Pataki ti kosemi rọ PCB ko le wa ni underestimated ni PCB ẹrọ. Idi kan jẹ aṣa si miniaturization. Ni afikun, ibeere fun awọn PCBS kosemi ti wa lori ilosoke nitori irọrun ati iṣẹ ṣiṣe ti apejọ 3D. Sibẹsibẹ, kii ṣe gbogbo awọn olupese PCB ni anfani lati pade eka ti o rọ ati ilana iṣelọpọ PCB kosemi. Awọn igbimọ Circuit ti o rọ ologbele jẹ iṣelọpọ nipasẹ ilana kan ti o dinku sisanra ti igbimọ lile si 0.25mm +/- 0.05mm. Eyi, ni ọna, ngbanilaaye igbimọ lati lo ninu awọn ohun elo ti o nilo atunse igbimọ ati gbigbe si inu ile naa. The plate can be used for one-time bending installation and multi-bending installation.

Eyi ni awotẹlẹ diẹ ninu awọn abuda ti o jẹ ki o jẹ alailẹgbẹ:

FR4 ologbele – rọ abuda PCB

L Ẹya pataki julọ ti o ṣiṣẹ dara julọ fun lilo tirẹ ni pe o rọ ati pe o le ṣe deede si aaye to wa.

L Irọpọ rẹ pọ si nipasẹ otitọ pe irọrun rẹ ko ṣe idiwọ gbigbe ifihan rẹ.

L O tun jẹ iwuwo fẹẹrẹ.

Ni gbogbogbo, PCBS ologbele-rọpo ni a tun mọ fun idiyele ti o dara julọ nitori awọn ilana iṣelọpọ wọn ni ibamu pẹlu awọn agbara iṣelọpọ ti o wa.

L Wọn fipamọ akoko apẹrẹ mejeeji ati akoko apejọ.

L Wọn jẹ awọn omiiran igbẹkẹle ti o gbẹkẹle, kii kere ju nitori wọn yago fun ọpọlọpọ awọn iṣoro, pẹlu awọn tangles ati alurinmorin.

Ilana ṣiṣe PCB

The main manufacturing process of FR4 semi-flexible printed circuit board is as follows:

Ilana gbogbogbo ni wiwa awọn abala wọnyi:

L Ige ohun elo

L Gbẹ fiimu ti a bo

L Iyẹwo adaṣe adaṣe adaṣe

L Browning

L laminated

L X-ray ayewo

L liluho

L electroplating

L Awonya iyipada

L etching

L Titẹ iboju

L Ifihan ati idagbasoke

L Ipari dada

L Ijinle Iṣakoso milling

L Idanwo itanna

L Didara iṣakoso

L apoti

Kini awọn iṣoro ati awọn solusan ti o ṣeeṣe ni iṣelọpọ PCB?

Iṣoro akọkọ ni iṣelọpọ ni lati rii daju iṣedede ati awọn ifarada iṣakoso iṣakoso ijinle. O tun ṣe pataki lati rii daju pe ko si awọn dojuijako resini tabi fifọ epo ti o le fa awọn iṣoro didara eyikeyi. Eyi pẹlu ṣiṣe ayẹwo atẹle naa lakoko mimu iṣakoso ijinle:

L sisanra

L akoonu Resini

L ọlọdun ọlọ

Ijinle milling igbeyewo A

Ti ṣe wiwọn sisanra nipasẹ ọna maapu lati ni ibamu si sisanra ti 0.25 mm, 0.275 mm ati 0.3 mm. Lẹhin ti itusilẹ igbimọ naa, yoo ni idanwo lati rii boya o le farada titọ iwọn 90. Ni gbogbogbo, ti sisanra ti o ku jẹ 0.283mm, okun gilasi ni a ka pe o bajẹ. Therefore, the thickness of the plate, the thickness of the glass fiber and the dielectric condition must be taken into account when conducting deep milling.

Ijinle milling igbeyewo B

Da lori ohun ti o wa loke, o jẹ dandan lati rii daju sisanra idẹ kan ti 0.188mm si 0.213mm laarin fẹlẹfẹlẹ idena alaja ati L2. Itọju to dara tun nilo lati mu fun eyikeyi warping ti o le waye, ni ipa lori iṣọkan sisanra lapapọ.

Ijinle milling igbeyewo C

Mimu iṣakoso ijinle ṣe pataki lati rii daju pe a ti ṣeto awọn iwọn si 6.3 “x10.5” lẹhin ti a ti tu afọwọṣe nronu naa. After this, survey point measurements are taken to ensure that 20 mm vertical and horizontal intervals are maintained.

Special fabrication methods ensure that the depth control thickness tolerance is within ±20μm.