Iglue ebomvu yinkqubo ye-polyene. Ngokungafaniyo ne-solder paste, iyaphiliswa xa ishushu. Amaqondo obushushu ashushu yi-150 ℃, ngeli xesha, iglu ebomvu iqala ukuba yomelele ngokuthe ngqo kunamathisele. Iglu ebomvu yeyento ye-SMT. Eli nqaku liza kukukhokela ukuze uqonde ukuba yintoni iglu ebomvu Ibhodi PCB, iyintoni indima yeglue ebomvu kwi-PCB, indima yeglue ebomvu kwi-PCB ye-PCB kunye ne-SMT inkqubo ebomvu yeglue.

Yintoni iglu ebomvu kwibhodi ye-PCB?

Kwinkqubo exubeneyo ye-SMT kunye ne-DIP, ukuthintela icala elinye lokufakelwa kwakhona kwe-welding, ukutshiza nge-soldering kanye kabini kwimeko yesithando somlilo, kwi-PCB ye-wave soldering surface chip components, embindini wesixhobo seglu ebomvu, inokuthengiswa kube kanye tin, gcina inkqubo yokushicilela ye-solder.

Inkqubo “yeglu ebomvu” ye-SMT? Ngokwenyani, igama elichanekileyo kufuneka libe yinkqubo ye-SMT “yokuhambisa”. Uninzi lwe-adhesive lubomvu, ke oko kubizwa ngokuba yi “red adhesive”. Ngapha koko, kukho nesincamathelisi esimthubi, esifana njengoko sihlala sisithi “sisiter sokuvala” kumphezulu webhodi yesekethe “ipeyinti eluhlaza”.

Yintoni iglu ebomvu kwibhodi ye-PCB? Uyintoni umsebenzi weglu ebomvu kwiPCB?

Singafumanisa ukuba kukho ubunzima beglue ebomvu embindini wamacandelo amancinci ezinto zokuxhathisa kunye nee-capacitors. Le yiglue ebomvu. Inkqubo yeglue ebomvu yaphuhliswa kuba zininzi izinto ze-elektroniki ezingenakudluliselwa kwangoko ukusuka kwiphakheji yentsusa ye-DIP iye kwiphakheji ye-SMD.

Ibhodi yesekethe inesiqingatha samalungu e-DIP kunye nesiqingatha samalungu e-SMD. Uzibeka njani iindawo ukuze zibe nokudibanisa ngokuzenzekelayo ebhodini? Isenzo esiqhelekileyo kukuyila zonke iinxalenye ze-DIP kunye neze-SMD kwicala elinye lebhodi. Amacandelo e-SMD aprintiwe ngophawu lwe-solder emva koko atyhidiweyo abuyela eziko. Zonke ezinye iinxalenye ze-DIP zinokudityaniswa kanyekanye kusetyenziswa inkqubo yesithando somlilo ngenxa yokuba zonke izikhonkwane zivelisiwe kwelinye icala lebhodi. Ke sidinga amanyathelo amabini okuwelda ekuqaleni ukuze yonke into idityaniswe.

Ukuze ugcine indawo yoyilo lwePCB, sinethemba lokubeka ngaphezulu izinto kuyo. Ke ngoko, izixhobo ze-SMT kufuneka zibekwe kumgangatho osezantsi. Ukuze uqhoboshele iinxalenye kwibhodi yesekethe kwaye ufumane ibhodi yesekethe kwisithando somlilo se-Wave, ukuba usincamathisele kwiphedi ye-soldering kwaye ungangeni kwiziko elitshisayo le-Wave.

Ukwenzela ukunciphisa inkqubo yetekhnoloji, sinethemba lokugqibezela ukuwelda ngaxeshanye. Ukufakwa ngaphakathi kwimingxunya yokufaka i-soldering kunokwenzeka, kodwa uninzi lweeplagi zethu alunakumelana namaqondo aphezulu obushushu be-soldering. Ke ngoko, ukugqobhoza umngxunya wokuvula awunakwenzeka. Ke ngoko, kunokwenzeka kuphela ukuba kuthathelwe ingqalelo ukugoba ukugoba ukuhambisa umbane kwiimveliso ezininzi zeenkampani ezinkulu, kuba banokuthenga izinto ezinexabiso eliphezulu ezinokumelana namaqondo obushushu aphezulu.

