Eli phepha lichaza ngokucacileyo iingxaki ezinxulumene nokufuma ngaphakathi ibhodi yesekethe eprintiweyo. Eli linqaku elichanekileyo malunga nokunciphisa ifuthe lokufuma kulo naluphi na uhlobo lwebhodi yesekethe eprintiweyo. Ukususela fusion eziphathekayo, uyilo PCB, prototyping, ubunjineli PCB, ibandla ngokusebenzisa nokupakishwa kunye nezigaba unikezelo ukuze, ingqalelo kufuneka ihlawulwe ifuthe ukufuma ekuveliseni PCB ukuthintela umonakalo kunye nezinye iingxaki kunye nokusebenza PCB. Ukongeza, sinike ukuqonda kumanyathelo abalulekileyo okulawula amanqanaba okufuma ngexesha lokumisa, ulawulo lwenziwe ngexesha lendibano ye-PCB kunye nolawulo lokugcina, ukupakisha kunye nokuhamba.

Iindibano zebhodi yesekethe eqinileyo / eguqukayo, iinyanda zekhebula, iindibano zebhokisi okanye ii-Wire bundles ze-PCB zendibano zenziwe kwiintlobo ezahlukeneyo zezinto ezihambelana ngokupheleleyo neepropathi eziyimfuneko ekusebenzeni ngokuqinileyo koomatshini kunye nombane kwi-elektroniki esetyenziswa kuwo onke amashishini amakhulu kwihlabathi liphela. Ifuna amaza aphakamileyo, impedance ephantsi, ubungqongqo, ukuhlala ixesha elide, amandla aphezulu eqine, ubunzima obuphantsi, ukusebenza ngokuchaseneyo, ulawulo lobushushu okanye ukumelana nokufuma, kwaye i-PCB ingangatshatanga, iphindwe kabini okanye ibe mininzi, ngokuxhomekeke kubunzima besekethe. Kuzo zonke iingxaki ezinzulu ekufuneka ziqwalaselwe kumanqanaba okuqala okuvelisa i-PCB, ukufuma okanye ukufuma yeyona nto iphambili ekhokelela ekwakheni indawo yokusilela kwe-elektroniki kunye noomatshini kwimisebenzi yePCB.

Yintoni ifuthe lokufuma kwiPCB

Ukufuma kunokubangela njani ingxaki enkulu kwiibhodi zesekethe eziprintiweyo?

Ngokubakhona kwi-epoxy yeglasi preregs, isasazeka kwi-PCBS ngexesha lokugcina, kwaye xa ifunxwe, ukufuma kunokwenza iziphene ezahlukeneyo kwiindibano zePCB. Ixesha lenkqubo emanzi kwimveliso ye-PCB ikhona kwii-microcracks okanye zingenza ikhaya kwimbonakalo yentlaka. Ngenxa yobushushu obuphezulu kunye noxinzelelo lwemphunga ngokuhambelana nokucwangciswa kwe-quadcopter kwindibano ye-PCB, ukufunxwa kwamanzi kubangelwa.

Njengoko ukusilela kokubambelela kunye nokudibana kwiibhodi zesekethe eziprintiweyo kukhokelela ku-delamination okanye ukuqhekeka, ukufuma kunokwenza ukufuduka kwesinyithi kwenzeke, okukhokelela kwindlela ephantsi ye-impedance yenguqu ezinzileyo. Ngokwehla kobushushu beglasi yotshintsho, ukwanda kwe-dielectric engagungqiyo kunye nomnye umonakalo wobuchwephesha, kuya kukhokelela ekunciphiseni ukutshintsha kwesantya kunye nokulibaziseka kwexesha eliphezulu lokusasaza.

Iziphumo eziphambili zokufuma kwi-PCBS kukuba kunciphisa umgangatho wentsimbi, i-lamination, ifilimu yokumelana ne-solder kunye neenkqubo zokuvelisa ze-PCB. Ngenxa yempembelelo yokufuma, umda woxinzelelo lobushushu ugqithisile njengoko iqondo lobushushu beglasi liyancipha. Ngamanye amaxesha kunokubangela imijikelezo emifutshane enqamlezayo evumela amanzi ukuba angene, ekhokelela kukombana kwe-ion. Ezinye izinto eziqhelekileyo zepropathi ye-hygroscopic kwiindibano zebhodi yesekethe eshicilelweyo zibandakanya ukulibaziseka kwelangatye okanye ulweliso, ukwanda kokuchithwa kwezinto (DF) kunye ne-dielectric rhoqo (i-DK), uxinzelelo olushushu kwi-plated ngemingxunya, kunye ne-oxidation yobhedu.

