PCB ukubhola yinkqubo yokwenza ipleyiti yePCB, kodwa inyathelo elibaluleke kakhulu. Ngokukodwa kwibhodi yokugaya, iimfuno ze-wiring, ukwenza umngxuma, iimfuno zesakhiwo, yenza umngxuma wokwenza ukubeka; Ukubholwa kwebhodi eyahlukeneyo ayisiyo hit, eminye imingxunya engcwatyelwe kwibhodi yesekethe, eminye ebhodini ngasentla iyagqitha, ke kuyakubakho ukombiwa kweebhola ezimbini.

I-drill iyadingeka ukucwina inkqubo yobhedu, oko kukuthi, ukugubungela umngxuma ngobhedu, ukwenzela ukuba iileyile ezingaphezulu nezisezantsi zinokudityaniswa, njengokungena komngxuma, umngxuma wokuqala, njl.

Imingxuma emibini yokugaya ayifuni ukutshona imingxuma yobhedu, efana nemingxuma yesikrufu, imingxuma yokubeka indawo, isinki yobushushu, njl., le mingxunya ayifuni ukuba nepokotho yobhedu. I-drill yesibini kufuneka ibe ngasemva kweyokuqala, oko kukuthi, inkqubo iyahlukana.

Iingxaki eziqhelekileyo nge-PCB yokomba

1. Ikhefu le-drill

Causes are: excessive spindle deflection; Ukusebenza gwenxa komatshini wokugrumba we-NC; Ukukhetha umbhobho wokubhola akufanelekanga; Isantya sebhitri asonelanga kwaye inqanaba lokutya likhulu kakhulu. Iileya ezininzi zokupakisha; Kukho iisundries phakathi kwebhodi kunye nebhodi okanye phantsi kweplate yokugubungela; Xa kusetyenzwa ubunzulu bokusonta bunzulu kakhulu kukhokelela ekugrumbeni umbhobho wetshiphu ukhuphe ukujinga okubi; Amaxesha amaninzi okusila wombhobho wokugrumba okanye ngaphaya kobomi benkonzo; Icwecwe lokugquma liyakrwelwa kwaye lishwabene, kwaye i-backing plate igobile kwaye ayilingani; When fixing the substrate, the tape is too wide or the aluminum sheet and plate of the cover plate are too small; Isantya sokutya sikhawuleza kakhulu ukuba sibangele i-extrusion; Improper operation when filling holes; Serious ash blocking under aluminum plate of cover plate; Umbindi we-welding drill tip uyatenxa kumbindi we-drill handle.

2. Hole damage

Izizathu zezi zilandelayo: thatha i-drill nozzle emva kokuphula i-drill nozzle; No aluminum sheet or clamping back plate when drilling; Parameter error; I-drill inde; Ubude obusebenzayo bombhobho we-drill abukwazi ukuhlangabezana nobukhulu bepleyiti yokubhoboza. Ukubhola ngesandla; Isitya esikhethekileyo, ibhetshi ebangelwa ngaphambili.

3. Ukuphambuka komngxunya, ukutshintsha, ukungalungelelani kakuhle

Izizathu zezi zilandelayo: intwana yokomba iyaphambuka ngexesha lokomba; Improper selection of cover material, soft and hard discomfort; Izinto ezisisiseko ukuvelisa ukuncipha okubangelwa kukuphambuka komngxuma; Ukusetyenziswa ngokungafanelekanga kwezixhobo zokumisa ukumatanisa; Xa unyawo loxinzelelo lokugaya lubekwe ngendlela engafanelekanga, shaya i-pin ukwenza ipleyiti yokuvelisa ihambe; Ukuvakala kwakhona kwenzeka ngexesha lokusebenza kombane; Spring collet is not clean or damaged; Ipleyiti yokuvelisa, umngxunya wepaneli okanye i-stack offset yonke; Isilayidi sokugrumba xa uqhuba ipleyiti yokuqhagamshela. Imikrwelo okanye indawo ekrwada ebusweni bephepha le-aluminium yeleta yokugquma yemveliso yokuphambuka xa ukhokela umlomo wombhobho wokugrumba; Akukho zikhonkwane; Imvelaphi eyahlukileyo; Iphepha lokubambelela alincamathelanga ngokuqinileyo; I-X kunye nee-axes zomatshini wokugrumba zinokuphambuka kokuhamba; There is a problem with the program.