Kwaye iindawo eziqhelekileyo ze-SMD kuba ziyilelwe ukumelana nobushushu be-soldering, ukugcwalisa ubushushu be-soldering kuphezulu kuneqondo lobushushu be-soldering, ke izinto ze-SMD zishiyeke kumngxunya we-tin soldering, nokuba lixesha elifutshane , kodwa akukho ndlela yokwenza ushicilelo lwe-solder unamafutha e-SMD ashushu, kuba ubushushu besitovu kufuneka bube ngaphezulu kobushushu bencindi yokuncamathela, Oku kuyakwenza ukuba icandelo le-SMD linyibilike kwaye liwele eziko lesithando.

Ke ngoko, kufuneka silungise isixhobo se-SMD kuqala, ke sisebenzisa iglu ebomvu.

Yintoni indima yeglue ebomvu kwi-PCB?

1. Iglu ebomvu ngokubanzi idlala indima esisigxina kunye neyokuncedisa. I-Soldering yeyona welding yokwenyani.

2. I-wave soldering ukukhusela izinto ukuba zingawi (inkqubo ye-wave soldering). Xa kusetyenziswa i-wave soldering, eli candelo ligxunyekwe kwibhodi eprintiweyo ukunqanda icandelo ukuba lingawi njengoko ibhodi idlula kumjelo we-solder.

3. Ukuhamba kwakhona kwe-welding ukunqanda elinye icala lezinto ukuba liwe (inkqubo yokuwelda yamacala amabini). Kwinkqubo yokuwelda kwakhona yamacala amabini, ukuthintela izixhobo ezikhulu kwicala le welding ukuba zingawi ngenxa yokunyibilika kobushushu be-solder, kufuneka ubambelele kwi-SMT.

4. Thintela izinto ekubuyiseni nasekumeni (inkqubo yokuwelda kwakhona, inkqubo yangaphambi kokutyabeka). Isetyenziswe kwinkqubo yokufakelwa kwakhona kwe-welding kunye nenkqubo yokucoceka ukuthintela ukufuduswa kunye neplate ethe nkqo ngexesha lokunyuka.

I-5, uphawu (i-wave soldering, i-reflow welding, i-precoating). Ukongeza, ibhodi eprintiweyo kunye neenguqu zebhetshi yotshintsho, kunye nokuncamathelisa iqhosha lokumakisha.

Yintoni indima yeglue ebomvu ekusebenzeni kwe-PCB patch?

I-Patch processing agent nayo i-patch processing glue ebomvu, ngokuqhelekileyo ibomvu (emhlophe okanye emhlophe) unamathisele i-hardener ngokulinganayo, i-pigment, i-solvent kunye nezinye izinto ezinamathelayo, ikakhulukazi ezisetyenziselwa ukukhangela izixhobo ezizinzileyo kwibhodi eprintiweyo, ngokubanzi ukuhambisa okanye indlela yoshicilelo yesikrini yokuhambisa . Namathisela izinto uze uzibeke ehovini okanye uvuselele isithando somlilo ukufudumeza nokuqina.

Inkqubo yokubamba iqhosha lokunamathela bubushushu emva kokuphilisa, ubushushu bokuqina kokuqina kweqondo ngokubanzi ngama-150 degrees, ukuphinda uphinde uphinde uphinde uphinde unyibilike akuyi kunyibilika, oko kukuthi, inkqubo yokuqinisa ubushushu ayinakulungiseka. Isiphumo sokusebenza kwepatch siza kwahluka ngenxa yeemeko zokuphilisa ubushushu, unxibelelwano, izixhobo ezisetyenzisiweyo kunye nemeko yokusebenza. Ukuncamathela kwesiqwengana kufuneka kukhethwe ngokwenkqubo yendibano yebhodi yesekethe eprintiweyo ().

Ukulungiswa kwe-patch ebomvu yeglue yinkomfa yemichiza, ikakhulu enezinto zepolymer. Inkqubo yokufaka iipatch, iarhente yokuphilisa, ezinye izongezo, njl. Ukucwangciswa kokubambelela kokubambelela okubomvu kune-viscosity fluidity, iimpawu zobushushu, iimpawu zokumanzi njalo njalo. Ngokutsho kweempawu zeglue ebomvu ekusetyenzisweni kwe-SMT, injongo yokusebenzisa iglu ebomvu kwimveliso kukwenza ukuba iinxalenye zincamathele ziqinile kumphezulu wePCB nokuthintela ukuba iwe.

