PCB kumanikidza matambudziko akajairika

1. Muchena, unoratidza maitiro ejira regirazi

dambudziko rinokonzera:

1. The resin fluidity yakanyanya;

2. Pre-pressure yakanyanya;

3. Nguva yekuwedzera kudzvinyirira kwakanyanya haina kururama;

4. Iro resin yepepa yekubatanidza yakaderera, nguva yegel yakareba, uye fluidity yakakura;

Solution:

1. Deredza tembiricha kana kumanikidza;

2. Deredza pre-pressure;

3. Nyatsocherechedza kuyerera kweresin panguva yelamination, mushure mekuchinja kwekumanikidza uye kupisa kwekushisa, gadzirisa nguva yekutanga yekushandisa kudzvinyirira kwakanyanya;

4. Gadzirisa pre-pressure \ tembiricha uye nguva yekutanga yekumanikidza kwakanyanya;

Vaviri, kupupa furo, kupupa furo

dambudziko rinokonzera:

1. Pre-pressure yakaderera;

2. Kupisa kwakanyanya uye nguva iri pakati pepre-pre-pressure uye full pressure yakarebesa;

3. Iyo dynamic viscosity ye resin yakakwirira, uye nguva yekuwedzera kuzara yakazara yakanonoka;

4. Zvinhu zvinoshanduka zvakanyanyisa;

5. Nzvimbo yekubatanidza haina kuchena;

6. Kusafamba zvakanaka kana kusakwana pre-stress;

7. Kupisa kwebhodhi kwakaderera.

Solution:

1. Wedzera pre-pressure;

2. Kutonhorera pasi, kuwedzera pre-pressure kana kupfupisa pre-pressure cycle;

3. Iyo nguva-yekuita hukama hukama hunofanirwa kufananidzwa kuita kudzvanywa, tembiricha uye fluidity kurongeka pamwe chete;

4. Deredza pre-compression cycle uye kuderedza kukwira kwekushisa, kana kuderedza kushanduka kwezvinhu;

5. Simbisa simba rekushanda rekuchenesa kurapwa.

6. Wedzera pre-pressure kana kutsiva pepa rekubatanidza.

7. Tarisa mutambo wekupisa uye gadzirisa kutonhora kwe stamper inopisa

3. Pane makomba, resin uye wrinkles pamusoro pebhodhi pamusoro

dambudziko rinokonzera:

1. Kushanda kusina kunaka kweLAY-UP, mvura inosvibisa pamusoro pesimbi yesimbi isina kupukuta yakaoma, zvichiita kuti foil yemhangura iwedzere;

2. Bhodhi repamusoro rinorasikirwa nekumanikidza kana uchitsikirira bhodhi, izvo zvinokonzera kurasikirwa kwakanyanya kweresin, kushaya glue pasi pefoil yemhangura, uye makwinya pamusoro pefoil yemhangura;

Solution:

1. Nyatsochenesa ndiro yesimbi uye unyoro pamusoro pefoil yemhangura;

2. Nyatsoteerera kurongeka kwepamusoro uye pasi mahwendefa ane mahwendefa paunenge uchironga mahwendefa, kuderedza kushandiswa kwekushanda, shandisa pasi RF% firimu, kupfupisa resin kuyerera nguva uye kukurumidza kupisa kupisa;

Chechina, iyo yemukati layer graphics inoshanduka

dambudziko rinokonzera:

1. Iyo yemukati pateni yemhangura foil ine yakaderera peeling simba kana kushomeka tembiricha kuramba kana mutsetse upamhi hwakanyanya kutetepa;

2. Pre-pressure yakanyanya; iyo dynamic viscosity ye resin idiki;

3. The press template haina kufanana;

Solution:

1. Chinja kune yepamusoro-yemukati-layer foil-clad board;

2. Deredza pre-pre-pressure kana kutsiva pepa rekunamatira;

3. Gadzirisa template;

shanu, ukobvu husina kuenzana, kutsvedza kwemukati

dambudziko rinokonzera:

