FR4 semi-nezimo PCB uhlobo PCB inqubo yokukhiqiza

Ukubaluleka koku eqinile i-PCB eguquguqukayo cannot be underestimated in PCB manufacturing. Isizathu esisodwa ukuthambekela ekwenzeni i-miniaturization. Ngaphezu kwalokho, ukufunwa kwama-PCBS aqinile kuyanda ngenxa yokuguquguquka nokusebenza komhlangano we-3D. Kodwa-ke, akubona bonke abakhiqizi be-PCB abakwazi ukuhlangabezana nenqubo yokukhiqiza ye-PCB eyinkimbinkimbi futhi eqinile. Amabhodi wesekethe aphrintiwe kancane akhiqizwa ngenqubo enciphisa ukushuba kwebhodi eliqinile libe ngu-0.25mm +/- 0.05mm. Lokhu, nakho, kuvumela ibhodi ukuthi lisetshenziswe ezinhlelweni zokusebenza ezidinga ukugoba ibhodi nokuyifaka ngaphakathi kwendlu. The plate can be used for one-time bending installation and multi-bending installation.

ipcb

Nakhu ukubuka konke kwezinye izimfanelo ezikwenza kuhluke:

FR4 semi – nezimo PCB izici

L Imfanelo ebaluleke kakhulu esebenza kangcono ekusebenziseni kwakho ukuthi iyaguquguquka futhi ingakwazi ukuzivumelanisa nendawo etholakalayo.

L Ukuguquguquka kwayo kukwanda ngeqiniso lokuthi ukuguquguquka kwayo akukuvimbeli ukudluliswa kwayo kwesiginali.

L Futhi ayisindi.

Ngokuvamile, ama-PCBS angama-semi-flexible ayaziwa ngezindleko zawo ezinhle kakhulu ngoba izinqubo zabo zokukhiqiza ziyahambelana namandla akhona okukhiqiza.

L Zonga isikhathi sokuqamba nesikhathi somhlangano.

L Ziyizindlela ezinokwethenjelwa ngokwedlulele, hhayi okungenani ngoba zigwema izinkinga eziningi, kufaka phakathi ama-tangles kanye ne-welding.

Inqubo yokwenza i-PCB

The main manufacturing process of FR4 semi-flexible printed circuit board is as follows:

Inqubo ngokuvamile ihlanganisa lezi zinto ezilandelayo:

L Ukuzisika kwezinto

L Ukumboza ifilimu okomile

L Ukuhlolwa okuzenzakalelayo kokukhanya

L Browning

L laminated

L Ukuhlolwa kwe-X-ray

L ukubhola

L ukucubungula

L Igrafu ukuguqulwa

L ukugcotshwa

L Ukuphrinta kwesikrini

L Ukuvezwa nentuthuko

L Surface sekugcineni

L Ukujula kokulawulwa kokujula

L Ukuhlolwa kukagesi

L Ukulawulwa kwekhwalithi

L ukupakisha

Yiziphi izinkinga futhi izixazululo kungenzeka PCB yokukhiqiza?

Inkinga enkulu yokukhiqiza ukuqinisekisa ukunemba nokujula kokulawula ukugaya ukubekezelelana. Kubalulekile futhi ukuqinisekisa ukuthi akukho ukuqhekeka kwe-resin noma u-oyela ovuthayo ongadala izinkinga zekhwalithi. Lokhu kufaka ukubheka okulandelayo ngesikhathi sokugaya ukujula kokujula:

L ubukhulu

L Okuqukethwe kwe-Resin

L Ukugaya ukubekezela

Ukujula kokuhlolwa kokugaya ukuhlolwa A

Ukugaya ubukhulu kwenziwa ngendlela yemephu yokuhambisana nobukhulu be-0.25 mm, 0.275 mm no-0.3 mm. Ngemuva kokukhishwa kwebhodi, kuzohlolwa ukuthi likwazi yini ukumelana nokugoba ngeziqu ezingama-90. Ngokuvamile, uma ukushuba okusele kungu-0.283mm, i-fiber fiber ibhekwa njengonakele. Therefore, the thickness of the plate, the thickness of the glass fiber and the dielectric condition must be taken into account when conducting deep milling.

Ukujula kokuhlolwa kokugaya ukuhlolwa B

Ngokususelwe kokungenhla, kuyadingeka ukuqinisekisa ukushuba kwethusi okungu-0.188mm kuye ku-0.213mm phakathi kocingo lwesithiyo se-solder ne-L2. Ukunakekelwa okufanele futhi kudinga ukuthathwa kunoma yikuphi ukugoqana okungenzeka kwenzeke, okuthinta ukufana kobubanzi bonke.

Ukujula kokuhlolwa kokugaya ukuhlolwa C

Ukugaya ukulawulwa kokujula kwakubalulekile ukuqinisekisa ukuthi ubukhulu busethelwe ku-6.3 “x10.5” ngemuva kokukhishwa kohlobo lwephaneli. After this, survey point measurements are taken to ensure that 20 mm vertical and horizontal intervals are maintained.

Special fabrication methods ensure that the depth control thickness tolerance is within ±20μm.