Quaenam sunt processus ad PCB plating?

The electroplating process of circuitu tabula dure indicari potest in acidum electrum aeri lucidum, nickel / aurum et stannum electroplatum.

Versus Plating

1、 Classification of electroplating process:

Acidi aeris electroplating lucidi nickel / auri electroplating tin

2、 Processus fluxus;

Pickling → copper plating on the whole board → pattern transfer → acid degreasing → secondary countercurrent rinsing → micro etching → secondary → pickling → tin plating → secondary countercurrent rinsing

Countercurrent rinsing → acid dipping → graphic copper plating → secondary countercurrent rinsing → nickel plating → secondary water washing → citric acid dipping → gold plating → recovery → 2-3-stage pure water washing → drying

3、 Processus Description:

1） Pickling

① Role and purpose:

Spodium in superficie laminae remove et superficies lamellae eu. Communiter concentratio est 5%, et quidam ad 10% circiter conservantur, maxime ne aqua contentus acidum sulphuricum instabile inducat et causat in liquore piscinae;

② The acid leaching time should not be too long to prevent oxidation of the plate surface; After use for a period of time, if the acid solution is turbid or the copper content is too high, it shall be replaced in time to prevent contamination of the plated copper cylinder and plate surface;

③ CP gradu acidi sulphurici hic utantur;

（2） Full plate copper plating: also known as primary copper, plate electricity, panel plating ① function and purpose:

Protect the thin chemical copper just deposited, prevent the chemical copper from being etched by acid after oxidation, and add it to a certain extent by electroplating

② Processus parametri ad laminam cupream in tota lamina pertinentia: solutio balnei maxime componitur ex sulphate aeris et acido sulphurico. Formula acidi magni et aeris minoris adhibita est ut aequabilitas bracteae crassitudinis distributio et altae patellae facultatis pro profunda foraminibus in electroplatandi; Acidum sulphuricum maxime 180 g/L est, et plerique 240 g/L attingunt; Contentum sulphate cupri fere 75 g / L. in additione, parva moles chloridi ion lacus liquidi additur, ut glossa auxiliaris agentis et agentis aenei glossae ad fabulae effectum glossae coniungitur; Additio quantitatis vel cylindri aperiendi quantitatem aeris politurae fere 3-5ml / L. Adiectio politurae aeneae plerumque suppletur secundum modum horae kiloampere vel secundum effectum producendi; Vena totius laminae electroplatulae generaliter computatur multiplicando 2A/quadratum decimetrorum per aream in laminam electroplantis. Pro tota lamina, est bractea longitudo DM × Plate latitudo DM × ij × 2A/ DM2； Temperatura cylindrici aeri conservatur in temperatura cella, fere non plus quam 32 gradus, maxime ad 22 gradus moderata. Ideo propter caliditatem in aestate commendatur ut ratio temperaturae refrigerium instituat ad cylindrum aeris;

processus sustentationem:

Aes nitorem reple tempore secundum horas quotidie kiloampere, et adde secundum 100-150ml / Kah; Reprehendo num sentinam colum normaliter operare et num lacus aer sit; Munda virgula cathode conductiva cum panno madido mundo singulis 2-3 horis; Contenta sulphate aeris (semel in hebdomada), acidi sulphurici (semel in hebdomada) et chloridi ion (bis in hebdomada) in cylindro cupri regulariter omni septimana enucleentur, contentum lucidioris per Aulam cellam examinis accommodetur, ac rudis materiae tempore suppleatur; Anode baculum conductivum et electricum connexiones ad utramque partem piscinae singulis septimanis mundare, anodam globum aeris in calatho titanii in tempore replere, et elaborare cum humili currenti 0.2-0.5 ASD pro 6-8 horis; Reprehendo num calathus titanium anoodi per singulos menses laedatur, et repone in tempore; Reprime num anode lutum cumulatum in fundo anode titanii calathum, et si quis in tempore emunda; Core carbonis adhibitum est ad filtrationem continuam per 6-8 horas, et immundities ab humili currente electrolysis simul tollebantur; Singulis annis vel sic dijudicare, utrum curatio magna-scalarum (condi carbonis carbonis actuatus) secundum pollutionem liquidam piscinam requiratur; Repone colum elementum colum sentinam singulis duabus septimanis;