Ukucwangciswa kwepatch kwiglu ebomvu sisixhobo esicocekileyo sokusetyenziswa, ayisiyomfuneko yemveliso, ngoku ngokuqhubeka kophuculo loyilo oluphezulu kunye netekhnoloji, ukuqhubekeka kwephiko ngokufaka umngxunya wokufaka umngxunya, ukuwelda okunamacala amabini kuye kwafezekiswa, ukusetyenziswa kwepatch ukuqhubekeka Inkqubo yokuncamathelisa indawo yokuncamathela kuncinci.

Inkqubo esemgangathweni yeglue ebomvu ye-SMT

Inkqubo esemgangathweni yemveliso yeglue ebomvu ye-SMT yile: ukushicilelwa kwescreen → (ukuhambisa) → ukunyusa → (ukuphilisa) → ukuwelda kwakhona → ukucoca → ukucoca → ukubhaqa → ukulungiswa → ukugqitywa.

1.Ukushicilelwa kwescreen: umsebenzi wayo kukuprinta ukunamathisela i-solder (i-solder paste) okanye i-glue ebomvu (i-patch glue) kwiphedi ye-solder yebhodi yesekethe ye-PCB ukulungiselela ukuwelda kwezinto. Izixhobo ezisetyenzisiweyo ngumatshini wokuprinta kwescreen (umatshini wokushicilela wescreen), emi kwindawo ephambili yomgca wemveliso ye-SMT.

2. Ukuhambisa: yindawo ebomvu yeglu kwindawo esisigxina yePCB, eyona ndima yayo ephambili kukulungisa izinto kwibhodi yePCB. Umatshini wokuhambisa ubekwe ngaphambili komgca wemveliso ye-SMT okanye ngasemva kwesixhobo sovavanyo.

3. Ukubeka: umsebenzi wayo ukufaka ngokuchanekileyo izinto zebandla lendawo kwindawo emiselweyo yePCB. Izixhobo ezisetyenzisiweyo ngumatshini we-SMT, ongasemva komatshini wokushicilela wescreen kumgca wemveliso ye-SMT.

4. Ukuphilisa: indima yayo kukunyibilikisa iglu ebomvu (isambatho sokuncamathelisa), ukuze izinto zebandla elingaphezulu kunye nebhodi yePCB ziqiniswe ngokuqinileyo. Izixhobo ezisetyenzisiweyo kukunyanga iziko, elibekwe emva komatshini we-SMT kumgca we-SMT.

5. Reflow welding: umsebenzi wayo ukunyibilika solder intlama (solder paste), ukuze izinto umphezulu ibandla kunye nebhodi PCB ziqiniswe ngokuqinileyo kunye. Isithando somlilo esizinzileyo sibekwe emva komatshini we-SMT kumgca we-SMT.

6. Ukucoca: umsebenzi wayo kukususa iintsalela ze-welding ezinjenge-flux eziyingozi emzimbeni womntu kwibhodi ye-PCB ehlanganisiweyo. Izixhobo ezisetyenzisiweyo ngumatshini wokucoca, indawo ayinakulungiswa, inokubakho kwi-Intanethi, nayo ayinakuba kwi-Intanethi.

7. Ukuchonga: umsebenzi wayo kukufumana umgangatho we-welding kunye nomgangatho webandla we-PCB. Izixhobo ezisetyenzisiweyo kukhulisa iglasi, imicroscope, isixhobo sovavanyo esikwi-on-line (ICT), isixhobo sovavanyo lwenaliti esibhabha, uvavanyo oluzenzekelayo lwe-optical (AOI), inkqubo yovavanyo lwe-X-ray, isixhobo sovavanyo esisebenzayo, njl. Indawo ngokweemfuno zokuhlola, inokuqwalaselwa kumgca wokuvelisa kwindawo efanelekileyo.

8.Ukulungisa: indima yayo kukufumanisa ukusilela kwebhodi yePCB ukuze iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde iphinde kwakhona. Ezona zixhobo ziphambili zisetyenzisiweyo yimipu yobushushu, isinyithi esenziwe ngentsimbi, ukulungiswa kwendawo yokusebenza, njl. Ingafakwa naphi na kumgca wemveliso.