ʻO ka ʻoiaʻiʻo, ʻo ka hana maʻamau impedance he 10% deviation. Hiki i kahi mea koʻikoʻi ke loaʻa i ka 8%. Nui nā kumu:

1. ʻO ka hoʻokaʻawale ʻana o ka mea pepa ponoʻī

2. Etching deviation in PCB aaioee

3. Deviations e like me ke kahe kahe i hanaʻia e ka lamination i ka wā PCB hana

4. Ma ke kiʻekiʻe wikiwiki, ka roughness o ka ili o ke keleawe foil, ke aniani fiber hopena o PP, ka DF pinepine hoʻololi hopena o ka waena, etc.

No ka hoʻomaopopo ʻana i ka impedance, pono ʻoe e hoʻomaopopo i ka hana ʻana. Ma nā ʻatikala e hiki mai ana, e nānā kākou i kekahi ʻike o ka hana ʻana. E nānā ka mea mua i ka lamination:

1. The principle of PCB pressing

ʻO ke kumu nui o ka lamination ʻo ia ka hoʻohui ʻana i ka PP me nā papa ʻokoʻa o loko a me nā ʻāpana keleawe o waho ma o ka “wela a me ke kaomi”, a hoʻohana i ka foil keleawe o waho e like me ke kumu o ka kaapuni waho. A hiki ke hoʻolako ʻia nā ʻano like ʻole o ka PP me nā pā i loko a me ke keleawe ʻili me nā kikoʻī like ʻole a me ka mānoanoa o nā papa kaapuni. ʻO ke kaʻina hana kaʻina hana koʻikoʻi i ka hana ʻana i nā papa multilayer PCB, a pono e hoʻokō i nā hōʻailona kumu o ka PCB ma hope o ke kaomi ʻana.

1. Mānoanoa: Hāʻawi i ka insulation uila pili, ka mana impedance, a me ka hoʻopiha ʻana i ke kāpili ma waena o nā papa o loko.

2. Hoʻohui: E hoʻolako i ka hoʻopaʻa ʻana me ka ʻeleʻele o loko (brown) a me waho o ke keleawe keleawe.

3. Ke kūpaʻa o ka dimensional: ʻO ka hoʻololi ʻana o ka nui o kēlā me kēia ʻāpana i loko e kūlike e hōʻoia i ka alignment o nā puka a me nā apo o kēlā me kēia papa.

4. Papa Warping: E ​​mālama i ka palahalaha o ka papa.

2. PCB kaomi kaʻina hana

ʻO nā kūlana e pono e hoʻokō no ke kaʻina hana kaomi

A. Nā kūlana waiwai:

Hana ʻia ka papa kumu i loko o ke ʻano conductor

Pāpaʻi keleawe

Kūkaukau

B. Process conditions:

ke ana wela

ka piʻi nui

3. Hoʻomaka i ka PP o nā mea laminated

maʻamau:

Nā waiwai o prepreg

A. RC% (Resin content): refers to the weight percentage of the resin component in the film except for the glass cloth. The amount of RC% directly affects the resin’s ability to fill the gaps between the wires, and at the same time determines the thickness of the dielectric layer after pressing the board.

B. RF% (Resin flow): e pili ana i ka pakeneka o ka resin e kahe ana mai loko mai o ka papa i ka huina kaumaha o ka prepreg mua ma hope o ke kaomi ʻana i ka papa. ʻO RF% kahi kuhikuhi e hōʻike ana i ka wai o ka resin, a hoʻoholo pū i ka mānoanoa o ka papa dielectric ma hope o ke kaomi ʻana i ka pā.

C. VC% (maʻiʻo volatile): pili i ka pākēneka o ke kaumaha kumu o nā ʻāpana volatile i nalowale ma hope o ka maloʻo ʻana o ka prepreg. Hoʻopili pololei ka nui o VC% i ka maikaʻi ma hope o ke kaomi ʻana.

Launch:

1. E like me ka mea hoʻopaʻa paʻa o nā papa o loko a me waho.

2. Hāʻawi i kahi mānoanoa o ka papa insulating kūpono. Hoʻokumu ʻia ke kiʻiʻoniʻoni me ka lole fiber aniani a me ka resin. ʻO ka ʻokoʻa mānoanoa o ke aniani fiber lole kiʻiʻoniʻoni ma hope o ke kaomi ʻana i hoʻoponopono nui ʻia e ka ʻokoʻa resin ʻokoʻa ma mua o nā kūlana paʻi.

