PCB ho phunya ke mokhoa oa ho etsa lipoleiti tsa PCB, empa hape ke mohato oa bohlokoa haholo. Haholo-holo ho cheka boto, litlhoko tsa wiring, ho etsa mokoti, litlhoko tsa sebopeho, ho etsa lesoba ho etsa maemo; Ho cheka boto ea mekato e mengata ha se ho otloa, masoba a mang a patiloeng ka leboteng la potoloho, a mang ka sekepeng se kaholimo a feta, ka hona ho tla ba le sebolaea sa liboro tse peli.

Ho hlokahala ho cheka ho teba ts’ebetsong ea koporo, ke hore, ho roala sekoti ka koporo, e le hore likarolo tse ka holimo le tse ka tlaase li ka kopanngoa, tse kang ka sekoting, lesoba la pele, joalo-joalo.

Likoti tse peli tsa ho phunya ha li hloke ho tebisa masoba a koporo, joalo ka masoba a screw, masoba a ho beha maemo, sink ea mocheso, joalo-joalo, masoba ana ha a hloke ho ba le pokotho ea koporo. Mochini oa bobeli o lokela ho ba kamora oa pele, ke ho re mohato o arohane.

Mathata a tloaelehileng ka ho cheka PCB

1. Ho phunya khefu

Causes are: excessive spindle deflection; Ts’ebetso e sa nepahalang ea mochini oa ho phunya oa NC; Khetho ea nozzle ea ho cheka ha ea lokela; Lebelo la biti ha lea lekana mme sekhahla sa phepelo se seholo haholo. Ho na le mekato e mengata haholo; Ho na le li-sundries pakeng tsa boto le boto kapa ka tlas’a sekoahelo; Ha ho cheka botebo ba ho phunya ho tebile haholo ho fella ka ho phunya nozzle chip discharge e mpe e leketlileng; Linako tse ngata haholo tsa ho sila tsa nozzle ea ho cheka kapa ho feta bophelo ba tšebeletso; Poleiti ea sekoaelo e koetsoe ebile e sosobane, ‘me poleiti e tšehelitsoeng e kobehile ebile ha ea lekana; When fixing the substrate, the tape is too wide or the aluminum sheet and plate of the cover plate are too small; Lebelo la ho fepa le potlakile haholo ho baka extrusion; Improper operation when filling holes; Serious ash blocking under aluminum plate of cover plate; Setsi sa ntlha ea ho tjheseletsa se kheloha ho tloha bohareng ba mochini oa ho tirila.

2. Hole damage

Mabaka ke a latelang: nka nozzle ea ho cheka kamora ho roba nozzle ea ho cheka; No aluminum sheet or clamping back plate when drilling; Parameter error; Boro e telele; Bolelele bo sebetsang ba nozzle ea ho cheka ha bo khone ho kopana le botenya ba poleiti ea ho phunya. Ho phunya matsoho; Letlapa le khethehileng, pele batch e bakiloeng.

3. Ho kheloha ha lesoba, ho falla, ho se lumellane

Mabaka ke ana a latelang: lata ea ho cheka e kheloha nakong ea ho cheka; Improper selection of cover material, soft and hard discomfort; Lisebelisoa tsa motheo ho hlahisa shrinkage e bakoang ke ho kheloha ha lesoba; Ts’ebeliso e sa nepahalang ea lisebelisoa tse tšoanang tsa boemo; Ha cheka khatello ea maoto beha ka tsela e fosahetseng, otla Pin ho etsa tlhahiso poleiti poleiti; Resonance e etsahala nakong ea ts’ebetso ea ho cheka; Spring collet is not clean or damaged; Production poleiti, phanele a koala lesoba kapa kaofela spongebob koala; Thepa ea boro e ea thellela ha o tsamaisa sekoaelo sa sekwahelo. Mekhoro kapa likheo holim’a letlapa la aluminium la sekoaelo li hlahisa ho kheloha ha li tataisa molomo oa ho phunya ho theosa; Ha ho lithapo; Tšimoloho e fapaneng; Pampiri e khomarelang ha e khomaretsoe ka thata; Lilepe tsa X le Y tsa mochini oa ho phunya li na le ho kheloha ha motsamao; There is a problem with the program.