4. Umngxunya omkhulu, umngxunya omncinci, ukugqwethwa komngxuma

Izizathu zezi: impazamo yemilomo yemilomo yokugrumba; Isantya sokutya esingafanelekanga okanye isantya sokujikeleza; Ukugqithisa ngokugqithiseleyo i-drill tip; Too many times of regrinding of the drill nozzle or the bottom length of chip removing groove is lower than the standard; Ukugqwetha okungaphezulu kokuluka ngokwako; I-tip ye-drill iyancipha, kwaye ububanzi bomngxuma buba bukhulu; Ungafundi kakuhle umngxuma; Ububanzi bomngxuma abulinganiswa xa itshintshi incam yokugrumba; Drill bit alignment error; Faka indawo engalunganga xa utshintsha i-drill nozzle; Itshathi yokuvula ayikhange ihlolwe; I-Spindle ayikwazi ukubeka imela, ibangele imela yoxinzelelo; Ipharamitha ifake inombolo yesiriyeli engalunganga.

5. Ukubhola ukuvuza

The reasons are as follows: drill break (unclear mark); Nqumama phakathi; Impazamo yenkqubo; Inkqubo ngokungacwangciswanga; Izixhobo zokumba zilahlekile idatha yokufunda.

6. Ngaphambili

Izizathu zezi zilandelayo: Impazamo yeparameter; Umlomo wombhobho unxibe ngokungathandekiyo, ikhaba alibukhali; Ukuxinana komgangatho akwanelanga; Kukho iisundries phakathi kwe-substrate kunye ne-substrate, i-substrate kunye neplate esezantsi; I-plate yesiseko igobile ukwenza i-void; Akukho ipleyiti yokugubungela; Izinto zeplate zizodwa.

7. Umngxunya awutyhoboziwe (hayi nge-substrate)

Izizathu zezi: ubunzulu obungafanelekanga; Ubude be-drill abonelanga; Iqonga elingalinganiyo; Ubungakanani obungalinganiyo beplate yokuxhasa; Imela eyaphukileyo okanye umlomo we-drill owaphukileyo, umngxunya awukho; Ibhetshi yangaphambili emngxunyeni emva kokuba imvula yobhedu yenze i-opaque; Othini yokuluka evakalala, kwinkqubo kusombiwa ngemilomo esatsiba ngumfutho; Akukho nokubotshwa ezantsi ipleyiti; Xa kusenziwa ipleyiti yokuqala okanye imingxunya yokugcwalisa, kongezwa iipads ezimbini, ezingatshintshwanga ngexesha lokuvelisa.

Kukho i-lotus-tie curling chip kwipleyiti yobuso

Izizathu zezi: akukho cwecwe lokusibekela okanye ukhetho olungafanelekanga lweeparamitha zenkqubo yokomba.

9.Umngxunya weplagi (umngxunya weplagi)

Izizathu zezi zilandelayo: ubude obusebenzayo bot drill abonelanga; Ubunzulu boqweqwe kwisitya esixhaswayo bunzulu kakhulu; Iingxaki zezinto ze-substrate (amanzi kunye nokungcola); Ukusetyenziswa kwakhona kwepleyiti; Ngenxa yeemeko ezingalunganga zokuqhubekeka, njengokungoneli kwamandla ombane; Ubume bombhobho we-drill abulungile; Isantya sokondla incam yokomba ikhawuleza kakhulu kwaye ukunyuka akulunganga.

10. Udonga olubi lomngxuma

Izizathu zezi zilandelayo: ubungakanani besondlo butshintsha kakhulu; Isantya sokondla siyakhawuleza kakhulu; Improper selection of cover material; Fixed bit vacuum degree insufficient (air pressure); Isantya sokusika asifanelekanga; Umda wokusika wencam I-Angle yesuntswana yaphukile okanye yonakele; Othini ukuphambuka mkhulu kakhulu; Ukusebenza kakubi kokukhutshwa kwe-chip.

11. Isangqa esimhlophe sibonakala ekupheleni komngxuma (uluhlu lobhedu ekupheleni komngxuma luhlukaniswe kwizinto ezisisiseko kwaye luqhume umgodi)

Izizathu: ukugaya kuvelisa uxinzelelo lwe-thermal kunye namandla omatshini okubangelwa ukuphuka kwendawo ye-substrate; Ilaphu leglasi elilukiweyo ubukhulu lirhabaxa; Umgangatho ombi wezinto ze-substrate (izinto zeshiti); Ubungakanani bokutya bukhulu kakhulu; Umbhobho wokugrumba ukhululekile kwaye uyatyibilika kwaye ulungisiwe; Maninzi kakhulu amaqhekeza

Oku ngasentla kudla ngokuba yingxaki kwimveliso yokugaya, ekusebenzeni kwangempela kufuneka kube nomlinganiselo kunye nokuhlolwa okungakumbi. Kwangelo xesha, ukusebenza ngokungqongqo okusemgangathweni kuluncedo olukhulu ukulawula ukusilela komgangatho wemveliso yokubhola umngxunya, ukuphucula umgangatho wemveliso, ukuphucula ukusebenza kwemveliso, kunye noncedo olukhulu.