickel

① Ke kumu a me ka hana: hoʻohana nui ʻia ka papa nickel plating ma ke ʻano he pale pale ma waena o ka papa keleawe a me ka pale gula e pale ai i ka diffusion like o ke gula a me ke keleawe a hoʻopili i ka ola weldability a me ke ola o ka papa; I ka manawa like, hoʻonui nui ke kākoʻo o ka nickel layer i ka ikaika mechanical o ka papa gula;

② Nā palena hana e pili ana i ka plating keleawe ma ka pā holoʻokoʻa: hoʻonui ʻia ka hoʻohui o nā mea hoʻohui nickel plating e like me ke ʻano o ka hola kiloampere, a i ʻole ka huina hoʻohui e pili ana iā 200ml / Kah e like me ka hopena hana maoli o ka pā. Hoʻomaulia maʻamau ʻia ke au o ka papa electroless nickel plating e ka hoʻonui ʻana iā 2 A / decimeter square e ka electroplating area ma ka pā; Mālama ʻia ka mahana o ka pahu kui nikela ma 40-55 kekelē, a ʻo ka mahana maʻamau ma kahi o 50 kekelē. No laila, pono e hoʻolako ʻia ka paukū nickel me ka hoʻomehana a me ka ʻōnaehana kaohi wela;

Maintenance Mālama hana:

Hoʻopiha kūpono i nā mea hoʻohui plating nickel e like me nā hola kiloampere i kēlā me kēia lā; E hōʻoia inā hana maʻamau ka pauma kānana a inā aia ka leakage ea; E hoʻomaʻemaʻe i ke koʻokoʻo alakaʻi cathode me kahi ʻūlū maʻū maʻemaʻe i kēlā me kēia 2-3 mau hola; Nānā i nā ʻike o ka nickel sulfate (nickel sulfamate) (hoʻokahi manawa i ka pule), nickel chloride (hoʻokahi manawa i ka pule) a me ka waikawa boric (hoʻokahi manawa i kēlā me kēia pule) i ka paukū keleawe mau i kēlā me kēia pule, e hoʻoponopono i nā ʻike o nā mea hoʻohui nickel plating ma o ka hoʻāʻo ʻana o ke keʻena Hall. , a hoʻohui i nā mea maka e pili ana i ka manawa; E hoʻomaʻemaʻe i ke koʻokoʻo conductive anode a me nā mea hoʻopili uila i nā wēlau ʻelua o ka pahu i kēlā me kēia pule, e hoʻonui i ka anode nickel angle i ka hīnaʻi titanium i ka manawa, a electrolyze me ka haʻahaʻa 0.2-0.5 ASD no 6-8 mau hola; E hōʻoia inā ua ʻino ka ʻeke hīnaʻi titanium o anode i kēlā me kēia mahina, a hoʻololi iā ia i ka manawa; E hōʻoia inā i hōʻiliʻili ʻia ka lepo anode ma lalo o ka hīnaʻi titanium anode, a hoʻomaʻemaʻe ia i ka manawa inā loaʻa; Ua hoʻohana ʻia ke kinona kalapona no ka kānana mau no 6-8 mau hola, a ua hoʻoneʻe ʻia nā impurities e ka electrolysis haʻahaʻa haʻahaʻa i ka manawa like; I kēlā me kēia hapalua makahiki a ʻoi paha, e hoʻoholo inā koi ʻia ka lapaʻau nui (activated carbon powder) e like me ka pahu wai i hoʻowahāwahā ʻia. E kuapo i ka mea kānana o ka paila kānana i kēlā me kēia pule ʻelua;