1. Ukobvu hwese hwekugadzira ndiro yehwindo rimwe chete zvakasiyana;

2. Iyo yakaunganidzwa ukobvu kutsauka kwebhodhi rakadhindwa mubhodhi rekugadzira yakakura; iyo parallelism ye-hot-pressing template yakashata, iyo laminated board inogona kufamba zvakasununguka, uye iyo yose stack iri kubva pakati pe-hot-pressing template;

Solution:

1. Gadzirisa kune imwechete yakazara ukobvu;

2. Gadzirisa ukobvu, sarudza mhangura yakashongedzwa laminate nekutsauka kudiki ukobvu; gadzirisa kufananidzwa kweiyo inopisa-yakadzvanywa bhaisikopo bhodhi, kudzikisira rusununguko rwe-multi-mhinduro kune laminated board, uye edza kuisa laminate munzvimbo yepakati yeiyo inopisa-yakadzvanywa template;

Nhanhatu, interlayer dislocation

dambudziko rinokonzera:

1. Thermal kuwedzera kwemukati layer zvinhu uye resin inoyerera ye bonding sheet;

2. Kupisa kupisa panguva yelamination;

3. Thermal kuwedzera coefficient ye laminate zvinhu uye template zvakasiyana chaizvo.

Solution:

1. Dzora maitiro epepa rekunamatira;

2. Indiro yave yakapiswa-kupisa mberi;

3. Shandisa mukati memukati copper clad board uye bonding sheet ine yakanaka dimensional kugadzikana.

Seven, plate curvature, plate warpage

dambudziko rinokonzera:

1. Asymmetric chimiro;

2. Kusakwana kurapa kutenderera;

3. Nzira yekucheka yepepa rekubatanidza kana mukati memhangura yakavhara laminate inopesana;

4. Iyo yakawanda-layer board inoshandisa mahwendefa kana mashizha ekubatanidza kubva kune vakasiyana-siyana vanogadzira.

5. Bhodhi ye-multilayer inobatwa zvisina kunaka mushure mekuporesa uye kusunungura kudzvinyirira

Solution:

1. Shingairira symmetrical wiring design density uye symmetrical kuiswa kwe bonding sheets mu lamination;

2. Ita vimbiso yekurapa kutenderera;

3. Edza kutevedzera nzira yekucheka.

4. Zvichave zvinobatsira kushandisa zvinhu zvakagadzirwa nemugadziri mumwe chete mune imwe mold yakabatanidzwa

5. Iyo multilayer bhodhi inopisa kusvika kumusoro kweTg pasi pekumanikidzwa, uye yozochengetwa pasi pekumanikidzwa uye kutonhodzwa kusvika pasi pekamuri tembiricha.

Eight, stratification, kupisa stratification

dambudziko rinokonzera:

1. Kunyorova kwepamusoro kana kusvibiswa kwemukati mukati memukati;

2. High volatile content in adhesive sheet;

3. Kusvibiswa kwemukati; kusvibiswa kwezvinhu zvekunze;

4. Pamusoro peiyo oxide layer ine alkaline; pane masara ekloriti pamusoro;

5. Iyo oxidation haina kujairika, uye iyo oxide layer crystal yakarebesa; iyo pre-kurapwa haina kuumba nzvimbo yakakwana yepamusoro.

6. Kusakwana passivation

Solution:

1. Usati wapedza lamination, bika mukati kuti ubvise unyoro;

2. Kuvandudza nzvimbo yekuchengetedza. Pepa rekunamatira rinofanira kushandiswa mukati memaminitsi gumi nemashanu mushure mekubviswa kubva munzvimbo yekuomesa vacuum;

3. Kuvandudza mashandiro uye kudzivirira kubata iyo inoshanda nzvimbo yekubatana kwepamusoro;

4. Simbisa kuchenesa mushure mekushanda kweoxidation; tarisa kukosha kwePH yemvura yekuchenesa;

5. Kupfupisa nguva yeoxidation, gadzirisa kusangana kweiyo oxidation mhinduro kana shandisa tembiricha, wedzera micro-etching, uye gadzirisa mamiriro epamusoro.

6. Tevedzera zvinodiwa pakuita