Wannan takarda a sarari tana nuna matsalolin da suka danganci zafi a cikin buga kewaye hukumar. Wannan ingantaccen labarin ne game da rage tasirin danshi akan kowane nau’in allon da’irar da aka buga. Daga haɗaɗɗen kayan, shimfidar PCB, samfuri, injiniyan PCB, taro ta hanyar marufi da matakan isar da oda, yakamata a kula da tasirin danshi a masana’antar PCB don gujewa lalacewa da sauran matsaloli tare da aikin PCB. Bugu da ƙari, ba mu haske game da mahimman matakan don sarrafa matakan zafi yayin lamination, sarrafawa da aka aiwatar yayin taron PCB da sarrafa sarrafawa, marufi da sufuri.

Rigid/m PRINTED tarurrukan hukumar kewaya, daure na USB, manyan akwatuna ko damarar Wayoyin PCB ana yin su daga nau’ikan nau’ikan kayan da suka dace daidai da kaddarorin da ake buƙata don ƙarfin injin da ƙarfin lantarki a cikin kayan lantarki da ake amfani da su a duk manyan masana’antu a duk duniya. Yana buƙatar madaidaicin mita, ƙarancin rashin ƙarfi, ƙaramin ƙarfi, dorewa, ƙarfin ƙarfi mai ƙarfi, ƙarancin nauyi, daidaituwa, sarrafa zafin jiki ko juriya mai zafi, kuma PCB na iya zama ɗaya, ninki biyu ko ɗimbin yawa, dangane da mawuyacin yanayin kewaye. Daga cikin duk manyan matsalolin da yakamata a bincika a farkon matakan kera PCB, zafi ko zafi shine babban abin da ke haifar da samar da ɗaki don gazawar lantarki da na inji a ayyukan PCB.

Menene tasirin danshi akan PCB

Ta yaya danshi zai iya haifar da babbar matsala akan allon allon da aka buga?

Ta wurin kasancewa a cikin prepregs gilashin epoxy, watsawa a cikin PCBS yayin ajiya, kuma lokacin sha, danshi na iya haifar da lahani iri -iri a cikin tarukan PCB. Lokacin aiwatar da rigar a cikin masana’antar PCB yana wanzu a cikin microcracks ko zai iya samar da gida a cikin keɓaɓɓiyar dubawa. Saboda matsanancin zafin jiki da matsin lamba a layi ɗaya da daidaitawar quadcopter a cikin taron PCB, ana haifar da shan ruwa.

Kamar yadda gazawar haɗin kai da haɗin kai a cikin allon da’irar da aka buga yana haifar da lalatawa ko fashewa, danshi na iya yin ƙaurawar ƙarfe, yana haifar da ƙarancin hanyar rashin ƙarfi don canje -canjen kwanciyar hankali. Tare da raguwar zazzabi mai canzawa na gilashi, ƙaruwa na dindindin da sauran lalacewar fasaha, zai haifar da raguwar saurin sauyawar da’irar da jinkirin lokacin yaduwa.

Babban tasirin danshi a cikin PCBS shine yana rage ingancin ƙarfe ƙarfe, lamination, fim ɗin juriya da hanyoyin sarrafa PCB. Saboda tasirin danshi, iyakar danniya na zafi ya wuce kima yayin da yanayin sauyin gilashi ke raguwa. Wani lokaci kuma yana iya haifar da gajerun hanyoyin da ke ba da damar ruwa ya shiga, wanda ke haifar da lalata ion. Sauran kaddarorin gama -gari na kaddarorin hygroscopic a cikin majalisun kwamiti da aka buga na PRINTED sun haɗa da jinkirin wuta ko lamination, ƙimar watsawa (DF) da madaidaicin zafin wuta (DK), matsi mai zafi akan rufin ramuka, da iskar ƙarfe na jan ƙarfe.

Hanyoyi don rage danshi a masana’antar PCB:

Ko masana’antar PCB tana amfani da dabaru masu sauƙi ko rikitarwa, akwai ayyuka da yawa a cikin injiniyan PCB waɗanda ke buƙatar aiwatar da rigar da cire danshi na saura. Abubuwan da aka yi amfani da su a masana’antar PCB suna buƙatar kariya yayin ajiya, sarrafawa da sarrafa damuwa yayin taron PCB. Mai zuwa shine taƙaitaccen jagora don aiwatar da sarrafawa a duk matakan aikin PCB:

1. laminated

Lamination shine matakin bushewar ruwa a masana’antar PCB saboda an haɗa jigon da prepreg billet tare don haɗa layuka. The main factors controlled in the lamination process are temperature, elapsed time and heating rate. Wasu lokuta lokacin da bushewa ta yi ƙasa, ana ɗaukar matakan rage gurɓataccen iska don rage yuwuwar ɓoyayyun ciki na jawo ɗimbin danshi. Sabili da haka, amfani da safofin hannu lokacin sarrafa prepregs yana ba da kyakkyawan kula da matakan danshi. Wannan yana rage gurɓataccen giciye. Katunan nuna alamun zafi ba masu lalatawa yakamata su sami sassauci don warware matakan zafi kamar yadda ake buƙata. Ya kamata a wanke laminates a takaice hawan keke kuma a adana su da kyau a cikin yanayi mai sarrafawa, wanda ke taimakawa hana aljihun danshi daga yin laminates.

2. Post lamination tsari da PCB taro

Bayan hakowa, hoton daukar hoto, da ayyukan ragi a masana’antar PCB, yawan shakar danshi da aka kama a cikin rigar ya fi girma. Maganin bugun allo da yin burodi na rufe fuska ana aiwatar da matakai don sauƙaƙe danshi. Wannan ya fi tasiri a rage matakan sha ruwa ta hanyar rage tazarar lokacin riƙewa tsakanin matakai har ma da sha’awar sarrafa yanayin ajiya. Ta hanyar tabbatar da cewa PCB ya bushe sosai a farkon matakan lamination, hukumar zata iya taimakawa rage ayyukan yin burodi bayan kammala lamination. Bugu da kari, ana amfani da kyakkyawan inganci don hana fasa fasa yayin hakowa da kuma cire danshi daga ragowar ta hanyar yin burodi kafin a yi aikin daidaita matakin iska mai zafi. Ya kamata a kiyaye lokacin yin burodi ta hanyar yin la’akari da ƙimar matakin ƙimar danshi, rikitarwa na masana’antar PCB, maganin farfajiyar PCB da isasshen kauri da ake buƙata don hukumar.

Saboda haka, yana da mahimmanci a san sabon halin da ake ciki na tasirin danshi a masana’antar PCB don gujewa gazawa, lalacewa da gajeren zango akan PCB, yayin da ake ƙara farashin sake yin aiki. Yanzu, masu bincike suna gab da gabatar da ƙarin ingantattun mafita waɗanda ke adana lokaci, kuzari da farashi ta amfani da fasahar PCB mai muhalli don sarrafa sinadarin ruwa a kowane mataki na kera PCB.