3. Mana impedance. Ma waena o nā kumu nui e hoʻohuli ai, ʻo ka waiwai Dk a me ka mānoanoa o ka papa dielectric e hoʻoholo ʻia e nā ʻano o ke kiʻiʻoniʻoni. Hiki ke helu ʻia ka waiwai Dk o ke kiʻiʻoniʻoni i hoʻokumu ʻia e kēia ʻano kumu.

Dk=6.01-3.34RR: Maʻiʻo resin%

No laila, hiki ke helu ʻia ka waiwai Dk i ka wā e hoʻohālikelike ai i ka impedance ma muli o ka ratio o ka lole fiber aniani a me ka resin i loko o ka hui kiʻi laminated.

Ua helu ʻia ka mānoanoa maoli o PP ma hope o ka hoʻopiha ʻana penei:

Ka mānoanoa ma hope o ke kaomi ʻana iā PP

1. Mānoanoa = theoretical mānoanoa o hookahi PP-hoopiha poho

2. Filling loss = (1-A surface inner layer copper foil residual copper rate) x inner layer copper foil thickness + (1-B surface inner layer copper foil residual copper rate) x inner layer copper foil thickness/3, inner layer Residual copper rate = inner wiring area / entire board area

ʻO ke koena keleawe o nā papa ʻelua i loko o ke kiʻi ma luna nei penei:

E ʻoluʻolu e hoʻolohe i ke ʻano o luna. Inā mākou e helu ana i ka hoʻopiha piha ʻana o ka papa waho lua, pono mākou e helu i hoʻokahi ʻaoʻao, ʻaʻole ke koena keleawe o ka papa waho. penei:

Pohō ka hoʻopiha ʻana = (1-ʻoi aku ka nui o ke keleawe keleawe i loko) x ka mānoanoa o ka ʻili keleawe i loko.

Hoʻolālā hoʻolālā hoʻoemi

(1) Manaʻo ʻia ka ʻiʻo lahilahi me ka mānoanoa nui (ʻoi aku ka maikaʻi o ke kūpaʻa ʻana)

(2) Ua makemake ʻia ka PP haʻahaʻa haʻahaʻa (no ka ʻano lole aniani like PP, ʻaʻole pili ka ʻike resin i ke kumukūʻai)

(3) ʻOi aku ka maikaʻi o ka hoʻolālā symmetrical e pale i ka warpage PCB ma hope o ka pau ʻana o ka huahana. ʻO ke kiʻi ma lalo nei he hale paʻa ʻole a ʻaʻole paipai ʻia.

(4) ʻO ka mānoanoa o ka papa dielectric》ka mānoanoa o ka pahu keleawe i loko × 2

(5) ʻAʻole ʻae ʻia ka hoʻohana ʻana i ka PP me ka haʻahaʻa resin haʻahaʻa i loko o ka pepa hoʻokahi ma waena o nā papa 1-2 a me nā papa n-1/n, e like me 7628 × 1 (n ka helu o nā papa)

(6) No 3 a ʻoi aku ka prepregs i hoʻonohonoho pū ʻia a i ʻole ka mānoanoa o ka papa dielectric i ʻoi aku ma mua o 25 mils, koe wale no nā papa waho a me loko o PP, ua hoʻololi ʻia ka waena PP e kahi papa kukui.

(7) Aia ka lua o ka papa a me ka n-1 papa he 2oz lalo keleawe a me ka mānoanoa o ka 1-2 a me n-1/n papa o ka insulating papa i emi iho ma mua o 14mil, ua kapu ka hoohana hookahi PP, a me ka waho loa. Pono ka papa e hoʻohana i ka PP resin kiʻekiʻe. E like me 2116, 1080; inā ʻoi aku ka liʻiliʻi o ke koena keleawe ma mua o 80%, e hoʻāʻo e pale i ka hoʻohana ʻana i hoʻokahi 1080PP

(8) ʻO ka papa i loko o ka papa keleawe 1oz, ke hoʻohana ka 1-2 layer a me ka n-1 / n layer i ka 1 PP, pono ka PP e hoʻohana i ka ʻike resin kiʻekiʻe, koe wale 7628 × 1

(9) ʻAʻole pāpā ʻia ka hoʻohana ʻana i hoʻokahi PP no nā papa me ke keleawe i loko ≥ 3oz. ʻO ka maʻamau, ʻaʻole hoʻohana ʻia ka 7628. Pono e hoʻohana ʻia nā PP he nui me ka ʻike resin kiʻekiʻe, e like me 106, 1080, 2116…

(10) No nā papa multilayer me nā wahi keleawe ʻole i ʻoi aku ma mua o 3″×3″ a i ʻole 1″×5″, ʻaʻole hoʻohana ʻia ʻo PP ma ke ʻano he pepa hoʻokahi ma waena o nā papa kumu.