④ Major treatment procedure: A. take out the anode, pour out the anode, clean the anode film on the anode surface, and then put it in the barrel packaging the copper anode. Roughen the copper corner surface to uniform pink with micro etchant. After washing and drying, put it into the titanium basket and put it into the acid tank for standby. B. soak the anode titanium basket and anode bag in 10% alkaline solution for 6-8 hours, wash and dry with water, and then soak in 5% dilute sulfuric acid, Wash and dry with water for standby; C. Transfer the tank liquid to the standby tank, add 1-3ml / L 30% hydrogen peroxide, start heating, turn on air stirring when the temperature is about 65 ℃, and stir with insulated air for 2-4 hours; D. Turn off the air stirring, slowly dissolve the activated carbon powder into the tank solution at the rate of 3-5g / L, turn on the air stirring after the dissolution is complete, and keep it warm for 2-4 hours; E. Turn off the air stirring, heat up and let the activated carbon powder settle to the bottom of the tank slowly; F. When the temperature drops to about 40 ℃, use 10um PP filter element and filter aid powder to filter the tank liquid into the cleaned working tank, turn on air stirring, put the anode, hang it into the electrolytic plate, and electrolyze at low current according to 0.2-0.5asd current density for 6-8 hours. G. adjust the content of sulfuric acid, copper sulfate and chloride ion in the tank to the normal operation range after laboratory analysis; Replenish the brightener according to the Hall cell test results; H. After the color of the plate is uniform, the electrolysis can be stopped, and then the electrolytic film is treated for 1-2 hours according to the current density of 1-1.5asd. A layer of black phosphorus film with uniform dense adhesion is formed on the anode; 1. Test plating OK;

⑤ The anode copper ball contains 0.3-0.6% phosphorus. The main purpose is to reduce the anode dissolution efficiency and reduce the production of copper powder;

⑥ When replenishing drugs, if the amount is large, such as copper sulfate and sulfuric acid; Low current electrolysis shall be conducted after addition; Pay attention to safety when adding sulfuric acid. When the amount of sulfuric acid is large (more than 10 liters), add it slowly several times; Otherwise, the temperature of the bath liquid will be too high, the photocatalyst decomposition will be accelerated, and the bath liquid will be polluted;

Praecipua cura ad supplementum ionis chloridis reddendum est, quia ion contentum chloridum praecipue humile (30-90ppm), accurate perpendendum est cylindrico mensurando vel poculo ante addendo; Acidum hydrochloricum 1ml continet circa 385ppm ion chloridum;

⑧ Drug addition calculation formula:

Copper sulfate (kg) = (75-x) × Tank volume (L) / 1000

Sulfuric acid (in liters) = (10% – x) g / L × Tank volume (L)

Or (in liters) = (180-x) g / L × Tank volume (L) / 1840

Hydrochloric acid (ML) = (60-x) ppm × Tank volume (L) / 385

3） Acidum degreasing

Propositum et functionem: remove oxydatum super lineae superficiei aeris, velum residua atramenti et gluten residua, et cura adhaesionem inter cupri primarium et exemplar electroplating cupri vel nickel

② Remember to use acid degreaser here. Why not use alkaline degreaser, and the degreasing effect of alkaline degreaser is better than that of acid degreaser? Mainly because the graphic ink is not alkali resistant and will damage the graphic circuit, only acidic degreaser can be used before graphic electroplating.

In productione solum necessarium est intentionem et tempus minuentium regere. Concentratio graduum circiter 10% est et tempus praestatur ut 6 minuta sint. Paulo diutius adversa non habebunt effectus; Usus et reponenda liquoris piscinae etiam in 15 m2 / L liquoris laborantis fundatur, et accessio addita suppletiva innititur 100 m2 0. 5—0。 8L；

（4） Micro etching:

Eatching Line

① Purpose and function: clean and roughen the copper surface of the circuit to ensure the bonding force between pattern electroplating copper and primary copper

② Sodium persulfate is mostly used as the micro etchant, with stable and uniform coarsening rate and good water washability. The concentration of sodium persulfate is generally controlled at about 60 g / L and the time is controlled at about 20 seconds. The addition of drugs is 3-4 kg per 100 square meters; Copper content shall be controlled below 20 g / L; Other maintenance and cylinder replacement are the same as copper precipitation micro corrosion.

5） Pickling

① Role and purpose:

Spodium in superficie laminae remove et superficies lamellae eu. Communiter concentratio est 5%, et quidam ad 10% circiter conservantur, maxime ne aqua contentus acidum sulphuricum instabile inducat et causat in liquore piscinae;

② The acid leaching time should not be too long to prevent oxidation of the plate surface; After use for a period of time, if the acid solution is turbid or the copper content is too high, it shall be replaced in time to prevent contamination of the plated copper cylinder and plate surface;

③ CP gradu acidi sulphurici hic utantur;

（6） Graphic copper plating: also known as secondary copper, circuit copper plating

① Propositum et munus: ut onus cuiuslibet lineae aestimatae currenti occurrat, singulae lineae et foraminis aenei ad quandam crassitudinem pervenire debent. Ad lineam laminam aeris, foramen aeris et linea aeris ad quamdam crassitudinem incrassata erunt;

