- 15
- Nov
PCB pressing common problems
PCB fa’alavelave masani
1. White, revealing the texture of the glass cloth
faʻafitauli mafuaʻaga:
1. The resin fluidity is too high;
2. The pre-pressure is too high;
3. O le taimi o le faʻaopoopoina o le mamafa maualuga e le saʻo;
4. O le resini o loʻo i totonu o le laupepa faʻapipiʻi e maualalo, o le taimi gel e umi, ma e tele le suavai;
fofo:
1. Fa’aitiitia le vevela po’o le mamafa;
2. Reduce pre-pressure;
3. Mataʻituina ma le faʻaeteete le tafe o le resin i le taimi o lamination, pe a uma le suiga o le mamafa ma le maualuga o le vevela, fetuunai le taimi amata o le faʻaogaina o le mamafa maualuga;
4. Adjust the pre-pressure\temperature and the start time of high pressure;
Lua, fa’afu, fa’afu
faʻafitauli mafuaʻaga:
1. E maualalo le mamafa muamua;
2. O le vevela e maualuga tele ma o le va i le va o le mamafa muamua ma le mamafa atoa e umi tele;
3. O le viscosity malosi o le resin e maualuga, ma o le taimi e faaopoopo ai le mamafa atoa ua tuai;
4. The volatile content is too high;
5. E le mama le mea fa’apipi’i;
6. Poor mobility or insufficient pre-stress;
7. E maualalo le vevela o le laupapa.
fofo:
1. Faʻateleina le mamafa muamua;
2. Fa’alili i lalo, fa’ateleina le fa’aosoina pe fa’apu’upu’u le ta’amilosaga muamua;
3. The time-activity relationship curve should be compared to make the pressure, temperature and fluidity coordinate with each other;
4. Reduce the pre-compression cycle and reduce the temperature rise rate, or reduce the volatile content;
5. Faʻamalosia le malosi o le gaioiga o togafitiga faʻamamā.
6. Increase the pre-pressure or replace the bonding sheet.
7. Siaki le faʻavevela afi ma fetuunai le vevela o le stamper vevela
3. E iai lua, resini ma maanuminumi i luga o le laupapa
faʻafitauli mafuaʻaga:
1. Le lelei o le faʻaogaina o le LAY-UP, vai stains i luga o le mata o le ipu uʻamea e leʻi soloina mago, ma mafua ai ona maanuminumi le pepa apamemea;
2. O le pito i luga o le laupapa e leiloa le mamafa pe a oomi le laupapa, lea e mafua ai le tele o le resini gau, leai se kelu i lalo o le pepa apamemea, ma maanuminumi i luga o le pepa apamemea;
fofo:
1. Faʻamama ma le faʻaeteete le ipu uʻamea ma faʻalelei le pito i luga o le pepa apamemea;
2. Faʻalogo lelei i le faʻaogaina o le pito i luga ma lalo o papatusi ma papatusi pe a faʻatulagaina papatusi, faʻaitiitia le faʻaogaina o le mamafa, faʻaoga le maualalo o le RF% ata tifaga, faʻapuupuu le taimi tafe resin ma faʻavave le vevela vevela;
Fourth, the inner layer graphics shift
faʻafitauli mafuaʻaga:
1. O le totonugalemu apamemea apamemea e maualalo le pa’u malosi po o le le lelei o le vevela tetee po o laina lautele e manifinifi tele;
2. The pre-pressure is too high; the dynamic viscosity of the resin is small;
3. E le tutusa le mamanu lolomi;
fofo:
1. Su’i i le laupapa fa’alava-lava-i totonu maualuga;
2. Faʻaitiitia le faʻamalo muamua pe sui le laupepa faʻapipiʻi;
3. Adjust the template;
Five, uneven thickness, inner layer slippage
faʻafitauli mafuaʻaga:
1. The total thickness of the forming plate of the same window is different;
2. The accumulated thickness deviation of the printed board in the forming board is large; the parallelism of the hot-pressing template is poor, the laminated board can move freely, and the entire stack is off the center of the hot-pressing template;
fofo:
1. Fetuuna’i i le mafiafia atoa tutusa;
2. Fetuuna’i le mafiafia, filifili apamemea faaofuina laminate ma se eseʻese mafiafia laʻititi; fetuunai le tutusa o le laupapa ata tifaga vevela, faʻatapulaʻa le saʻolotoga o le tele-tali mo le laupapa laminated, ma taumafai e tuʻu le laminate i le ogatotonu o le mamanu vevela;
Ono, va’ava’a fa’atasi
faʻafitauli mafuaʻaga:
1. Le faʻalauteleina o le vevela o mea faʻapipiʻi totonu ma le tafe resini o le laupepa faʻapipiʻi;
2. Heat shrinkage during lamination;
3. O le faʻalauteleina o le vevela o le mea laminate ma le faʻataʻitaʻiga e matua ese lava.
fofo:
1. Pulea uiga o le pepa faʻapipiʻi;
2. O le ipu ua uma ona togafitia i le vevela;
3. Fa’aoga le pito i totonu o le laupapa fa’aofuina apamemea ma le pepa fa’apipi’i ma le mautu lelei.
Seven, plate curvature, plate warpage
faʻafitauli mafuaʻaga:
1. Asymmetric fausaga;
2. Le lava le taamilosaga faamalolo;
3. The cutting direction of the bonding sheet or the inner copper clad laminate is inconsistent;
4. O le tele-layer board e faʻaaoga ai papatusi poʻo pepa faʻapipiʻi mai tagata gaosi oloa eseese.
5. O le laupapa multilayer e le lelei ona taulimaina pe a maeʻa le faʻamalolo ma le tuʻuina atu o le mamafa
fofo:
1. Strive for symmetrical wiring design density and symmetrical placement of bonding sheets in lamination;
2. Faʻamaonia le taamilosaga faʻamalolo;
3. Taumafai mo le fa’atonuga o le tipi.
4. O le a aoga le faʻaogaina o mea e gaosia e le kamupani lava e tasi i se faʻapipiʻi tuʻufaʻatasia
5. The multilayer board is heated to above Tg under pressure, and then kept under pressure and cooled to below room temperature
Valu, stratification, stratification vevela
faʻafitauli mafuaʻaga:
1. High humidity or volatile content in the inner layer;
2. High volatile content in the adhesive sheet;
3. Pollution of the inner surface; pollution of foreign substances;
4. The surface of the oxide layer is alkaline; there are chlorite residues on the surface;
5. O le oxidation e le masani, ma o le tioata o le oxide e umi tele; o le mua’i togafiti e le’i lava le vaega o luga.
6. Insufficient passivation
fofo:
1. Before lamination, bake the inner layer to remove moisture;
2. Faʻaleleia le siosiomaga teuina. E tatau ona fa’aaogaina le pepa fa’apipi’i i totonu ole 15 minute pe a uma ona aveese mai le si’osi’omaga fa’agogo;
3. Faʻaleleia le gaioiga ma aloese mai le paʻi i le vaega aoga o le faʻaogaina o luga;
4. Faʻamalosia le faʻamamaina pe a uma le faʻamaʻi faʻamaʻi; mataʻituina le tau o le PH o le vai faʻamamaina;
5. Faʻapuupuu le taimi faʻamaʻi, fetuunai le faʻaogaina o le faʻamaʻi faʻamaʻi poʻo le faʻaogaina o le vevela, faʻateleina le micro-etching, ma faʻaleleia le tulaga o luga.
6. Mulimuli i le faagasologa o manaoga