I-glue ebomvu iyinhlanganisela ye-polyene. Ngokungafani nokunamathisela kwe-solder, kuyelapheka lapho kufudunyezwa. Ukushisa kwephoyinti lakhona okubandayo kungu-150 ℃, ngalesi sikhathi, i-glue ebomvu iqala ukuqina ngqo kusuka kunamathisela. Ingcina ebomvu ingeyokusebenza kwe-SMT. Lo mbhalo uzokuqondisa ukuthi uqonde ukuthi yini i-glue ebomvu PCB ibhodi, iyini indima yeglue ebomvu ku-PCB, indima yeglue ebomvu ku-PCB SMT processing kanye ne-SMT red glue inqubo ejwayelekile.

Yini i-glue ebomvu ebhodini le-PCB?

Enkambeni ehlanganisiwe ye-SMT ne-DIP, ukuze kugwenywe ukufakwa kwe-single-side reflow kanye, igagasi lokufaka amandla kanye kabili ngaphezulu kwesimo somlilo, ezingxenyeni ze-PCB wave soldering surface chip, isikhungo sedivayisi ebomvu, singafakwa i-soldering kanye tin, gcina inqubo yokuphrinta yokunamathisela ye-solder.

Inqubo ye-SMT “yeglue ebomvu”? Empeleni, igama elifanele kufanele libe inqubo ye-SMT “yokuhambisa”. Iningi lokunamathisela libomvu, ngakho-ke livame ukubizwa ngokuthi “i-adhesive ebomvu”. Eqinisweni, kukhona okunamathelayo okuphuzi, okufana nalokho esivame ukubiza ngokuthi “i-solder mask” ebusweni bebhodi lesifunda “upende oluhlaza”.

Yini i-glue ebomvu ebhodini le-PCB? Uyini umsebenzi weglue obomvu ku-PCB?

Singathola ukuthi kunenqwaba yeglue ebomvu phakathi kwezingxenye ezincane zama-resistors nama-capacitors. Le ngcina ebomvu. Inqubo yeglue ebomvu yathuthukiswa ngoba kwakunezinto eziningi ze-elekthronikhi ezazingasuswa ngokushesha zisuswe kwiphakethe yoqobo ye-DIP ziye kwiphakethe le-SMD.

Ibhodi lesifunda linehhafu yezingxenye ze-DIP nengxenye yezingxenye ze-SMD. Uzibeka kanjani izingxenye ukuze zikwazi ukugoqwa ngokuzenzekelayo ebhodini? Umkhuba ojwayelekile ukuklama zonke izingxenye ze-DIP ne-SMD ohlangothini olufanayo lwebhodi. Izingxenye ze-SMD ziphrintiwe ngokunamathisela kwe-solder bese zibuyiselwa esithandweni. Zonke ezinye izingxenye ze-DIP zingashiselwa ngasikhathi sinye kusetshenziswa inqubo yesithando somlilo esishisayo ngoba zonke izikhonkwane ziveziwe kolunye uhlangothi lwebhodi. Ngakho-ke sidinga izinyathelo ezimbili zokushisela ekuqaleni ukuze konke kushiselwe.

Ukuze ugcine isikhala sokuhlelwa kwe-PCB, sinethemba lokufaka izinto eziningi kuyo. Ngakho-ke, amadivayisi we-SMT nawo kudingeka abekwe endaweni engezansi. Ukuze unamathisele izingxenye ebhodini lesifunda nokuthi ibhodi lesifunda lingene esithandweni se-Wave Soldering, ukuze usinamathisele kuphedi yoku-soldering futhi ungangeni esithandweni esishisayo se-Wave.

Ukuze sinciphise inqubo yezobuchwepheshe, sinethemba lokuqedela ukushisela ngasikhathi sinye. Ukufakwa ngaphakathi kokufaka izimbobo kungenziwa, kepha ama-plugins ethu amaningi awakwazi ukumelana namazinga okushisa aphezulu we-soldering evuselelayo. Ngakho-ke, ukufakwa kwe-hole hole kungenzeki. Ngakho-ke, kungenzeka kuphela ukubheka ukufaka insimbi okufaka imbobo ngemikhiqizo eningi yezinkampani ezithile ezinkulu, ngoba zingathenga ezinye izinto ezinamanani aphezulu ezizi-plug-in ezingamelana namazinga okushisa aphezulu.

