Muchokwadi, iyo impedance control routine ndeye 10% kutsauka. Imwe yakaomesesa zvishoma inogona kuwana 8%. Pane zvikonzero zvakawanda:

1. Kutsauka kwepepa zvinhu pachayo

2. Etching kutsauka mukati PCB kugadzira

3. Kutsauka kwakadai seyekuyerera kunokonzerwa nelamination panguva PCB kugadzirisa

4. Pakumhanya kukuru, kushata kwepamusoro pefoiri yemhangura, iyo girazi fiber mhedzisiro yePP, iyo DF frequency shanduko mhedzisiro yepakati, nezvimwe.

Kuti unzwisise impedance, unofanirwa kunzwisisa kugadzirisa. Muzvinyorwa zvishoma zvinotevera, ngatitarisei rumwe ruzivo rwekugadzirisa. Yokutanga inotarisa lamination:

1. Nheyo yePCB yekudzvanya

Chinangwa chikuru chelamination ndechekubatanidza PP nemabhodhi akasiyana emukati emukati uye ekunze mapepi emhangura kuburikidza ne “kupisa nekumanikidza”, uye kushandisa yekunze foil yemhangura sehwaro hwedunhu rekunze. Uye akasiyana PP kuumbwa neakasiyana emukati ndiro uye pamusoro pemhangura inogona kuve yakashongedzwa neakasiyana maratidziro uye ukobvu hwemabhodhi edunhu. Iyo yekutsikirira ndiyo inonyanya kukosha maitiro mukugadzirwa kwePCB multilayer mabhodhi, uye inofanirwa kusangana neiyo yekutanga mhando zviratidzo zvePCB mushure mekudzvanya.

1. Hukobvu: Inopa zvine chekuita nemagetsi ekudzivirira, impedance control, uye glue kuzadza pakati pematanho emukati.

2. Musanganiswa: Ipai chisungo nechemukati dema (brown) uye kunze kwemhangura foil.

3. Dimensional kugadzikana: Kuchinja kwechidimbu chemukati wega wega wemukati kunopindirana kuti kuve nechokwadi kurongeka kwemakomba uye zvindori zvega rega rega.

4. Bhodhi warping: Chengetedza flatness yebhodhi.

2. PCB kudzvanya maitiro

Mamiriro ezvinhu anofanirwa kusangana nekutsikirira

A. Mamiriro ezvinhu:

Iyo yemukati bhodhi bhodhi yemuenzaniso we conductor inogadzirwa

Mhangura foil

Prepreg

B. Maitiro ekugadzirisa:

kupisa kwakanyanya

high pressure

3. Nhanganyaya kuPP ye laminated material

hunhu:

Properties of prepreg

A. RC% (Resin content): inoreva huremu hwehuwandu hwechikamu cheresin mufirimu kunze kwejira regirazi. Kuwanda kweRC% kunokanganisa zvakananga kukwanisa kwe resin kuzadza mapeji pakati petambo, uye panguva imwechete inotarisa kukora kwedielectric layer mushure mekutsikirira bhodhi.

B. RF% (Resin flow): inoreva chikamu cheresin inoyerera ichibuda mubhodhi kune huremu hwese hwekutanga prepreg mushure mekudzvanya bhodhi. RF% indekisi inoratidza kuyerera kweresin, uye zvakare inotaridza ukobvu hweiyo dielectric layer mushure mekudzvanya ndiro.

C. VC% (volatile content): inoreva chikamu chehuremu hwepakutanga hwezvikamu zvinoputika zvakarasika mushure mokunge prepreg yaoma. Huwandu hweVC% hunobata zvakananga kunaka mushure mekudzvanya.

basa:

1. Sechisungo chekubatanidza chemukati nekunze.

2. Ipa yakakodzera insulating layer ukobvu. Iyo firimu inoumbwa negirazi fiber jira uye resin. Musiyano weukobvu weiyo yakafanana girazi fiber jira firimu mushure mekutsikirira inonyanya kugadziridzwa neyakasiyana resin yemukati kwete mamiriro ekudzvanya.