4. Sekoti se seholo, lesoba le lenyane, ho khopama ha lesoba

Mabaka ke: drill nozzle specification error; Lebelo le sa nepahalang la fepa kapa lebelo la potoloho; Ho senyeha ho feteletseng ha ntlha ea ho phunya; Too many times of regrinding of the drill nozzle or the bottom length of chip removing groove is lower than the standard; Tsela e feteletseng ea ho ohla; Mothapo oa ho phunya oa putlama, ‘me bophara ba lesoba bo ba kholoanyane; Bala hampe lesoba; Bophara ba lesoba ha boa ka ba lekanngoa ha ntlha ea ho betla e fetoloa; Drill bit alignment error; Kenya boemo bo fosahetseng ha u fetola nozzle ea ho cheka; Chate ea lesoba ha e hlahlojoe; Spindle sitoa ho beha thipa, ho fellang ka khatello thipa; Paramethara e kentse nomoro ea seriale e fosahetseng.

5. Ho cheka ho dutla

The reasons are as follows: drill break (unclear mark); Emisa bohareng; Phoso ea lenaneo; Hlakola lenaneo ka boomo; Mochine oa ho cheka o feletsoe ke lintlha tsa ho bala.

6. Ka pele

Lisosa ke tse latelang: Phoso ea Parameter; Drill nozzle apara ka botebo, lehare ha le bohale; Boima ba fatše ha boa lekana; Ho na le li-sundries lipakeng tsa substrate le substrate, substrate le poleiti e tlase; Poleiti botlaaseng e ikemiselitse ho etsa sekheo; Ha ho poleiti; Lisebelisoa tsa poleiti li khethehile.

7. Sekoti ha se phunye (eseng ka substrate)

Mabaka ke: botebo bo sa lokelang; Bolelele ba ho cheka ha boa lekana; Sethala se sa lekanang; Botenya bo sa lekaneng ba poleiti e tšehetsang; Thipa e robehileng kapa drill nozzle e robehileng halofo, lesoba ha le fete; Batch ka pele ka mokoting ka mor’a hore pula ea koporo e bope e sa bonahaleng; Spindle ts’oarello hlephileng, nakong ea ho cheka nozzle cheka ke khatello e khutšoanyane; Ha ho clamping tlase poleiti; Ha ho etsoa poleiti ea pele kapa masoba a ho tlatsa, mekotla e ‘meli e ile ea eketsoa, ​​e neng e sa fetoloe nakong ea tlhahiso.

Ho na le chip e tlanngoeng ka lotus holim’a poleiti ea sefahleho

Mabaka ke: ha ho poleiti ea sekoahelo kapa khetho e sa nepahalang ea mekhahlelo ea ho cheka.

9. Phula lesoba (plug lesoba)

Mabaka ke a latelang: bolelele bo sebetsang ba ho cheka bo-bit ha boa lekana; Botebo ba ho phunya ka har’a letlapa la mokokotlo bo tebile haholo; Mathata a li-substrate (metsi le litšila); Tšebeliso hape ea poleiti; Ka lebaka la maemo a sa lokang a ho e lokisa, joalo ka matla a lekaneng a lephaka; Sebopeho sa nozzle ea ho phunya ha se hantle; Lebelo la phepelo la ntlha ea drill le potlakile haholo mme ho phahama ha hoa nepahala.

10. Lerako la lesoba le thata

Mabaka ke a latelang: phepelo ea lijo e fetoha haholo; Sekhahla sa lijo se potlakile haholo; Improper selection of cover material; Fixed bit vacuum degree insufficient (air pressure); Sekhahla sa ho itšeha ha se tšoanelehe; Karolo ea ho itšeha ea ntlha Angle ea bit e robehile kapa e senyehile; Spindle deflection e kholo haholo; Ts’ebetso e mpe ea ts’ebetso ea chip.

11. Selikalikoe se sesoeu se hlaha pheletsong ea mokoti (mokato oa koporo ntlheng ea mokoti o arotsoe ho thepa ea motheo ebe oa phatloha)

Lisosa: ho cheka ho hlahisa khatello ea mocheso le matla a mochini a bakoang ke ho robeha ha substrate ea lehae; Lesela la khalase le lohiloeng boholo ba khoele e mahoashe; Boleng bo bobe ba thepa ea substrate (matlapa a maqephe); Palo ea lijo e kholo haholo; Nozzle ea ho cheka e hlephile, e thella ebile e tsitsitse; Ho na le marako a mangata haholo a stacking.

Tse kaholimo hangata ke bothata ba tlhahiso ea ho cheka, ts’ebetsong ea ‘nete e lokela ho ba litekanyo le tlhahlobo e eketsehileng. Ka nako e ts’oanang, ts’ebetso e tsitsitseng e tsitsitseng e na le molemo o moholo ho laola ho hlōleha ha boleng ba tlhahiso ea sekoti sa ho cheka, ho ntlafatsa boleng ba sehlahisoa, ho ntlafatsa katleho ea tlhahiso, hape ho na le thuso e kholo.