Futhi izingxenye ezijwayelekile ze-SMD ngoba zidizayinelwe ukumelana namazinga okushisa we-soldering, ukufudumeza kabusha kwe-soldering kuphakeme kune-wave soldering temperature, ngakho-ke izingxenye ze-SMD zishiywe esithandweni se-wave soldering tin, noma isikhathi esifushane futhi ngeke sibe nezinkinga , kodwa ayikho indlela yokwenza ukuphrinta okunamathiselwe kwe-solder kube nesithando somlilo se-SMD wave, ngoba izinga lokushisa kwesitofu kufanele libe ngaphezu kokushisa kwephoyinti lokuncibilika, Lokhu kuzokwenza ukuthi ingxenye ye-SMD incibilike iwele esithandweni sikathayela.

Ngakho-ke, sidinga ukulungisa idivaysi ye-SMD kuqala, ngakho-ke sisebenzisa i-glue ebomvu.

Yini indima yeglue ebomvu ku-PCB?

1. I-glue ebomvu ngokuvamile idlala indima engaguquki futhi esizayo. Ukunamathisela ngensimbi kungukushisela kwangempela.

2. I-Wave soldering ukuvimbela izingxenye ukuthi zingawi (inqubo yokufaka amagagasi ngamagagasi). Lapho kusetshenziswa i-wave soldering, le nto iqondiswa ebhodini eliphrintiwe ukuvimbela ukuthi ingxenye ingawi njengoba ibhodi lidlula emseleni we-solder.

3. Ukugeleza kwe-Reflow ukuvimbela olunye uhlangothi lwezinto ukuwa (inqubo yokuwelda yokuvuselela kabusha emaceleni amabili). Enkambeni yokufaka insimbi yokufaka kabusha emaceleni emabili, ukuvikela amadivayisi amakhulu ohlangothini lwe-welding ukuthi angawi ngenxa yokuncibilika kokushisa kwe-solder, kuyadingeka ukuthi kube nokunamathela kwe-SMT.

4. Vimbela izingxenye ekusukeni nasekumeni (gcwalisa inqubo yokuwelda, inqubo yangaphambi kokumboza). Isetshenziselwa inqubo yokufaka kabusha i-welding nenqubo yokufaka precoating ukuvimbela ukufuduka kanye nepuleti eliqondile ngesikhathi sokugibela.

5, maka (ukuguqa ngegagasi, ukugcwalisa kabusha i-welding, precoating). Ngaphezu kwalokho, ibhodi ephrintiwe ne-batch change change, ne-patch adhesive yokumaka.

Yini indima yeglue elibomvu ku-PCB patch processing?

Isixazululo se-patch esisebenzisayo futhi sicubungula i-glue ebomvu, imvamisa ibomvu (ephuzi noma emhlophe) unamathisela i-hardener ngokulinganayo, i-pigment, i-solvent kanye nezinye izinto zokunamathisela, ezisetshenziselwa ukuhlanganisa izingxenye zokucubungula ezihleliwe ebhodini eliphrintiwe, ngokuvamile likhipha noma indlela yensimbi yokuphrinta isikrini ukusabalalisa . Namathisela izingxenye bese uzifaka kuhhavini noma uvuselele isithando somlilo ukushisa nokuqina.

I-patch processing patch adhesive ukushisa ngemuva kokuphulukiswa, ukushisa kwe-patch processing solidification ngokuvamile kungama-degree angama-150, ukuvuselela kabusha ngeke kuncibilike, okungukuthi, inqubo yokuqinisa i-patch yokuqina iyashintshwa. Umphumela wokusebenza kwesiqeshana uzohluka ngenxa yezimo zokupholisa ezishisayo, ukuxhumana, okokusebenza okusetshenzisiwe, nemvelo yokusebenza. Isinamathelisi se-patch kufanele sikhethwe ngokuya ngenqubo ephrintiwe yebhodi yesifunda () yenqubo.

I-Patch processing red glue iyinhlanganisela yamakhemikhali, eyakhiwe kakhulu ngezinto ze-polymer. Ukugcwaliswa kwesichibi, i-ejenti yokwelapha, ezinye izithasiselo, njll. I-Patch processing adhesive ebomvu ine-viscosity fluidity, izici zokushisa, izici zokumanzisa njalonjalo. Ngokuya ngezimpawu zeglue ebomvu ekusetshenzisweni kwe-SMT, inhloso yokusebenzisa i-glue ebomvu ekukhiqizeni ukwenza izingxenye zinamathele ngokuqinile ebusweni be-PCB nokuyivimba ukuthi ingawi.