Aliae res eadem sunt ac plenae laminam electroplating

（7） Electroplated tin ① purpose and function: the purpose of graphic electroplated pure tin mainly uses pure tin as a metal resist layer to protect circuit etching;

② Liquor balneum maxime componitur ex sulphate stanno, acido sulphurico et additivis; Contentum sulphate stannous temperatum circa 35 g/L et acidum sulphuricum circiter 10% temperatum est; Additio stannei additivorum plerumque suppletur secundum modum kiloampere horae vel secundum effectum producendi actualem; Current styli electroplati fere computatur ut 1. 5/quadratus decimeter ductus ab area electroplatis in laminam; Temperatura cylindrici stannei conservatur ad locus temperatus. Plerumque temperatura 30 gradus non excedit et plerumque ad 22 gradus moderatur. Ideo propter caliditatem aestivalem, commendatur ut niteremur refrigerationem et temperaturam temperationis ratio ad columpnam stanneam;

processus sustentationem:

Opportune supplementum stannum plating additiva iuxta horas cotidie kiloampere; Reprehendo num sentinam colum normaliter operare et num lacus aer sit; Munda virgula cathode conductiva cum pannus mundo humido singulis 2-3 horis; Expendere sulphate stannoum (semel in hebdomada) et acidum sulphuricum (semel in hebdomada) in cylindrico stanneo regulariter omni septimana, compone contentum platonis additivorum per Aulam cellam testam, ac supplementum materiae rudis in tempore pertinentes; Anode virga conductiva et electrici connexiones ad utramque partem piscinae singulis hebdomadibus expurgant; Electrolysis cum humili currente 0.2-0.5 ASD pro 6-8 horarum qualibet septimana; Sacculus anode pro noxa quolibet mense sedetur et laesus tempore reponatur; Reprehendo anode lutum in fundo anode sacculo coacervatum, et si tempus est, purga; Filtra continenter cum nucleo carbonii singulis mensibus 6-8 horis, et immunditias per gravem electrolysin auferunt; Singulis annis vel sic dijudicare, utrum curatio magna-scalarum (condi carbonis carbonis actuatus) secundum pollutionem liquidam piscinam requiratur; Repone colum elementum colum sentinam singulis duabus septimanis;

⑨ Maior tractandi ratio: A. tolle anodam, sacculum anode tolle, anode superficiem cum penicillo aereo munda, eam lava et cum aqua sicca, pone sacculum in anode et mitte in piscinam acidam pro standby. B. macera peram anodam in solutione alcalini 10% horarum 6-8, lava et aqua sicca, macera in 5% acido sulphurico diluto, et cum aqua ad standby lava et sicca; C. Solutio cellae ad sto- cellam transfer et lente reducitur carbonis pulveris solutionem in cellam ad ratem 3-5g/L. Post solutionem omnino dissolutam, eam per 4-6 horas adsorbe, solutionem cellam sparge. cum elementum sparguntur 10um PP et sparguntur auxilium pulveris ad cellam mundatam operantes, eam in anodem pone, eam in laminam electronicam suspende, et electronicas ad densitatem currentis 0.2-0.5 horarum 6-8 submissam insculpe. D. Acidum sulphuricum in cellula post analysim chemicam compone, contentum sulfatum stannum intra range operativa normali; In laminas plumbi additivas iuxta Aulam cellae testium eventus addere; E. Siste electrolysis post colores superficiei laminae electronici uniformis est; F. Test plating OK;

Cum implerent medicamenta, si magna accessio est, ut sulphate stannosi et acidum sulphuricum; Minimum current electrolysis agetur post additionem; Tuti attende cum acido sulphurico addito. Cum copia acidi sulphurici magna est (plus quam 10 liters), hoc tarde pluries adde; Alioquin temperatura balnei nimis alta erit, oxydatum stagni oxidized erit, et umor senescit accelerabitur.

⑤ medicamentis adiectio calculi formula:

Sulfatum stannum (unit: kg) = (40-x) × Tank volumen (L) / 1000

Sulfuric acid (in liters) = (10% – x) g / L × Tank volume (L)

Or (in liters) = (180-x) g / L × Tank volume (L) / 1840

9） Nickel plating

① Propositum et munus: iacuit nickel iacuit maxime usus est ut obice iacuit inter stratum aeneum et stratum auri, ne mutuus auri et aeris diffusio et societas et usus vitae tabulae afficerent; Eodem tempore, faucium nickel stratum etiam auget robur mechanicam auri strati;