3. Impedance control. Pakati pezvinhu zvikuru zvina zvinopesvedzera, iyo Dk kukosha uye kukora kweiyo dielectric layer inotarwa nehunhu hwefirimu. Iyo Dk kukosha kweiyo firimu yakaumbwa inogona kuverengerwa kuverengerwa neinotevera formula.

Dk=6.01-3.34RR: Resin content%

Naizvozvo, iyo Dk yakakosha inoshandiswa pakufungidzira iyo impedance inogona kuverengerwa zvichienderana nechiyero chegirazi fiber jira uye resin mune laminated film musanganiswa.

Iko kukora chaiko kwePP mushure mekuzadza kunoverengerwa sezvizvi:

Hukobvu mushure mePP kudzvanya

1. Ukobvu = theoretical thicken of single PP-kuzadza kurasikirwa

2. Kuzadza kurasikirwa = (1-A pamusoro pemukati pepa remhangura foil residual copper rate) x yemukati layer yemhangura foil ukobvu + (1-B pamusoro pemukati mbiru foil residual copper rate) x yemukati layer yemhangura foil ukobvu/3, yemukati layer Residual chiyero chemhangura = yemukati wiring nzvimbo / nzvimbo yese yebhodhi

Miyero yemhangura yasara yezvikamu zviviri zvemukati mumufananidzo uri pamusoro apa ndeaya anotevera:

Ndapota teerera kune formula iri pamusoro. Kana isu tichiverenga kurasikirwa kwekuzadza kweyechipiri yekunze kwekunze, isu tinongoda kuverenga rumwe rutivi, kwete yakasara yemhangura chiyero chekunze. sezvinotevera:

Kuzadza kurasikirwa = (1-yemukati mhangura foil yakasara yemhangura mwero) x mukati memhangura foil ukobvu

Kudzvinyirira chimiro dhizaini

(1) Nheyo yakatetepa ine gobvu hombe inosarudzwa (zvinei zviri nani dimensional kugadzikana)

(2) Iyo yakaderera-mutengo PP inosarudzwa (yeiyo yakafanana girazi jira rudzi PP, iyo resin yemukati haina kukanganisa mutengo)

(3) Iyo symmetrical chimiro inosarudzwa kudzivirira PCB warpage mushure mekupedza chigadzirwa. Chimiro chinotevera chimiro chisina chiyero uye hachikurudzirwe.

(4) Kukora kwedielectric layer》ukobvu hwemukati mendarira foil×2

(5) Hazvibvumirwi kushandisa PP ine yakaderera resin content mune imwe pepa pakati pe 1-2 layers uye n-1 / n zvidimbu, zvakadai se7628 × 1 (n ndiyo nhamba yezvikamu)

(6) Kune 3 kana kupfuura prepregs yakarongedzwa pamwe chete kana ukobvu hweiyo dielectric layer yakakura kupfuura 25 mils, kunze kweiyo yekunze uye yemukati-kati yePP, iyo yepakati PP inotsiviwa nechiedza bhodhi.

(7) Kana chikamu chechipiri uye n-1 layer iri 2oz pasi mhangura uye ukobvu hwe1-2 uye n-1/n zvidimbu zve insulating layer iri pasi pe14mil, zvinorambidzwa kushandisa imwe PP, uye yekunze. layer inoda kushandisa yakakwira resin yemukati PP. Zvakadai se2116, 1080; kana mhangura yasara iri pasi pe80%, edza kudzivirira kushandisa imwechete 1080PP.

(8) Iyo yemukati yemukati yendarira 1oz bhodhi, apo 1-2 layer uye n-1 / n layer inoshandisa 1 PP, iyo PP inoda kushandisa yakakwira resin content, kunze kwe7628 × 1.

(9) Inorambidzwa kushandisa PP imwe chete yemapuranga ane mukati memhangura ≥ 3oz. Kazhinji, 7628 haisi kushandiswa. Multiple PPs ane yakakwira resin yemukati inofanirwa kushandiswa, senge 106, 1080, 2116…

(10) Kumabhodhi akawanda ane nzvimbo dzisina mhangura dzinopfuura 3 ″ × 3 ″ kana 1 ″ × 5 ″, PP haiwanzo shandiswa sepepa rimwechete pakati pemabhodhi epakati.