I-Patch processing glue ebomvu yinto yokusetshenziswa emsulwa, hhayi umkhiqizo odingekayo wenqubo, manje ngokuthuthuka okuqhubekayo kokuklanywa kokuklanywa kobuso nobuchwepheshe, ukucutshungulwa kwama-patch ngokusebenzisa i-hole reflow welding, i-double-emaceleni welding welding isetshenzisiwe, ukusetshenziswa kwe-patch ukucubungula inqubo yokufaka okunamathelayo kuncane futhi kuncane ukuthambekela.

Inqubo ejwayelekile ye-SMT ebomvu

Inqubo ejwayelekile yokukhiqizwa kweglue ebomvu i-SMT yile: ukuphrinta kwesikrini → (ukuhambisa) → ukukhweza → (ukuphilisa) → ukufaka kabusha i-welding → ukuhlanza → ukutholwa → ukulungiswa → ukuqedwa.

1. Ukuphrinta kwesikrini: umsebenzi wawo ukuphrinta ukunamathisela kwe-solder (ukunamathisela i-solder) noma i-glue ebomvu (i-patch glue) kuphedi le-solder lebhodi lesifunda le-PCB ukulungiselela ukufakwa kwezingxenye. Imishini esetshenzisiwe umshini wokuphrinta wesikrini (umshini wokuphrinta wesikrini), osendaweni ephambili kulayini wokukhiqiza we-SMT.

2. Ukuhambisa: kuyiphuzu elibomvu lokunamathela endaweni ehleliwe ye-PCB, indima yalo enkulu ukulungisa izingxenye ebhodini le-PCB. Umshini wokuhambisa utholakala ekugcineni komugqa wokukhiqiza we-SMT noma ngemuva kwemishini yokuhlola.

3. Ukukhweza: umsebenzi wayo ukufaka ngokunembile izingxenye zomhlangano womhlaba endaweni ehleliwe ye-PCB. Imishini esetshenzisiwe ngumshini we-SMT, otholakala ngemuva komshini wokuphrinta wesikrini kulayini wokukhiqiza we-SMT.

4.Ukuphulukisa: indima yayo ukuncibilikisa i-glue ebomvu (i-patch adhesive), ukuze izingxenye zomhlangano womhlaba kanye nebhodi le-PCB zihlanganiswe ngokuqinile. Imishini esetshenzisiwe isithando somlilo esisemuva komshini we-SMT kulayini we-SMT.

5. Ukugeleza kwe-Reflow: umsebenzi wayo ukuncibilikisa ukunamathisela kwe-solder (ukunamathisela kwe-solder), ukuze izingxenye zomhlangano womhlaba kanye nebhodi le-PCB zihlanganiswe ngokuqinile. Isithando somlilo esivuselelwe sitholakala ngemuva komshini we-SMT kulayini we-SMT.

6. Ukuhlanza: umsebenzi wayo ukususa izinsalela zokushisela ezifana nokugeleza okuyingozi emzimbeni womuntu ebhodini le-PCB elihlanganisiwe. Imishini esetshenzisiwe umshini wokuhlanza, isikhundla asikwazi ukulungiswa, singaba ku-inthanethi, futhi asikwazi ukuba ku-inthanethi.

7. Ukuthola: umsebenzi wayo ukuthola ikhwalithi ye-welding nekhwalithi yomhlangano webhodi le-PCB elihlanganisiwe. Isisetshenziswa esisetshenziswa ukukhulisa ingilazi, imicroscope, insimbi yokuhlola on-line (ICT), insimbi yokuhlola inaliti endizayo, ukuhlolwa okuzenzakalelayo kwe-optical (AOI), uhlelo lokuhlola lwe-X-ray, ithuluzi lokuhlola elisebenzayo, njll. Isikhundla ngokuya ngezidingo zokuhlola, singalungiswa kulayini wokukhiqiza endaweni efanele.

8. Ukulungisa: indima yawo ukuthola ukwehluleka kwebhodi le-PCB ukuze kusebenze kabusha. Amathuluzi amakhulu asetshenziswa ukushisa isibhamu, i-soldering iron, indawo yokusebenza yokulungisa, njll. Ingafakwa noma yikuphi kulayini wokukhiqiza.