④ Nā kaʻina hana nui: A. lawe i ka anode, ninini i ke anode, hoʻomaʻemaʻe i ka anode, a laila hoʻokomo i loko o ka pahu i piha me nā kihi nickel, ʻeleʻele i ka ʻaoʻao o ke kihi nickel me ka micro etchant i ka aila poni. Ma hope o ka holoi ʻana a me ka hoʻomaloʻo ʻana, hahao ia i loko o ka hīnaʻi titanium a hoʻokomo i loko o ka pahu waikawa no ke kū paʻa. B. hoʻohuʻu i ka hīnaʻi titanium anode a me ka ʻeke anode ma 10% solution alkaline no 6-8 mau hola, holoi a hoʻomaloʻo me ka wai, a laila e pulu i ka 5% dilute sulfuric acid, holoi a hoʻomaloʻo me ka wai no ka standby; C. Hoʻololi i ka wai i loko o ka pahu e kū pono, e hoʻohui i ka 1-3ml / L 30% hydrogen peroxide, e hoʻomaka i ka hoʻomehana ʻana, e hoʻohuli i ka lewa i ka wā o ka mahana ma kahi o 65 ℃, a hoʻoulu me ka ea i hoʻopaʻa ʻia no 2-4 mau hola. D. E hoʻopau i ka ea e hoʻouluulu, e lohi mālie i ka pauka kalapona i hoʻoheheʻe ʻia i loko o ka hopena wai ma ke ana o 3-5g / L, e hoʻohuli i ka ea e hoʻouluulu ana ma hope o ka pau ʻana o ka hoʻopau ʻana, a mehana ia no 2-4 mau hola; E. E hoʻopau i ka ea e hoʻonāukiuki ana, hoʻomehana a hoʻokuʻu i ka pauma kalapona hana i ka lalo o ka pahu i ka lohi; F. Ke hāʻule ka mahana ma kahi o 40 ℃, e hoʻohana i ka 10um PP filter element a me ka paukū kōkua kānana e kānana i ka wai wai i loko o ka pahu hana hoʻomaʻemaʻe, e hoʻohuli i ka ea, hoʻokomo i ka anode, kau i loko o ka pā electrolytic, a kaomi 0. 2-0。 5asd i kēia manawa electrolysis haʻahaʻa haʻahaʻa no 6-8 mau hola, G. ma hope o ka hoʻākoakoa ʻana o ka kemika, hoʻoponopono i ka ʻike o nickel sulfate a i ʻole nickel sulfamate, nickel chloride a me boric acid i loko o ka pahu i ka pae hana maʻamau; Hoʻohui i nā mea hoʻohui plating nickel e like me nā hopena hōʻike o ke keʻena o Hall; H. Ma hope o ke kala o ka papa o ka papa electrolytic mea like, hoʻopau i ka electrolysis, a laila hana i ka electrolytic lapaʻau e like me ka nui o 1-1.5 ASD no 10-20 mau minuke e hoʻoheheʻe i ka anode; 1. Hōʻoia plating OK;

⑤ Ke hoʻopili ʻana i nā lāʻau, inā nui ka mea hoʻohui, e like me nickel sulfate a i ʻole nickel sulfamate a me nickel chloride, e electrolyzed ʻia me ke au haʻahaʻa ma hope o ka hoʻohui; Ke hoʻohui nei i ka waikawa boric, hoʻokomo i ka waikawa boric i hoʻohui ʻia i loko o kahi ʻeke anode maʻemaʻe a kau ʻia i ka paukū nikala. ʻAʻole hiki ke hoʻohui pololei ʻia i loko o ka pahu wai;

⑥ Ma hope o ka hoʻopili ʻana o ka nickel, koi ʻia e hoʻohui i kahi holoi wai holoi a wehe i ka paukū me ka wai maoli, i hiki ke hoʻohana ʻia e hoʻonui i ka pae wai i hoʻonui ʻia e ka hoʻomehana ʻana i ka paukū nikala. Ma hope o ka holoi wai holoi, hoʻopili ʻia me ka holoi countercurrent lua;

Formula Hoʻolālā helu hoʻohui hoʻohui lāʻau:

Nickel sulfate (kg) = (280-x) × Ka nui o ka pahu (L) / 1000

Nickel chloride (kg) = (45-x) × Ka nui o ka pahu (L) / 1000

Boric acid (kg) = (45-x) × Ka nui o ka pahu (L) / 1000

（10 gold Gold electroplating: ua mahele ʻia i loko o ka electroplating gula paʻa (gula oka a) a me ka wai gula (gula maʻemaʻe) nā kaʻina hana. ʻO ke ʻano o ka plating gula paʻakikī ka mea like me ka ʻauʻau gula palupalu, akā aia kekahi mau metala kuhi e like me ka nickel, cobalt a me ka hao i loko o ka ʻauʻau gula paʻakikī;

① Ke kumu a me ka hana: ma ke ʻano he metala makamae, maikaʻi ke gula i ka weldability, ke kūpale ʻana i ka oxygen, kūpaʻa ka ʻaʻa, ke kūpaʻa hoʻohaʻahaʻa haʻahaʻa a ʻaʻa i ka pale.