This paper clearly points out the problems related to humidity in bọọdụ sekit biri ebi. This is an accurate article about reducing the effects of moisture on any type of printed circuit board. From material fusion, PCB layout, prototyping, PCB engineering, assembly through packaging and order delivery stages, attention should be paid to the influence of moisture in PCB manufacturing to avoid damage and other problems with PCB functionality. In addition, give us an insight into the important measures to control humidity levels during lamination, controls implemented during PCB assembly and control storage, packaging and transportation.

Mgbakọ bọọdụ sekit ebipụta siri ike/na -agbanwe agbanwe, ùkwù eriri, mgbakọ igbe ma ọ bụ mgbakọ PCB sitere na ụdị ihe dị iche iche nke dabara na ihe achọrọ maka ịrụ ọrụ siri ike na ọkụ eletrik na ngwa elektrọnik eji arụ ọrụ niile n’ụwa niile. Ọ chọrọ ugboro ugboro dị elu, obere impedance, compactness, anwụ ngwa ngwa, ike ọdụdọ dị elu, ịdị arọ dị ala, ntụgharị, njikwa okpomọkụ ma ọ bụ nguzogide iru mmiri, yana PCB nwere ike ịbụ otu, okpukpu abụọ ma ọ bụ ọtụtụ, dabere na mgbagwoju nke sekit. N’ime nnukwu nsogbu niile ekwesịrị ilebara anya na mbido mbụ nke nrụpụta PCB, iru mmiri ma ọ bụ iru mmiri bụ isi ihe na -eduga n’ịmepụta ohere maka ọdịda elektrọnik na n’ibu arụmọrụ PCB.

What is the effect of moisture on PCB

Kedu ka mmiri nwere ike isi kpatara nnukwu nsogbu na bọọdụ sekit e biri ebi?

Site na ịnọ na prepregs glass epoxy, na -agbasa na PCBS n’oge nchekwa, na mgbe a na -etinye ya mmiri, mmiri nwere ike mebie ntụpọ dị iche iche na mgbakọ PCB. Oge usoro mmiri dị na nrụpụta PCB dị na microcracks ma ọ bụ nwee ike mepụta ụlọ na interface resin. Due to the high temperature and steam pressure parallel to the quadcopter configuration in PCB assembly, water absorption is caused.

Dika nrapado na ọdịda na mbadamba sekit e biri ebi na -eduga na delamination ma ọ bụ mgbawa, mmiri mmiri nwere ike ime ka mwepụ igwe ga -ekwe omume, na -eduga n’ụzọ nkwụsị dị ala maka mgbanwe nkwụsi ike nke akụkụ. Site na mbelata nke ọnọdụ mgbanwe mgbanwe iko, mmụba nke ihe ọkụ eletrik na mbibi teknụzụ ndị ọzọ, ọ ga -eduga mbelata ngbanwe sekit na oge igbu oge dị elu.

Mmetụta dị ukwuu nke mmiri dị na PCBS bụ na ọ na -ebelata ịdị mma nke ịkpụzi ihe, mkpuchi, ihe nkiri na -eguzogide solder na usoro nrụpụta PCB. N’ihi mmetụta nke mmiri, njedebe nke nrụgide ọkụ na -adị oke ka ọnọdụ mgbanwe mgbanwe iko na -ebelata. Mgbe ụfọdụ, ọ nwekwara ike bute obere okirikiri okirikiri na -enye ohere ka mmiri banye, na -eduga n’ize corrosion. Other common properties of hygroscopic properties in PRINTED circuit board assemblies include flame retardation or lamination, increased dissipation factor (DF) and dielectric constant (DK), thermal stress on plated through holes, and oxidation of copper.

Ụzọ iji belata mmiri na PCB n’ichepụta:

Ma nrụpụta PCB na -eji usoro dị mfe ma ọ bụ dị mgbagwoju anya, enwere ọtụtụ arụmọrụ na injin PCB nke chọrọ usoro mmiri na iwepu mmiri mmiri. Raw materials used in PCB manufacturing need to be protected during storage, handling and stress handling during PCB assembly. Ihe ndị a bụ ntuziaka dị nkenke maka mmejuputa njikwa na ọkwa niile nke ọrụ PCB:

1. laminated

Lamination bụ nsị mmiri na -emepụta na PCB n’ihi na etinyere isi na prepreg billet ọnụ iji kekọta akwa na laminate. The main factors controlled in the lamination process are temperature, elapsed time and heating rate. Mgbe ụfọdụ mgbe nkụ dị ala, a na -eme ihe iji belata oghere iji belata ohere nke oghere dị n’ime ya na -adọta mmịkọrọ mmiri. Ya mere, iji mkpuchi aka mgbe a na -ejikwa prepregs na -enye ezigbo njikwa ọkwa mmiri. Nke a na-ebelata mmetọ obe. Kaadị ihe ngosi iru mmiri na-adịghị emebi emebi kwesịrị inwe mgbanwe iji dozie ọkwa iru mmiri dịka achọrọ. Ekwesịrị ịsacha laminates na obere oge wee chekwaa ya nke ọma na mpaghara a na -achịkwa, nke na -enyere aka igbochi akpa mmiri ka ọ ghara ịkpa na laminates.

2. Post lamination process and PCB assembly

Mgbe emechara egwu, onyonyo onyonyo, na ọrụ etching na nrụpụta PCB, ọnụego mmịkọrọ mmiri dị na usoro mmiri dị elu. A na -ahazi nbipụta ihuenyo na ịsa ihe mkpuchi ịgbado ọkụ iji belata iru mmiri. Nke a dị irè karịa ibelata ọkwa mmịpụta mmiri site n’ibelata oge njigide dị n’etiti nrịgo na ọbụna jiri ịnụ ọkụ n’obi jikwaa ọnọdụ nchekwa. Site n’ịhụ na PCB kpọrọ nkụ nke ọma na mbido mmalite nke lamination, bọọdụ ahụ nwere ike inye aka belata ọrụ ime achịcha. Tụkwasị na nke ahụ, a na -eji ngwụcha dị elu iji gbochie mgbawa n’oge a na -egwu ala na iwepu mmiri site na nsị site na ime achịcha tupu usoro ịkwa akwa ikuku ọkụ. Ekwesịrị idobe oge ịme achịcha site na iburu n’uche ogo nke ọdịnaya mmiri, ịdị mgbagwoju anya nke nrụpụta PCB, ọgwụgwọ elu PCB na oke ọkpụrụkpụ achọrọ maka bọọdụ.

Yabụ, ọ dị mkpa ịmara ọnọdụ ọhụrụ nke mmetụta mmiri dị na nrụpụta PCB iji zere ọdịda, mmebi na obere sekit na PCB, ebe ị na -abawanye ọnụ ahịa nrụzigharị. Now, researchers are on the verge of introducing even more advanced solutions that save time, energy and cost by using environmentally friendly PCB technology to control the water element in every step of PCB manufacturing.