Ka nui o ʻoʻoleʻa PCB maʻalahi ʻaʻole hiki ke hoʻowahāwahā ʻia i ka hana ʻana PCB. ʻO hoʻokahi kumu ke ʻano i ka miniaturization. Eia hou, ke piʻi nei ka noi no PCBS ʻoʻoleʻa ma muli o ka maʻalahi a me ka hana o ka 3D hui. Eia nō naʻe, ʻaʻole hiki i nā mea hana PCB āpau ke hālāwai me ke kaʻina hana PCB paʻakikī paʻakikī a paʻakikī hoʻi. Hana ʻia nā papa kaapuni semi-hoʻololi e ka hana e hōʻemi i ka mānoanoa o ka papa ʻoʻoleʻa i 0.25mm +/- 0.05mm. ʻO kēia, ʻae ʻia e hoʻohana i ka papa i nā noi e koi i ke kūlou ʻana i ka papa a kau i loko o ka hale. The plate can be used for one-time bending installation and multi-bending installation.

Eia kahi hiʻohiʻona o kekahi o nā ʻano e ʻokoʻa ai:

FR4 semi – ʻano maʻalahi PCB ʻano

L ʻO ke ʻano nui e ʻoi aku ka maikaʻi no kāu hoʻohana pono ʻana he palupalu ia a hiki ke hoʻololi i kahi ākea i loaʻa.

L Hoʻonui ʻia kona laha ākea e ka ʻoiaʻiʻo ʻaʻole hiki i kāna maʻalahi ke pale i kāna lawe ʻana i hōʻailona.

L Māmā hoʻi ia.

Ma ke ʻano laulā, ʻike ʻia ka PCBS semi-maʻalahi no kā lākou kumukūʻai maikaʻi loa no ka mea kūlike kā lākou hana hana me nā hana hana e noho nei.

L Mālama lākou i ka manawa hoʻolālā a me ka manawa hui.

L Pili pono lākou i nā koho ʻē aʻe, ʻaʻole ka mea liʻiliʻi no ka mea pale lākou i nā pilikia he nui, e like me nā tangles a me nā kuʻihao.

Nā hana hana PCB

The main manufacturing process of FR4 semi-flexible printed circuit board is as follows:

Uhi ka hana i nā ʻaoʻao aʻe:

L ʻoki mea

L ka pena kiʻi ʻoniʻoni maloʻo

L Nānā ʻike ʻākiō

L Browning

L laminated

Ninaninau L-ray

L ʻeli ʻana

L uila

L hoʻolilo kiʻi

L mānoanoa

L Pai paʻi

L Hōʻike a me ke kūkulu ʻana

L hoʻopau honua

L pā kāloli wili

L hoʻāʻo uila

L ka maikaʻi e kaohi ana

L ʻōpala

He aha nā pilikia a me nā hāʻina hiki i ka hana ʻana PCB?

ʻO ka pilikia nui i ka hana ʻana e hōʻoia i ka pololei a me ka hoʻomanawanui ʻana i ka milling tolerance. He mea nui nō hoʻi ia e hōʻoia i ka loaʻa ʻole o nā māwae resin a i ʻole ka spalling aila i hiki ke kumu i nā pilikia maikaʻi. Hoʻopili kēia i ka nānā ʻana i ka mea aʻe i ka wā o ka wili hoʻomalu hohonu:

L mānoanoa

L Resin maʻiʻo

L ʻO ke ahonui ʻo Milling

Hōʻoia ka wili ʻana i ka hohonu o ka ʻili A

Hana ʻia ka wili palaoa e ka hana palapala ʻana e kūlike i ka mānoanoa o 0.25 mm, 0.275 mm a me 0.3 mm. Ma hope o ka hoʻokuʻu ʻia ʻana o ka papa, e hoʻāʻo ʻia ia e ʻike inā hiki iā ia ke kū i ke kūlou ʻana he 90. ʻO ka maʻamau, inā ʻo 0.283mm ka mānoanoa i koe, manaʻo ʻia ua pōʻino ke aniani aniani. Therefore, the thickness of the plate, the thickness of the glass fiber and the dielectric condition must be taken into account when conducting deep milling.

Hōʻoia ka wili ʻana i ka hohonu o ka hohonu B

Ma muli o ka mea i luna, pono e hōʻoia i ka mānoanoa o ke keleawe o 0.188mm a i ka 0.213mm ma waena o ka pale pale solder a me L2. Pono e mālama pono ʻia no kēlā me kēia kaua ʻana e kū mai ana, e hoʻopili ana i ka laulā mānoanoa o ka laulā.

Hōʻike wili ka hohonu o ka hohonu C

He mea nui ka wili ʻana i ka hohonu e hōʻoia i ka hoʻonohonoho ʻia o nā ana i 6.3 “x10.5” ma hope o ka hoʻokuʻu ʻia ʻana o ka prototype panel. After this, survey point measurements are taken to ensure that 20 mm vertical and horizontal intervals are maintained.

Special fabrication methods ensure that the depth control thickness tolerance is within ±20μm.