② Processus parametri ad laminam aeneam in tota lammina relata: additionis nickel additivorum plerumque suppletur secundum modum horae kiloampere, vel adiectio quantitatis circiter 200ml/Kah secundum effectum productionis ipsius laminae; Current exemplaria electroless nickel plating generaliter computata est multiplicatione 2 A / quadrati decimetrorum per aream electronicam in laminam; Temperatura cylindrici nickel retinetur ad 40-55 gradus, et generalis temperatura circiter 50 gradus est. Ideo cylindrus nickel instruendus est ad calefaciendum et temperandum systema temperandum;

processus sustentationem:

Opportune supplementum nickel plating additiva iuxta horas cotidie kiloampere; Perspicias num sentinam colum normaliter operetur et num lacus aer sit; Munda virgula cathode conductiva cum pannus mundo humido singulis 2-3 horis; Expendere contenta nickel sulfate (nikel sulfamatis) (semel in hebdomade), chloridum nickel (semel in hebdomada) et acidum boricum (semel in hebdomada) in cylindrico aeneo regulariter omni septimana, accommodare contentum nickel plating additiva per Aulam cellam test ac supplementum ad tempus rudis materiae pertinentes; Anode baculum conductivum et electricum connexiones ad utramque partem piscinae singulis septimanis purgare, anode angulum nickel in canistro titanii in tempore supplere, et electronico demittere currenti 0.2-0.5 ASD pro 6-8 horis; Reprehendo num calathus titanium anoodi per singulos menses laedatur, et repone in tempore; Reprime num anode lutum cumulatum in fundo anode titanii calathum, et si quis in tempore emunda; Core carbonis adhibitum est ad filtrationem continuam per 6-8 horas, et immundities ab humili currente electrolysis simul tollebantur; Singulis annis vel sic dijudicare, utrum curatio magna-scalarum (condi carbonis carbonis actuatus) secundum pollutionem liquidam piscinam requiratur; Repone colum elementum colum sentinam singulis duabus septimanis;

④ Maior curatio procedendi: A. tolle anode, effunde anode, anode munda, et pone illud in dolio nickel referto angulo, superficiem anguli nickel exasperet cum micro etchant ad roseum uniformem. Post lavationem et siccationem, mitte in cophinum titanium et mitte in piscinam acidam pro standby. B. macera anodum titanii canistrum et anodam peram in 10% solutione alcalini per 6-8 horas, aqua lava et sicca, et postea in 5% acido sulphurico diluto macera, lava et sicca cum aqua ad standby; C. Transfer liquidum piscinam ad piscinam standi, adde 1-3ml / L 30% peroxidum hydrogenii, calefactionis initium, turn in aerem moventem cum temperatura circiter 65 , et cum aere insulato per 2-4 horas excita; D. Averte aerem excitatum, tarde retractum pulveris carbonis in solutionem piscinae solvendae ad ratem 3-5g/L, converte in aerem motum post dissolutionem completum et calefactum per horas 2-4; E. Averte aerem excitantem, calefac, et carbonis carbonis reductum ad imum lente piscinae compone; F. Cum temperaturae guttae ad circiter 40 , 10um PP elementum sparguntur et auxilium sparguntur, ut piscinam liquorem in piscinam mundatam operantem eliquare, rursus in aerem excitantem, in anode immissum, in lamellam electronicam suspende, ac preme 0. 2-0。 5asd densitas currentis humilis electrolysis currentis pro 6-8 horis, G. post analysin chemicam, contentus nickel sulfate vel nickel sulfamatis, nickel chloridi et acidi borici in piscina ad range operativa normali; Nickel plating additiva iuxta Aulam cellam testium proventuum addere; . Test plating OK;

⑤ When supplementing drugs, if the addition amount is large, such as nickel sulfate or nickel sulfamate and nickel chloride, it shall be electrolyzed with low current after addition; When adding boric acid, put the added boric acid into a clean anode bag and hang it in the nickel cylinder. It cannot be directly added into the tank;

Post nickel plating, suadetur ut aquae lavandae et cylindri cum aqua pura aperiat recuperationem addere, quae adhiberi potest ad supplementum liquoris campi volatilis calefaciendo in cylindro nickel. Post receptam aquam lava, iungitur cum lotio secundario countercurrente;

⑦ medicamentis adiectio calculi formula:

Nickel sulfate (kg) = (280-x) Tank volumen (L) / 1000

Nickel chloridum (kg) = (45-x) Tank volumen (L) / 1000

Acidum boricum (kg) = (45-x) Tank volumen (L) / 1000

（10） Electroplatando aurum: dividitur in electroplatando aurum durum (aurum mixturae) et aqua aurum (purum aurum) processuum. Compositio laminae auri durae eadem fere est quae balneum auri molle, sed vestigia quaedam sunt metalla, ut nickel, cobaltum vel ferrum in balneum auri duri;

① Propositum et munus: sicut metallum pretiosum, aurum bonum condobilitas, oxidatio resistentia, corrosio resistentia, humilitas resistentia et resistentia induuntur.