Iindlela ukunciphisa ukufuma kwimveliso PCB:

Nokuba imveliso ye-PCB isebenzisa iindlela ezilula okanye ezintsonkothileyo, kukho imisebenzi emininzi kubunjineli be-PCB efuna iinkqubo ezimanzi kunye nokususwa kwentsalela eseleyo. Izinto zokwenza imveliso ezisetyenziswa kwimveliso ye-PCB kufuneka zikhuselwe ngexesha lokugcinwa, ukuphatha kunye nokuphathwa koxinzelelo ngexesha lendibano ye-PCB. Oku kulandelayo sisikhokelo esifutshane sokuphumeza ulawulo kuwo onke amabakala okusebenza kwe-PCB:

1. ndoyisiwe

I-Lamination linyathelo lokuphelelwa ngamanzi emzimbeni ekuveliseni i-PCB kuba isiseko kunye ne-prereg billet zidityaniswe ngokudibeneyo ukuze zibambe umaleko kwi-laminate. Izinto eziphambili ezilawulwa kwinkqubo ye-lamination bubushushu, ixesha elidlulileyo kunye nenqanaba lokufudumeza. Ngamanye amaxesha xa ukoma kusezantsi, kuthathwa amanyathelo okunciphisa isithuba ukuze kunciphise amathuba okushiya ngaphakathi okutsala ukufuma. Ke ngoko, ukusetyenziswa kweiglavu xa uphatha ii-preregs kubonelela ngolawulo olufanelekileyo lwamanqanaba okufuma. Oku kunciphisa ukungcoliseka komnqamlezo. Amakhadi esalatha angonakalisiyo amakhadi kufuneka abenakho ukutshintsha ukusombulula amanqanaba okufuma njengoko kufuneka. Iilaminates kufuneka zihlanjwe kwimijikelezo emifutshane kwaye zigcinwe ngokufanelekileyo kwindawo elawulwayo, enceda ekuthinteleni iipokotho zomswakama ekubeni zenze ii-laminates.

2. Post inkqubo wokulaminetha kunye ibandla PCB

Emva kokugrumba, umfanekiso wokufota, kunye nokusebenza kwemveliso kwimveliso yePCB, inqanaba lokufunxa ukufuma elifakwe kwinkqubo emanzi liphezulu. Ukuphrinta kwescreen kunye nokuphilisa imaski yokubhaka ngamanyathelo acwangcisiweyo ukukhupha ukufuma kwangaphakathi. Oku kusebenza ngakumbi ekunciphiseni amanqanaba okufakwa kwamanzi ngokunciphisa ixesha lokubamba phakathi kwamanyathelo kunye nokulawula ngentshiseko iimeko zokugcina. Ngokuqinisekisa ukuba i-PCB yomile ngokwaneleyo kumanqanaba okuqala okuqaqanjiswa, ibhodi inokunceda ukunciphisa imisebenzi yokubhaka emva kokumiliselwa. Ukongeza, ukugqitywa komgangatho ophezulu kusetyenziswa ukuthintela iintanda ngexesha lokomba nokususa ukufuma kwiintsalela ngokubhaka ngaphambi kwenkqubo yokulinganisa umoya oshushu. Ixesha lokubhaka kufuneka ligcinwe ngokuthathela ingqalelo inqanaba elimiselweyo lomxholo wokufuma, ukuntsokotha kwemveliso yePCB, unyango lomphezulu wePCB kunye nobukhulu obaneleyo bebhodi.

Ke ngoko, kubalulekile ukuba wazi imeko yakutshanje yesiphumo sokufuma kwimveliso ye-PCB ukunqanda ukusilela, ukonakala kunye nokujikeleza okufutshane kwi-PCB, ngelixa usonyusa iindleko zokuphinda usebenze kwakhona. Ngoku, abaphandi basemngciphekweni wokwazisa ngezisombululo ezihambele phambili ezonga ixesha, amandla kunye neendleko ngokusebenzisa itekhnoloji ye-PCB enobume bendalo ukulawula indawo yamanzi kuwo onke amanyathelo e-PCB.