Dzvuku glue iganda re polyene. Kusiyana nesoder paste, inorapwa painopisa. Yaro inotonhora inotonhora tembiricha iri 150 ℃, panguva ino, tsvuku glue inotanga kuomarara yakananga kubva kunama. Glue yakatsvuka ndeye SMT zvinhu. Ichi chinyorwa chinokutungamira iwe kuti unzwisise kuti chii chakatsvuka glue pane Pcb bhodhi, basa rei tsvuku yakanamirwa paPCB, basa reiyo tsvuku paPBB SMT kugadzirisa uye SMT tsvuku glue yakajairika maitiro.

What is the red glue on the PCB board?

Mune SMT uye DIP yakavhenganiswa maitiro, kuitira kudzivirira imwechete-padivi kudzoreredza mutserendende, wave soldering kamwe kaviri pamusoro peiyo mamiriro ezvinhu, muPCB wave wave soldering pamusoro chip zvikamu, pakati penzvimbo inoona tsvuku glue, inogona kunge ichiumbika kamwechete tini, ponesa iyo solder yekudhinda yekudhinda maitiro.

SMT “red glue” maitiro? Chaizvoizvo, iro zita chairo rinofanirwa kunge riri SMT “ichipa” maitiro. Mazhinji ekunamatira akatsvuka, saka inowanzozivikanwa se “red namira”. Muchokwadi, kune zvakare yeyellow namira, iyo yakafanana sezvo isu tinowanzo daidza “solder mask” pamusoro penzvimbo yedunhu “green pendi”.

What is the red glue on PCB board? What is the function of red glue on PCB?

Tinogona kuona kuti pane huwandu hweguru tsvuku pakati pezvikamu zvidiki zveanopikisa uye ma capacitors. Iri iguru tsvuku. Iyo tsvuku glue maitiro yakagadziriswa nekuti paive nezvakawanda zvemagetsi zvinhu izvo zvaisakwanisa kutamiswa pakarepo kubva kune yekutanga DIP package kuenda kune SMD package.

Dunhu redunhu rine hafu yezvikamu zveDIP uye hafu yezvikamu zveSMD. Unoisa sei izvo zvikamu kuitira kuti zvigone kugadziriswa zviri nyore kubhodhi? The general practice is to design all the DIP and SMD parts on the same side of the board. The SMD parts are printed with solder paste and then welded back to the furnace. The rest of the DIP parts can be welded all at once using the wave soldering furnace process because all the pins are exposed on the other side of the board. Saka tinoda nhanho mbiri dzekutungidza pakutanga kuti zvinhu zvese zvisunganidzwe.

Kuti uchengetedze pcb yekumisikidza nzvimbo, tinotarisira kuisa zvimwe zvinhu mairi. Naizvozvo, zvishandiso zveSMT zvinodawo kuiswa pazasi pePasi. Kuti ubatanidze zvikamu kubhodhi redunhu uye kuti utore bhodhi redunhu kuburikidza neWave Soldering furnace, kuti uibatanidze padhadha rekunamatira uye kuti urege kuwira muvira rinopisa reSave.

Kuti tideredze tekinoroji maitiro, isu tinotarisira kupedzisa iyo simbi panguva imwechete. Through-hole reflow soldering is possible, but many of our plugins cannot withstand the high temperatures of reflow soldering. Therefore, through-hole reflow welding is not possible. Therefore, it is only possible to consider through-hole reflow welding for the bulk products of some large companies, because they can purchase some high-priced plug-in components that can withstand high temperatures.

Uye zvakajairika zvikamu zveSMD nekuti zvakagadzirirwa kutsigira tembiricha yekudzora sarufa, tembiricha yekudzosera simbi iri pamusoro kupfuura tembiricha yemasaisai, saka zvikamu zveSMD zvakasara mumoto wekuzungunusa gaba, kunyangwe kwenguva pfupi zvakare hazvizove nematambudziko. , asi hapana nzira yekugadzira kudhinda paserita kunge ine choto cheSMD wave, nekuti tembiricha yechitofu inofanira kunge iri pamusoro pekupisa tembiricha yepasita, Izvi zvinokonzeresa kuti chikamu cheSMD chisvike uye chiwire mukati mevira remoto.

Naizvozvo, isu tinofanirwa kutanga tagadzirisa iyo SMD chishandiso, saka tinoshandisa tsvuku glue.

What is the role of red glue on PCB?

1. Red glue generally plays a fixed and auxiliary role. Kugadziriswa ndiyo chaiyo yekumonera.

2. Wave soldering yekudzivirira zvikamu kubva pakuwa (wave soldering process). Kana wave soldering ichishandiswa, chinongedzo chakatemerwa kune rakadhindwa bhodhi kudzivirira icho chikamu kubva kudonha sezvo bhodhi richipfuura nepasolder groove.

3. Reflow Welding yekudzivirira iro rimwe divi rezvinhu kudonha (kaviri-mativi reflow kutenderera maitiro). Mune maviri-mativi Reflow Welding maitiro, kudzivirira makuru madhijidhi parutivi rwakasungirirwa kuti rirege kudonha nekuda kwekupisa kwekunyungudika kwesodera, zvakakosha kuve ne SMT yekunamatira.

4. Dzivirira zvikamu kubva mukumira nekumira (reflow welding process, pre-coating process). Inoshandiswa mukudzoreredza maitiro uye precoating maitiro ekudzivirira kusuduruka uye yakatwasuka ndiro panguva yekumisikidza.

5, mark (wave soldering, reflow welding, precoating). Uye zvakare, yakadhindwa bhodhi uye echikamu batch shanduko, ine chigamba chinonamira chekumaka.

Ndechipi chinzvimbo cheguru tsvuku muPCB chigamba kugadzira?

Patch yekugadzirisa mumiririri zvakare chigamba kugadzirisa tsvuku glue, kazhinji tsvuku (yero kana chena) kunama zvakaenzana zvakagoverwa hardener, pigment, solvent uye mamwe anonamatira, anonyanya kushandiswa kukanda zvigadzirwa zvekugadzirisa zvakamisikidzwa pane rakadhindwa bhodhi, kazhinji ichipa kana simbi skrini yekudhinda nzira yekugovera . Batanidza izvo zvikamu uye uzviise muchoto kana kudzoreredza vira kuti upise uye kuomesa.

Patch yekugadzirisa chigamba chinonamatira ndiko kupisa mushure mekurapa, chigamba kugadzirisa solidification tembiricha inowanzoita madhigirii zana nemakumi mashanu, kudzorerazve hakuzonyungudike, ndiko kuti, chigamba chinogadziridza chakatsiga kuomesa maitiro hakugadzirisike. Iyo yekugadzirisa mhedzisiro yechigamba chichava chakasiyana nekuda kweanopisa mamiriro ekurapa, kubatana, zvishandiso zvinoshandiswa, uye nharaunda yekushandisa. Iyo yekunamatira chigamba inofanirwa kusarudzwa zvinoenderana neyakadhindwa wedunhu bhodhi gungano () maitiro.

Patch inogadzira tsvuku glue chinhu chemakemikari, chinonyanya kuve chakaumbwa nemapolymer zvinhu. Patch processing filler, curing agent, other additives, etc. Patch processing red adhesive has viscosity fluidity, temperature characteristics, wetting characteristics and so on. Zvinoenderana nehunhu hweglue yakatsvuka mukugadziriswa kweSMT, chinangwa chekushandisa yakatsvuka glue mukugadzira kuita kuti zvikamu zvinamatire zvakasimba paPCB uye zvidzivirire kubva pakuwa.

Patch kugadzirisa tsvuku glue is a pure consumption material, kwete chigadzirwa chinodikanwa cheichi chiitiko, ikozvino nekuenderera kunovandudzika kwenzvimbo inokwidziridzwa dhizaini uye tekinoroji, chigamba kugadzirisa kuburikidza negomba reflow welding, yakapetwa-mativi Reflow Welding zvave zvichizadzikiswa, kushandiswa kwechigamba kugadzirisa chigamba chinonamira kumisikidza maitiro ishoma uye zvishoma maitiro.

SMT red glue standard process

SMT red glue production standard process is: screen printing → (dispensing) → mounting → (curing) → reflow welding → cleaning → detection → repair → completion.

1. Screen kudhinda Iyo michina inoshandiswa iscreen yekudhinda muchina (skrini yekudhinda muchina), iri pamberi peye SMT yekugadzira mutsara.

2. Kugovera: ndiyo tsvuku inonongedzera kune yakatarwa chinzvimbo chePBB, basa rayo guru kugadzirisa zvikamu zvebhodhi rePCBB. Muchina wekupa uripo kumberi kwekupedzisira kweiyo SMT yekugadzira mutsara kana kuseri kwemidziyo yekuyedza.

3. Kubhururuka: basa rayo nderekuisa nenzira kwayo gungano repamusoro pazvinhu zvakatarwa zvePCB. Iyo michina inoshandiswa ndeye SMT muchina, iri kuseri kwechidzitiro yekudhinda muchina mune yeSMT yekugadzira mutsara.

4.Kurapa: basa rayo ndere kunyungudutsa tsvuku inonamira (chigamba namira), kuitira kuti pamusoro gungano zvikamu uye pcb bhodhi zvakabatanidzwa zvakabatana. Iyo michina inoshandiswa ndiyo yekuporesa vira, iri kuseri kweSMT muchina muSMT mutsara.

5. Reflow welding: its function is to melt solder paste (solder paste), so that the surface assembly components and PCB board firmly bonded together. Icho chinopisa moto chiri kuseri kwemushini weSMT mune iyo SMT mutsara.

6.Kuchenesa: basa rayo ndere kubvisa zvisaririra zvemoto zvakaita sekuyerera izvo zvinokuvadza muviri wemunhu pane yakaungana pcb board. Iyo michina inoshandiswa ndeye yekuchenesa muchina, iyo nzvimbo haigone kugadziriswa, inogona kuve online, zvakare haigone kuve online.

7. Detection: its function is to detect the welding quality and assembly quality of assembled PCB board. Iyo michina inoshandiswa kukudza girazi, maikorosikopu, pa-mutsetse bvunzo chiridzwa (ICT), inobhururuka tsono yekuyedza chiridzwa, otomatiki Optical bvunzo (AOI), X-ray bvunzo system, inoshanda test bvunzo, nezvimwe. Position according to the inspection needs, can be configured in the production line at the appropriate place.

8.Kugadzirisa: basa rayo ndere kuona kukundikana kwebhodhi rePCB rework. Zvishandiso zvikuru zvinoshandiswa kupisa pfuti, iron yesimbi, kugadzirisa workstation, nezvimwe. Inogona kuiswa chero kupi mumutsara wekugadzira.